M5Stack ATOM Display Lite adds HDMI output to ESP32 module

ESP32 HDMI output

M5Stack ATOM Display Lite is a kit based on GOWIN Gowin GW1NR-9C FPGA and LT8618SX RGB to HDMI chip designed to add HDMI output up to 720p to the company’s ESP32-based M5Stack ATOM Lite module. The ATOM Lite sees the ATOM Display Lite kit as an SPI display, but the solution outputs the data to an HDMI monitor or TV with up to 1280×720 resolution and can be used for information display, menu board, and more. ATOM Display Lite specifications: Wireless IoT modules – M5Stack ATOM Lite ESP32-PICO-D4 based module with 240MHz dual-core CPU, 520KB SRAM, 4MB flash, Wi-Fi 4 and Bluetooth connectivity FPGA – Gowin GW1NR-9C (PDF datasheet) FPGA with 8,640 LUTs used to simulate SPI TFT-LCD data output, HDMI bridge – Lontium Semi LT8618SX RGB to HDMI chip with 24-bit color depth up to 1280×720 output @ 60 fps (optimized frame rate up to 12 ~ 16FPS) Misc- […]

TurboX C7230 SOM integrates Qualcomm QCS7230 SoC for WiFi 6 & 5G 8K AI cameras

8K WiFi 6 AI camera development kit

Thundercomm TurboX C7230 SOM is a system-on-module powered by the just-announced Qualcomm QCS7230 hexa-core processor with 7 TOPS of AI performance and designed for WiFi 6 and 5G connected smart cameras with up to 8K resolution. The TurboX C7230 module comes with 8GB LPDDR5 (PoP), 128GB UFS storage, six MIPI CSI camera interfaces, two MIPI DSI display interfaces, as well as a QCA6391 chip for WiFi 6 and Bluetooth 5.1 connectivity, plus optional 5G cellular connectivity through an optional Snapdragon X55 module that connects to the TurboX C7230 development kit. TurboX C7230 SOM system-on-module specifications: SoC – Qualcomm Snapdragon QCS7230 hexa-core processor with 1x Kryo 585 Gold (Cortex-A77) core @ 2.84 GHz, 3x Kryo 585 Gold cores @ 2.4 GHz, and two Kryo 585 Silver (Cortex-A55) cores @ 1.8 GHz, 4 MB L3 cache, Adreno 650 GPU, Adreno 665 VPU, Adreno 995 DPU, Hexagon DSP with dual-HVX,  and Spectra 480 […]

Bluetooth LE audio evaluation kit supports nRF52840 Bluetooth Low Energy SoC

Bluetooth LE audio evaluation kit

Software company Packetcraft has announced the availability of its Bluetooth LE audio evaluation kit for the Nordic Semiconductor nRF52840 Bluetooth Low Energy SoC used to let engineers evaluate the technology and develop Bluetooth LE Audio applications. Bluetooth LE audio was first announced in January 2020 together with the LC3 audio codec, and promised to deliver a much longer battery life for your Bluetooth headphone or battery-operated speaker, as well as support for multi-stream and broadcast audio. But it’s taken some time before being adopted in chips like Qualcomm QCC305x/QCC3056 or FastConnect 7800, as well as operating systems with, for instance, Android 12 being the first version of Android with LE audio support. The kit is comprised of three Nordic Semi nRF52840-DK boards each fitted with a Packetcraft audio interface board (AIB) equipped with two 3.5mm audio jacks for microphone and speaker, plus a ground loop isolator, three 3.5mm audio cables […]

RM500U-CN Raspberry Pi 5G HAT kit sells for under $200… for the Chinese market

low-cost Raspberry Pi 5G HAT

Waveshare has introduced a new Raspberry Pi 5G HAT kit with a Quectel RM500U-CN 5G module, four antennas, and other accessories that sells for under $200, Raspberry Pi SBC not included. On the face of it, it looks like an incredible deal, considering we’ve previously covered two other 5G development kits for the Raspberry Pi, namely Waveshare SIM8200EA-M2 HAT with a Snapdragon X55 5G modem and Sixfab “Raspberry Pi 5G Development Kit” that sold for about $400 to $600. What’s the trick? It’s designed for the Chinese market. RM500U-CN Raspberry Pi 5G HAT kit content: Waveshare Raspberry Pi M.2 TO 4G/5G HAT Quectel RM500U-CN 5G M.2 module 4x antennas plus SMA protective caps and IPEX adapter cables USB 3.0 male to male cable 1x USB 3.0 adapter and 1x USB 2.0 adapter 40-pin header 5V/3A USB Type-C power adapter Screws pack We can find more details about the RM500U-CN module […]

