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August 3, 2022October 13, 2022 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

NVIDIA Jetson AGX Orin 32GB production module is now available

NVIDIA Jetson AGX Orin 32GB production module is now in mass production and available after the 12-core Cortex-A78E system-on-module was first announced in November 2021, and the Jetson AGX Orin developer kit was launched last March for close to $2,000. Capable of up to 200 TOPS of AI inference performance, or up to 6 times faster than the Jetson AGX, the NVIDIA Jetson AGX Orin 32GB can be used for AI, IoT, embedded, and robotics deployments, and NVIDIA says nearly three dozen partners are offering commercially available products based on the new module. Here’s a reminder of NVIDIA Jetson AGX Orin 32GB specifications: CPU – 8-core Arm Cortex-A78AE v8.2 64-bit processor with 2MB L2 + 4MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 1792 NVIDIA CUDA cores and 56 Tensor Cores @ 1 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator – PVA v2.0 (Programmable Vision […]

June 23, 2022 by Jean-Luc Aufranc (CNXSoft) - No Comments

Kontron D3723-R – An AMD Ryzen Embedded R2000 motherboard in mini-ITX form factor

AMD Ryzen Embedded R2000 mini-ITX motherboard

Kontron D3723-R is an industrial mini-ITX motherboard equipped with the just-announced AMD Ryzen Embedded R2000 processor family that delivers higher performance than Ryzen R1000 Series while keeping the costs lower than AMD Ryzen Embedded V2000 solutions, and enabling Windows 11 support. Manufactured in Germany, the Kontron D3723-R will be offered with Ryzen R2312, R2314, R2514 and R2544 SKUs, and be particularly suitable for embedded graphics applications such as professional casino gaming systems, medical displays, thin clients, industrial PCs, infotainment, and digital signage systems. Kontron D3723-R specifications: SoC (one of the other) AMD Embedded R2312 dual-core/quad-thread processor @ 2.7 / 3.5 GHz (Turbo) with 3-core AMD Radeon Vega Graphics; 12-35W TDP AMD Embedded R2314 quad-core processor @ 2.1 / 3.5 GHz (Turbo) with 6-core AMD Radeon Vega Graphics; 12-35W TDP AMD Embedded R2514 quad-core/eight-thread processor @ 2.1 / 3.7 GHz (Turbo) with 8-core AMD Radeon Vega Graphics; 12-35W TDP AMD Embedded […]

May 11, 2022 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

MIPS unveils RISC-V eVocore P8700 and I8500 multiprocessor IP cores

MIPS is dead, right? Well, there’s now very little done on the architecture itself, MIPS (the company) has decided to switch to RISC-V architecture, and unveiled the eVocore product lineup currently comprised of the eVocore P8700 and I8500 multiprocessor IP cores. The 64-bit cores are scalable from single-core multi-thread to a single cluster with multiple cores, and up to a multi-cluster, and target high-performance, real-time compute applications such as networking, data centers, and automotive. The eVocore P8700 comes with a 16-stage deep pipeline with multi-issue Out-of-Order (OOO) execution and multi-threading. MIPS claims it has single-threaded performance greater than what is currently available in other RISC-V CPU IP offerings, but did not provide any numbers. It will likely be used in the cloud and high-end servers as it can scale up to 64 clusters, 512 cores and 1,024 harts/threads. P8700 highlights: Multi-issue superscalar Out of Order (OOO) with Multi-threading 16-stage pipeline […]

May 4, 2022May 4, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

xSPI MRAM provides an alternative to SPI NOR/NAND flash with up to 400MB/s R/W bandwidth

Everspin has unveiled the EMxxLX xSPI MRAM (Magnetoresistive Random Access Memory) non-volatile memory solution for industrial IoT and embedded systems providing an alternative to SPI NOR/NAND flash with much faster R/W data rates of up to 400MB/s and densities between 8Mbit and 64Mbit. The higher speed is made possible by the new JEDEC expanded Serial Peripheral Interface (xSPI) standard interface and a clock frequency of up to 200 MHz, the maximum supported by the xSPI standard. All chips operate at 1.8V, and the family is offered in 24-ball BGA and 8-pin DFN packages. EMxxLX xSPI MRAM key features and specifications: Density – 8Mb, 16Mb, 32Mb, 64Mb 400MBps sustained throughput with OSPI at 200MHz, DTR, for reads and writes Expanded SPI (xSPI) bus interface supporting Octal, Quad, Dual, and Single SPI protocol Up to 200MHz single and double transfer rate (STR/DTR) for Octal SPI Up to 133MHz, SPI, DSPI, QSPI Data […]

