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August 4, 2024August 4, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

VIA launches MediaTek Genio 700 SMARC SoM, Pico-ITX SBC, and fanless Edge AI embedded system

MediaTek Genio 700 SoM SBC fanless system

VIA Technologies has launched three new Edge AI solutions based on the MediaTek Genio 700 mid-range Cortex-A78/A55 AI SoC with the SOM-5000 SMARC 2.1.1 system-on-module, VAB-5000 single board computer (SBC), and ARTiGO A5000 fanless embedded system. All three platforms come with 4GB or 8GB LPDDR4 memory, 16GB eMMC flash, gigabit Ethernet, video interfaces, and camera inputs, and are designed for intelligent edge computing across a range of industrial, commercial, and consumer applications. VIA SOM-5000 system-on-module Specifications: SoC – MediaTek Genio 700 (MT8390) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz, 6x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC3 GPU with support for OpenGL ES 1.1/2.0/3.2, OpenCL ES 2.2, and Vulkan 1.0/1.1 APIs VPU Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp75, AV1, VP9, HEVC, H.264 codecs supported AI accelerator – Mediatek DLA + VP6 with INT8, […]

July 30, 2024 by Debashis Das - 9 Comments

Firefly ROC-RK3576-PC low-profile Rockchip RK3576 SBC supports AI models like Gemma-2B, LlaMa2-7B, ChatGLM3-6B

Firefly ROC-RK3576-PC is a low-power, low-profile SBC built around the Rockchip RK3576 octa-core Cortex-A72/A53 SoC which we also find in the Forlinx FET3576-C, the Banana Pi BPI-M5, and Mekotronics R57 Mini PC. In terms of power and performance, this SoC falls in between the Rockchip RK3588 and RK3399 SoCs and can be used for AIoT applications thanks to its 6 TOPS NPU. Termed “mini computer” by Firefly this SBC supports up to 8GB LPDDR4/LPDDR4X memory and 256GB of eMMC storage. Additionally, it offers Gigabit Ethernet, WiFi 5, and Bluetooth 5.0 for connectivity. An M.2 2242 PCIe/SATA socket and microSD card can be used for storage, and the board also offers HDMI and MIPI DSI display interfaces, two MIPI CSI camera interfaces, a few USB ports, and a 40-pin GPIO header. Firefly ROC-RK3576-PC specifications SoC – Rockchip RK3576 CPU 4x Cortex-A72 cores at 2.2GHz, four Cortex-A53 cores at 1.8GHz Arm Cortex-M0 MCU at 400MHz GPU […]

July 29, 2024July 30, 2024 by Debashis Das - 2 Comments

Jetway JMTX-ADN8 mini-ITX motherboard features Intel N97 CPU, dual GbE, three display interfaces

The Jetway JMTX-ADN8 is a mini-ITX motherboard built around an Intel N97 (Alder Lake-N) processor. The board supports up to 32GB DDR5 RAM via a single SO-DIMM slot and can drive up to three independent displays powered by Intel UHD graphics. Additionally, it offers dual GbE LAN, nine USB ports both USB3.2 Gen 1 and USB 2.0, and multiple storage and expansion options including M.2 (M-key, E-key, and B-key) and SATA-III. The motherboard also includes PCI expansion and supports Windows and Linux operating systems. In one of our last posts, we wrote about the Jetway JNUC-ADN1, another Intel N97-powered SBC, but in a smaller Next Unit of Computing (NUC) form factor. Other than that we have written about similar motherboards in mini-ITX from factors including Radxa ROCK 5 ITX, MW-100-NAS, and ASRock IMB-A8000 feel free to check those out if you are looking for mini-ITX motherboards. Jetway JMTX-ADN8 mini-ITX SBC […]

July 11, 2024July 11, 2024 by Sponsored Post - No Comments

Mixtile Edge AI boxes work with ONVIF cameras to deploy video analytics solutions (Sponsored)

