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Posted on by Debashis Das - 1 Comment on Renesas RZ/V2N low-power AI MPU integrates up to 15 TOPS AI power, Mali-C55 ISP, dual MIPI camera support

Renesas RZ/V2N low-power AI MPU integrates up to 15 TOPS AI power, Mali-C55 ISP, dual MIPI camera support

Renesas RZ V2N MPU

Renesas has recently introduced the RZ/V2N low-power Arm Cortex-A55/M33 microprocessor designed for machine learning (ML) and computer vision applications. It features the company’s DRP-AI3 coprocessor, delivering up to 15 TOPS of INT8 “pruned” compute performance at 10 TOPS/W efficiency, making it a lower-power alternative to the RZ/V2H. Built for mid-range AI workloads, it includes four Arm Cortex-A55 cores (1.8GHz), a Cortex-M33 sub-CPU (200MHz), an optional 4K image signal processor, H.264/H.265 hardware codecs, an optional Mali-G31 GPU, and a dual-channel four-lane MIPI CSI-2 interface. The chip is around 38% smaller than the RZ/V2H MPU and operates without active cooling. The RZ/V2N is suitable for applications like endpoint vision AI, robotics, and industrial automation. Renesas RZ/V2N specifications CPU Application Processor – Quad-core Arm Cortex-A55 @ 1.8 GHz (0.9V) / 1.1 GHz (0.8V) L1 cache – 32KB I-cache (with parity) + 32KB D-cache (with ECC) per core L3 cache – 1MB (with ECC, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on 5th Gen AMD EPYC Embedded 9005 Series Zen 5 processors supports up to 6TB DDR5 memory, up to 160 PCIe Gen 5 lanes

5th Gen AMD EPYC Embedded 9005 Series Zen 5 processors supports up to 6TB DDR5 memory, up to 160 PCIe Gen 5 lanes

AMD EPYC Embedded 9005

AMD has just introduced the 5th Gen AMD EPYC Embedded 9005 Series “Zen 5” processors designed for embedded systems with a focus on longevity (7 years), reliability, and system resiliency, and targeting networking, storage, and industrial edge systems with support for up to 6TB of DDR5 memory, up to 160 PCIe Gen5 lanes with CXL 2.0. The EPYC Embedded 9005 Series processors are offered with 8 to 192 cores in a single socket and deliver up to a 1.3x faster networking process and 1.6x faster storage. The company also claims a 1.3x increase in socket throughput and 1.3x better performance/Watts compared to the competition thanks to the new Zen 5c architecture. AMD EPYC Embedded 9005 highlights: CPU sub-system AMD EPYC Embedded 9745 to 9965 – Zen 5c architecture up to 12x core complex dies (CCDs), 192x cores, 384x threads AMD EPYC Embedded 9015 to 9655 – Zen5 architecture up to […]

Posted on by Debashis Das - No Comments on Infineon PSoC 4000T multi-sense low-power MCU features capacitive, inductive, hover, and non-contact liquid sensing

Infineon PSoC 4000T multi-sense low-power MCU features capacitive, inductive, hover, and non-contact liquid sensing

Infineon 4000T multi sense low power MCU

Infineon Technologies has introduced the PSoC 4000T Multi-Sense low-power MCU, along with the upcoming PSoC 4100T Plus which will feature higher memory and more I/Os. These MCUs integrate fifth-generation CAPSENSE technology along with Multi-Sense capabilities, including proprietary inductive sensing, and non-contact liquid sensing solutions. This combination makes it easy to develop advanced HMI applications, such as touch-over-metal, hover touch, and accurate liquid-level detection. The MCU also supports SmartSense auto-tuning which eliminates manual calibration. It supports Always-On sensing with 10x lower power consumption and 10x higher SNR than previous generations. Additionally, the MCU enables hover touch detection through 2 cm air gaps and supports capacitive, inductive, and liquid sensing in a single device. The device also supports waterproofing for harsh environments and reduces system complexity and cost by integrating multiple sensing technologies into a single chip. Infineon PSoC 4000T specifications: MCU Core – 48 MHz Arm Cortex-M0+ CPU Memory – Up […]

Posted on by Debashis Das - No Comments on ASRock iEP-7040E fanless industrial IoT controllers feature Intel Core Ultra Arrow Lake-H CPU, 36V DI/DO

