xSPI MRAM provides an alternative to SPI NOR/NAND flash with up to 400MB/s R/W bandwidth

Everspin xSPI MRAM block diagram

Everspin has unveiled the EMxxLX xSPI MRAM (Magnetoresistive Random Access Memory) non-volatile memory solution for industrial IoT and embedded systems providing an alternative to SPI NOR/NAND flash with much faster R/W data rates of up to 400MB/s and densities between 8Mbit and 64Mbit. The higher speed is made possible by the new JEDEC expanded Serial Peripheral Interface (xSPI) standard interface and a clock frequency of up to 200 MHz, the maximum supported by the xSPI standard. All chips operate at 1.8V, and the family is offered in 24-ball BGA and 8-pin DFN packages. EMxxLX xSPI MRAM key features and specifications: Density – 8Mb, 16Mb, 32Mb, 64Mb 400MBps sustained throughput with OSPI at 200MHz, DTR, for reads and writes Expanded SPI (xSPI) bus interface supporting Octal, Quad, Dual, and Single SPI protocol Up to 200MHz single and double transfer rate (STR/DTR) for Octal SPI Up to 133MHz, SPI, DSPI, QSPI Data […]

Compact H.265 4K video encoder is made for embedded, medical, and military applications

h.265 video encoder board

US-based Z3 Technology has announced the Z3-Q603-RPS, a compact H.265 video encoder system capable of supporting 4K and HD resolutions for embedded, medical, and even military camera applications through NDAA (National Defense Authorisation Act) compliance. The board runs Linux on Qualcomm QCS603 IoT processor for AI and computer vision applications, which we previously found in Microsoft’s Vision AI Developer Kit, supports Ethernet and WiFI 5 connectivity, as well as features such as PTZ (Pan Tilt Zoom). Z3-Q603-RPS H.264 & H.265 video encoder system is comprised of an application board and a module with the following specifications: SoC – Qualcomm QCS603 (aka Qualcomm Vision Intelligence 300 Platform) with four Armv8 cores (2x 1.6GHz Kryo 300 Gold cores, 2x 1.7GHz Qualcomm Kryo 300 Silver cores ), Snapdragon neural processing engine, Adreno 615 GPU at 780 MHz System Memory – TBD Storage – NAND flash (capacity TBD) , MicroSD card socket Video Output […]

Vecow unveils Intel Atom x6211E based fanless Box PC & Pico-ITX motherboard

Compact Fanless Embedded Box PC

Vecow EPBC-1000 2.5-inch/Pico-ITX single board computer powered by an Intel Atom x6211E Elkhart Lake processor, and found in the company’s PBC-1000 ultra-compact fanless embedded box PC, is designed for edge applications such as intelligent control, energy management, M2M, In-Vehicle Infotainment (IVI), factory automation, and any AIoT or Industry 4.0 applications. Vecow EPBC-1000 Pico-ITX board and PBC-1000 embedded mini PC specifications: SoC – Intel Atom x6211E dual-core EIkhart Lake processor @ 1.20 GHz / 3.0 GHz (Turbo), with 16 EU Intel UHD graphics @ 350 MHz / 750 MHz, 1.5MB cache; 6W TDP System Memory – 1x DDR4 3200MHz SO-DIMM up to 32GB RAM Storage – 1x SATA III (6Gbps) port Video Output – 1x DisplayPort up to 4096 x 2160 @ 60Hz Audio 1x Mic-in, 1x Line-out Realtek ALC888S-VD, 7.1 Channel HD audio codec Networking 2x Gigabit Ethernet port via Realtek RTL8119I Ethernet Controllers Optional WiFi/Bluetooth or 4G LTE via […]

25-45W Intel Tiger Lake-H Xeon, Core, and Celeron embedded processors coming soon

Intel Tiger Lake-H module block diagram

While doing some research, I noticed an Intel Core i7-11850HE “Tiger Lake-H” processor on the OpenVino Toolkit website. Parts that end with “E” are usually processors designed for the embedded market. I had never heard about the Tiger Lake-H embedded family, so I looked for “i7-11850HE” processor, and it’s not in Intel Ark, or much anywhere else except on a page in Google Cache, about a COM-HPC module “with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application”. There we have a list of Xeon, Core, and Celeron 11th generation processors that I don’t think have ever been announced: Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 45/35W cTDP Intel Core vPRO i5-11500HE processor […]