August 9, 2021November 18, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Compact H.265 4K video encoder is made for embedded, medical, and military applications

US-based Z3 Technology has announced the Z3-Q603-RPS, a compact H.265 video encoder system capable of supporting 4K and HD resolutions for embedded, medical, and even military camera applications through NDAA (National Defense Authorisation Act) compliance. The board runs Linux on Qualcomm QCS603 IoT processor for AI and computer vision applications, which we previously found in Microsoft’s Vision AI Developer Kit, supports Ethernet and WiFI 5 connectivity, as well as features such as PTZ (Pan Tilt Zoom). Z3-Q603-RPS H.264 & H.265 video encoder system is comprised of an application board and a module with the following specifications: SoC – Qualcomm QCS603 (aka Qualcomm Vision Intelligence 300 Platform) with four Armv8 cores (2x 1.6GHz Kryo 300 Gold cores, 2x 1.7GHz Qualcomm Kryo 300 Silver cores ), Snapdragon neural processing engine, Adreno 615 GPU at 780 MHz System Memory – TBD Storage – NAND flash (capacity TBD) , MicroSD card socket Video Output […]

August 4, 2021September 26, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

Vecow unveils Intel Atom x6211E based fanless Box PC & Pico-ITX motherboard

Vecow EPBC-1000 2.5-inch/Pico-ITX single board computer powered by an Intel Atom x6211E Elkhart Lake processor, and found in the company’s PBC-1000 ultra-compact fanless embedded box PC, is designed for edge applications such as intelligent control, energy management, M2M, In-Vehicle Infotainment (IVI), factory automation, and any AIoT or Industry 4.0 applications. Vecow EPBC-1000 Pico-ITX board and PBC-1000 embedded mini PC specifications: SoC – Intel Atom x6211E dual-core EIkhart Lake processor @ 1.20 GHz / 3.0 GHz (Turbo), with 16 EU Intel UHD graphics @ 350 MHz / 750 MHz, 1.5MB cache; 6W TDP System Memory – 1x DDR4 3200MHz SO-DIMM up to 32GB RAM Storage – 1x SATA III (6Gbps) port Video Output – 1x DisplayPort up to 4096 x 2160 @ 60Hz Audio 1x Mic-in, 1x Line-out Realtek ALC888S-VD, 7.1 Channel HD audio codec Networking 2x Gigabit Ethernet port via Realtek RTL8119I Ethernet Controllers Optional WiFi/Bluetooth or 4G LTE via […]

July 29, 2021July 29, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

25-45W Intel Tiger Lake-H Xeon, Core, and Celeron embedded processors coming soon

While doing some research, I noticed an Intel Core i7-11850HE “Tiger Lake-H” processor on the OpenVino Toolkit website. Parts that end with “E” are usually processors designed for the embedded market. I had never heard about the Tiger Lake-H embedded family, so I looked for “i7-11850HE” processor, and it’s not in Intel Ark, or much anywhere else except on a page in Google Cache, about a COM-HPC module “with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application”. There we have a list of Xeon, Core, and Celeron 11th generation processors that I don’t think have ever been announced: Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 45/35W cTDP Intel Core vPRO i5-11500HE processor […]

February 12, 2021 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Commell LP-179 Pico-ITX motherboard ships with Intel Tiger Lake UP3 embedded processor

Intel first introduced Core i3/i5/i7 Tiger Lake UP3 processors with Intel Xe graphics in early September 2020, soon followed with embedded versions of Tiger Lake UP3 a couple of weeks later, and then Celeron 6305E, still for embedded & IoT applications, with support for features such as 2.5GbE and quad-display support. We’ve already seen some Tiger Lake UP3 motherboards with AAEON UP Xtreme i11 (122 x 120 mm) and IEI tKINO-ULT6 mini-ITX SBC, but if you’d like a more compact Tiger Lake solution, Commell LP-179 Pico-ITX motherboard may be an option with a choice of Core i7-1185G7E or Celeron 6305E processor. Commell LP-179 specifications: SoC (one or the other) Intel Core i7-1185G7E quad-core/octa-thread Tiger Lake UP3 embedded processor @ 1.8 GHz / 4.4 GHz (Turbo) with 12MB cache, 96EU Intel Iris Xe graphics; 12 to 28W TDP Intel Celeron 6305E dual-core Tiger Lake UP3 embedded processor @ 1.8 GHz (No […]