Mixtile Edge AI solution supports ONVIF cameras and leverages object detection, object classification, real-time analysis, and intelligent monitoring to create IoT video analytics applications across the security, transportation, logistics, retail, industry, and agriculture sectors. The hardware is based on the time-tested Mixtile Edge 2 Kit IoT gateway powered by a Rockchip RK3568 SoC with a 1 TOPS NPU and 1080p60 VPU, or Mixtile Blade 3 SBC featuring the more powerful Rockchip RK3588 octa-core SoC with a 6 TOPS AI accelerator and an 8Kp60 VPU. The former can analyze up to 10 streams in real-time, and the latter up to a whopping 40 streams. So the novelty here is on the software side that has been developed by Mixtile and works the following way: The ONVIF cameras transmit video streams to a Mixtile Edge AI Box over the network. The Edge AI Box then runs pre-trained AI models to analyze the […]

June 28, 2024June 28, 2024 by Debashis Das - 2 Comments

Infineon CY8CKIT-062S2-AI PSoC 6 Edge AI evaluation kit features multiple sensors, Arduino headers, Pmod connectors

Infineon CY8CKIT-062S2-AI evaluation kit is a hardware platform built around the PSoC 6 family of MCUs and designed to help developers easily create and test edge AI applications. The dev board features an array of sensors including radar, microphone, magnetometer, IMU, and an air pressure sensor, which make it easy for data collection applications. The board also features Wi-Fi and Bluetooth connectivity and includes an additional expansion header that can be used to connect other modules and sensors. All of these features make this board useful for building a wide range of AI-powered applications, including smart home automation, industrial monitoring, wearables, healthcare devices, and robotics. Previously we have written about similar low-power edge AI modules such as the Digi ConnectCore MP25, the Axiomtek AIE110-XNX, and the Arducam KingKong feel free to check those out if you are interested in such low-power modules. Infineon CY8CKIT-062S2-AI Evaluation Kit specifications: MCU – Infineon […]

June 20, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Alif Semi Ensemble E1C is an entry-level Cortex-M55 MCU with a 46 GOPS Ethos-U55 AI/ML accelerator

Alif Ensemble E1C AI/ML Cortex-M55 microcontroller

Alif Semi Ensemble E1C is an entry-level addition to the company’s Ensemble Cortex-A32M35 processors and microcontrollers with Ethos-U55 microNPUs that targets the very edge with a 160 MHz Cortex-M55 microcontroller and a 46 GOPS Ethos-U55 NPU. The Ensemble E1C is virtually the same as the E1 microcontroller but with less memory (2MB SRAM) and storage (up to 1.9MB non-volatile MRAM), and offered in more compact packages with 64, 90, or 120 pins as small as 3.9 x 3.9mm. Alif Semi Ensemble E1C specifications: CPU – Arm Cortex-M55 core up to 160 MHz with Helium Vector Processing Extension, 16KB Instruction and Data caches, Armv8.1-M ISA with Arm TrustZone; 4.37 CoreMark/MHz GPU – Optional D/AVE 2D Graphics Processing Unit MicroNPU – 1x Arm Ethos-U55 Neural Processing Unit with 128 MAC; up to 46 GOPS On-chip application memory Up to 1.9 MB MRAM Non-Volatile Memory Up to 2MB Zero Wait-State SRAM with optional […]

June 19, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ESWIN EIC7700X quad-core RISC-V SoC embeds 19.95 TOPS NPU for Edge AI vision applications

Yesterday we noted Sipeed was working on the LM5A system-on-module powered by ESWIN EIC7700X quad-core RISC-V processor with a ~20 TOPS AI accelerator in order to integrate it into its Lichee Book laptop and other carrier boards. So today, I’ve decided to look into the EIC7700X SoC designed by “BEIJING ESWIN COMPUTING TECHNOLOGY CO., LTD”, or ESWIN for shorts. The EIC770X features four 64-bit RISC-V (RV64GC) cores clocked up to 1.8 GHz, unnamed 3D and 2D GPUs, a 19.95 TOPS NPU, H.265/H.264 video encoder/decoder capable of handling up to 32x 1080p30 videos, various video output (HDMI + DSI) and input interfaces, dual GbE, 4-lane PCIe Gen 3, and more. ESWIN EIC7700X specifications: CPU 4x SiFive Performance P550 RV64GC RISC-V cores @ 1.4GHz (up to 1.8GHz) with Cortex-A75-class performance 32KB(I) + 32KB(D) L1 Cache 256KB L2 Cache 4MB shared L3 Cache Cache supports ECC (support SECDED) DNN Accelerator – 19.95 […]

June 2, 2024June 5, 2024 by Sponsored Post - No Comments

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]