Commell LP-179 Pico-ITX motherboard ships with Intel Tiger Lake UP3 embedded processor

LP-179 Tiger Lake Pico-ITX motherboard

Intel first introduced Core i3/i5/i7 Tiger Lake UP3 processors with Intel Xe graphics in early September 2020, soon followed with embedded versions of Tiger Lake UP3 a couple of weeks later, and then Celeron 6305E, still for embedded & IoT applications, with support for features such as 2.5GbE and quad-display support. We’ve already seen some Tiger Lake UP3 motherboards with AAEON UP Xtreme i11 (122 x 120 mm) and IEI tKINO-ULT6 mini-ITX SBC, but if you’d like a more compact Tiger Lake solution, Commell LP-179 Pico-ITX motherboard may be an option with a choice of Core i7-1185G7E or Celeron 6305E processor. Commell LP-179 specifications: SoC (one or the other) Intel Core i7-1185G7E quad-core/octa-thread Tiger Lake UP3 embedded processor @ 1.8 GHz / 4.4 GHz (Turbo) with 12MB cache, 96EU Intel Iris Xe graphics; 12 to 28W TDP Intel Celeron 6305E dual-core Tiger Lake UP3 embedded processor @ 1.8 GHz (No […]

Ubuntu Core 20 released for secure Linux IoT devices and embedded systems

Ubuntu Core 20 secure Linux IoT

Canonical has just released Ubuntu Core 20, a minimal, containerized version of Ubuntu 20.04 LTS for IoT devices and embedded systems. The company highlights several security improvements and features of the new version of the Linux-based operating system with secure boot, full disk encryption, secure device recovery, and secure containers. Ubuntu Core 20 is said to come with all benefits from Ubuntu 20.04 LTS such as regular, automated updates, the ability to manage custom app stores, and offers a longer 10-year support window. Ubuntu Core is available and certified on popular32-bit and 64-bit x86 and Arm single board computers such as Intel NUC or Raspberry Pi 4. Minimum requirements include a single-core processor @ 500 MHz, 256MB RAM, and 512MB storage. Alternatively, it’s also possible to run it in a virtual machine on your PC. Security is further enhanced with apps running in containers, and since only the necessary software […]

LG launches LG8111 AI SoC and development board for Edge AI processing

LG8111 AI Soc Development Board Eris

LG Electronics has designed LG8111 AI SoC for on-device AI inference and introduced the Eris Reference Board based on the processor. The chip supports hardware processing in artificial intelligence functions such as video, voice, and control intelligence. LG8111 AI development board is capable of implementing neural networks for deep learning specific algorithms due to its integrated “LG-Specific AI Processor.” Also, the low power and the low latency feature of the chip enhances its self-learning capacity. This enables the products with LG8111 AI chip to implement “On-Device AI.” Components and Features of the LG8111 AI SoC LG Neural engine, the AI accelerator has an extensive architecture for “On-Device” Inference/Leaning with its support on TensorFlow, TensorFlow Lite, and Caffe.  The CPU of the board comes with four Arm Cortex A53 cores clocked at 1.0 GHz, with an L1 cache size of 32KB and an L2 cache size of 1MB. The CPU also […]

Detecting & Solving Security Issues in IoT and Embedded Devices

need for device security

Last year’s Eclipse IoT Survey Report shows evidence that security is one of the major reasons for the development of IoT devices. As the number of IoT and embedded devices increases, we see a constant increase in the need for security issues in IoT and embedded devices. There have been increasing security expectations from device end customers and buyers to gain security insights and risks related to their connected devices. Security requires time and effort, so when a new product is launched in the market for business reasons, security compromises may have to be made. Also, organizations don’t have the capabilities and tools to get in-depth information about connecting device security. This is mainly due to the complex chain of third-party products. Methods for Detecting Security Issues Software Composition Analysis (SCA) allows organizations to identify third-party components that have been integrated into all applications. For each of these components, it […]

UP 7000 x86 SBC