ASRock iEP-7040E fanless industrial IoT controllers feature Intel Core Ultra Arrow Lake-H CPU, 36V DI/DO

iEP 7040E Series

ASRock has recently released the iEP-7040E series which are Arrow Lake-H industrial IoT controllers powered by Intel Core Ultra “Arrow Lake-H” SoCs with Intel Arc graphics and Intel AI Boost. They feature a fanless design, 9V to 36V or 19V to 36V DC input, three Gigabit Ethernet ports, and two optional Intel GbE ports with PoE. Depending on the variant, the iEP-7040E supports 4x DI/4x DO or 8x DI/8x DO (with 36V isolation), up to 96GB DDR5 5600MHz with In-Band ECC (IBECC), and Intel In-Band Manageability with TPM 2.0. Expansion options include an M.2 B-Key socket and Nano SIM card slot for cellular, an M.2 E-Key socket for WiFi/BT, and an M.2 2280 M-key socket for storage. I/O options include HDMI 2.0b, VGA, three USB 3.2 Gen2 ports, one USB 2.0 port, three RS232/422/485, audio I/O, and multiple power options with OVP, UVP, OCP, and 80V surge protection. Certified for […]

Posted on by Debashis Das - No Comments on Adafruit Metro RP2350 development board follows Arduino UNO form factor, features HSTX DVI output

Adafruit Metro RP2350 development board follows Arduino UNO form factor, features HSTX DVI output

Adafruit Metro RP2350 dev board

The Adafruit Metro RP2350 is a Raspberry Pi RP2350 development board that closely follows the Arduino UNO form factor for compatibility with existing Arduino shields. Key features include 37 GPIOs, a microSD card slot, a 5V buck converter (6–17V input), an onboard RGB NeoPixel, a Stemma QT port for I2C peripherals, a 22-pin HSTX port for DVI video output, and a USB Type-C port for power and data. It also provides a Pico Probe debug port, an RX/TX switch for UART flexibility, and a UF2 bootloader for easy firmware updates. Target applications include IoT projects, embedded system development, hardware prototyping, and educational purposes. Adafruit Metro RP2350 specifications SoC – Raspberry Pi RP2350 CPU Dual-core Arm Cortex-M33 @ 150 MHz with Arm Trust zone, Secure boot Dual-core RISC-V Hazard3 @ 150 MHz Up to two cores can be used at any given time Memory – 520 KB on-chip SRAM Security 8KB of […]

Posted on by Debashis Das - No Comments on Altair ALT1350 based HL7900 5G LPWA module supports Wi-SUN, GNSS, and NB-IoT over non-terrestrial networks

Altair ALT1350 based HL7900 5G LPWA module supports Wi-SUN, GNSS, and NB-IoT over non-terrestrial networks

Sierra Wireless HL7900 5G LPWA module

The HL7900 5G LPWA module from Semtech (Sierra Wireless) is a globally certified solution built around Sony’s Altair ALT1350 chip and designed for low-power IoT applications. It is certified by major U.S. carriers, including AT&T, T-Mobile, and Verizon, as well as Japan’s KDDI, and has achieved global regulatory certifications (FCC, CE, ISED, etc.) and industry certifications (PTCRB, GCF) for carrier interoperability. This chip features an ultra-low-power sensor hub MCU for efficient environmental monitoring. Additionally, it includes integrated sub-GHz and 2.4GHz radios supporting short-range protocols such as Wi-SUN including U-Bus Air, NB-IoT, and 5G NTN along with GNSS and Wi-Fi-based indoor/outdoor tracking. Furthermore, this chip supports embedded SIM support, secure edge-to-cloud connectivity, and over-the-air updates. These features make this chip useful for applications such as asset tracking, urban navigation, and other IoT solutions requiring reliable, low-power connectivity with global reach. Semtech HL7900 specifications: MCU – Sony ALT1350 5G cellular IoT chip […]

Posted on by Debashis Das - No Comments on Intel N50 fanless open-frame panel PCs features 7” and 10” PCAP touch display, HDMI 2.0a, RS-485/232

Intel N50 fanless open-frame panel PCs features 7” and 10” PCAP touch display, HDMI 2.0a, RS-485/232

BCM OFT10W ADLN Open Frame touch LCD computer

BCM Advanced Research has recently introduced two new fanless open-frame panel PCs powered by an Intel Processor N50 CPU – the OFT07W-ADLN (7-inch) and OFT10W-ADLN (10-inch) – which are low-cost all-in-one embedded computers designed for tablet-like usability. Both modules feature 8GB LPDDR5 memory, 64GB eMMC storage, and an M.2 E-key slot for Wi-Fi/Bluetooth connectivity. These panel PCs come with PCAP touchscreens (800×1280 for 7-inch and 1200×1920 for 10-inch) with various connectivity options including USB, HDMI 2.0a, RS-232/485, and Gigabit Ethernet. With 12-24V DC input supply, fanless operation, and a durable steel frame, these compact open-frame panel PCs are meant for space-constrained applications like HMIs, self-service kiosks, gaming consoles, medical terminals, smart vending machines, digital signage, and more. BCM OFT07W-ADLN and OFT10W-ADLN specifications: SoC – Intel Processor N50 dual-core processor up to 3.4 GHz with 6MB cache, 16EU Intel UHD Graphics; TDP: 6W System Memory – Up to 8GB LPDDR5 onboard Storage – […]

Posted on by Debashis Das - No Comments on SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

UP 7000 x86 SBC