NVIDIA launches Jetson AGX Orin Developer Kit, Orin NX modules, and Isaac Nova Orin AMR platform

NVIDIA Jetson AGX Orin Developer Kit

NVIDIA Jetson AGX Orin module was first introduced in November 2021, but the company has now officially launched the Jetson AGX Orin Developer Kit, andunveiled the lower cost Orin NX modules still with 70 TOPS or more, and the Isaac Nova Orin AMR (autonomous mobile robot) reference platform. NVIDIA Jetson AGX Orin Developer Kit Jetson Orin AGX developer kit specifications: Jetson AGX Orin module with CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ 1.3 GHz DL Accelerator – 2x NVDLA v2.0 Vision Accelerator – PVA v2.0 (Programmable Vision Accelerator) AI Performance – Up to 275 TOPS (INT8) @ 60W Video Encode – 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265) Video Decode – 1x 8K30 | 3x 4K60 | 7x 4K30 | […]

Quadric devkit features q16 hybrid AI, DSP, computer vision accelerator

Quadric devkit Raspberry Pi CM4

The Quadric devkit is an M.2 Key M module equipped with the company’s q16 edge processor offering a hybrid data-flow + Von Neumann machine for not only neural networks, but also computer vision, digital signal processing, BLAS (Basic Linear Algebra Subprograms), and other workloads. This architecture allows the Quadric q16 to be more flexible than traditional AI accelerators and can deliver more effective solutions for heterogonous systems that may have multiple accelerators or require a powerful processor. The M.2 form factor enables easy integration into boards with an M.2 Key M socket such as the Gumstix Raspberry Pi 4 development board shown below with the Quadric devkit. Quadric devkit specifications: Accelerator – Quadric q16x4 Processor with 256 Vortex Cores, 8 MB on-chip memory, 4 kB per core memory, multi-precision multiply accumulate; 16 x 16mm package Memory – 4GB LPDDR4, 32-bit, dual-rank up to 3677 MHz Host Interface – 2-lane PCIe […]

Ai-Thinker Ra-08 LoRaWAN module features ASR6601 chip (Sponsored)

Ai Thinker Ra-08 LoRaWAN Module

Ai-Thinker Ra-08/08H are new LoRaWAN modules based on ASR Microelectronics ASR6601 module featuring a 48MHz ARM Cortex M4 microcontroller and Semtech SX1262 transceiver allowing long-range, low power communication for the Internet of Things. Both LoRaWAN modules share most of the same specifications, but the Ra-08 module operates in the 410-525MHz frequency band, while the Ra-08H module works in the widely used 803MHz to 930MHz band. Ai-Thinker also provides a development kit for each module. Ai-Thinker Ra-08/Rs-08H key features and specifications: Programmable embedded Arm Cortex-M4 MCU with 128 KB of Flash and 16 KB of SRAM LoRa radio Sensitivity – -138 dBm @ SF12/125KHz Tx power – Up to +22dBm Frequencies Ra-08 – 410 MHz to 525 MHz Ra-07H – 803 MHz to 930 MHz Spread spectrum factor – SF5, SF6, SF7, SF8, SF9, SF10, SF11, SF12 LoRa, (G)FSK, BPSK, and (G)MSK modulation Bit rate up to 62.5 Kbps in LoRa […]

Banana Pi teases BPI-RK3588 Rockchip RK3588 SoM and development kit

RK3588_MB carrier board devkit

Banana Pi has showcased its first engineering samples of a Rockchip RK3588 SoM (system-on-module) with up to 8GB RAM and 128GB flash, as well as a development kit with dual Ethernet, three HDMI ports, SATA interfaces, PCIe interface, and more. Rockchip RK3588 octa-core Cortex-A76/A55 processor is the most powerful from the company, both in terms of CPU and GPU power, but also with a wide range of high-speed interfaces, and will be found in the upcoming Radxa ROCK5 single board computer, and a yet-to-be-announced board from Pine64. Banana Pi RK3588_CV1 “Core” (BPI-RK3588) board specifications: SoC- Rockchip RK3588 octa-core processor with four Cortex-A76 cores @ 2.4 GHz, four Cortex-A55 cores @ 1.8 GHz, an Arm Mali G610MC4 GPU, a 6 TOPS NPU, 8K 10-bit decoder, 8K encoder System Memory – 2GB, 4GB or 8GB LPDDR4 Storage – 32GB, 64GB, or 128GB eMMC flash 313-pin edge connector for I/Os including PCIe 3.0, […]

UP 7000 x86 SBC