Hailo-15 is a family of AI Vision processors for smart cameras that deliver up to 20 TOPS of AI inference and are able to process deep-learning AI applications such as video analytics. The Hailo-15 appears to build upon the earlier Hailo-8 AI processor with up to 26 TOPS and more limited computer vision capability. The new AI vision processor integrates a quad-core Cortex-A53 CPU sub-system, can handle 4K video streams, and features “advanced computer vision engines”. So the main differences are that the Hailo-15 is a complete SoC / standalone processor and is specifically designed for AI cameras. Hailo-15 highlights: CPU – Quad-core Arm Cortex-A53 processor up to 1.3 GHz or 1.1 GHz (Hailo-15L) DSP – Vector DSP, 256 MACs @ 700 MHz supports up to 350 GOPs AI accelerator / NN core sub-system with dataflow architecture Hailo-15H – Up to 20 TOPS Hailo-15M – Up to 11 TOPS Hailo-15L […]
STMicro STM32H5 Arm Cortex-M33 MCU clocks at 250 MHz, supports STM32Trust TEE Secure Manager
STMicroelectronics has announced the STM32H5 Arm Cortex-M33 “high-performance” microcontroller family clocked at up to 250 MHz and supporting STM32Trust TEE Secure Manager to boost both performance and security in “next-generation smart applications”. The STM32H5 family has three product types namely the higher-end STM32H563/573 with up to 2MB flash, 640KB SRAM, Ethernet, and hardware security, the STM32H562 with a similar design but fewer interfaces, and the entry-level STM32H502 with 128KB flash, 32KB SRAM. STM32H5 key features and specifications: MCU core – Arm Cortex-M33 core with TrustZone technology, digital signal processing (DSP) and floating-point unit (FPU) running up to 250 MHz; Up to 375 DMIPS and a 1023 CoreMark score executing from the flash memory Memory and Storage STM32H563/573/562 – 1 to 2 Mbytes of flash memory, 640 Kbytes of SRAM STM32H503 – 128 Kbytes of flash memory and 32 Kbytes of RAM. OSPI serial flash memory interface Up to 2x SDMMC […]
IoT Prototype Kit is powered by an Alder Lake-H COM Express module with up to Core i5-12600HE CPU
ADLINK has launched an IP-i IoT Prototype Kit based on their Express-ADP COM Express Type 6 Basic “Alder Lake-H” module with either an Intel Core i5-12600HE 12-core (4P+8E) processor clocked at up to 4.5 GHz or a Core i3-12300HE 8-core (4P+4E) processor reaching up to 4.3 GHz. The kit also includes the Express-BASE6 R3.1 carrier board, a thick heatsink with an active fan, a debug board (DB30 x86), and various cables for SATA storage, a DB9 COM port, and I/Os, and the kit can be used to develop applications for industrial automation and control, medical ultrasound, image processing and analysis, high-speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, etc… The Express-ADP module supports up to 64GB DDR5 memory, optional on-module NVMe storage, up to 4x 4K displays, multiple PCIe Gen4 and Gen3 interfaces, SATA 3.0, and so on. You’ll find detailed Express-ADP COM Express module specifications in […]
VAR-SOM-AM62 System-on-Module features TI AM625x Cortex-A53/M4 SoC
Variscite VAR-SOM-AM62 is a System-on-Module (SoM) powered by a Texas Instruments Ti AM625x quad-core Cortex-A53 processor @ up to 1.4 GHz with a 400MHz Cortex-M4F cores and 333MHz PRU real-time co-processors to control I/Os. The module also supports up to 4GB RAM and 128GB eMMC flash, features a single or dual-band WiFi + BT/BLE5.2 module, and offers up to 3x CAN Bus, dual GbE, audio, camera in, and dual USB, among other interfaces. It is designed for industrial applications with a -40 to 85°C operating temperature range. VAR-SOM-AM62 specifications: SoC – Texas Instruments Sitara AM62x (AM6252 or AM6254) with Up to 4x Arm Cortex-A53 @ 1.4 GHz 1x Arm Cortex M4F up to @ 400 MHz 1x PRUSS up to @ 333 MHz (only in industrial-grade modules) GPUs – 3D GPU with OpenGL ES 3.1 & Vulkan1.2, 2D graphics engine System Memory – 512MB to 4GB DDR4-3200 RAM @ 800MHz […]
Coral Dev Board Micro combines NXP i.MX RT1176 MCU with Edge TPU in Pi Zero form factor
Coral Dev Board Micro is the latest iteration of Google’s Edge AI devkit with an NXP i.MX RT1176 Cortex-M7/M4 crossover processor/microcontroller coupled with the company’s 4 TOPS Edge TPU, a camera, and a microphone in a board that’s about the size of a Raspberry Pi Zero SBC. The new board follows the original NXP i.MX 8M-based Coral Dev board that was introduced in 2019, and Coral Dev Board mini based on MediaTek MT8167S processor launched in 2020, and keeps with the trend of providing more compact solutions with lower-end host processors for edge AI. Coral Dev Board Micro specifications: MCU – NXP i.MX RT1176 processor with an Arm Cortex-M7 core @ up to 1 GHz, Cortex-M4 core up to 400 MHz, 2MB internal SRAM, 2D graphics accelerators; System Memory – 512 Mbit (64 MB) RAM Storage – 1 Gbit (128 MB) flash memory ML accelerator – Coral Edge TPU coprocessor […]
Nordic Semi nRF7002 DK low-power dual-band WiFi 6 IoT development kit launched for $56 and up
Nordic Semi nRF7002 DK is an IoT development kit based on the nRF5340 dual-core Cortex-M33 multi-protocol wireless SoC and nRF7002 companion chip adding low-power dual-band (2.4GHz and 5.0 GHz) WiFi 6 connectivity. When Nordic Semi introduced the nRF7200 dual-band WiFi 6 companion chip for nRF52840 and nRF5340 wireless SoCs and nRF9160 cellular IoT SiP last summer, the “nRF7002-PDK” development kit was only mentioned in passing with a 3D render and not much else. The company has now announced the availability of the nRF7002 DK to help developers create low-power Wi-Fi 6 IoT applications. nRF7002 DK specifications: Wireless MCU – Nordic Semi nRF5340 dual-core Arm Cortex-M33 microcontroller @ 128/64 MHz with 1 MB Flash + 512 KB RAM for the application core and 256 KB Flash + 64 KB RAM for the network core, Bluetooth 5.1 LE with direction-finding support, Bluetooth mesh, NFC, Thread, Zigbee, 802.15.4, ANT, and 2.4 GHz proprietary […]
Qualcomm-based Open-Q 2290CS and 4290CS SIPs target industrial IoT and machine vision applications
Lantronix has just unveiled two new System-in-Packages (SiP) with the entry-level Open-Q 2290CS SIP based on Qualcomm QCS2290 quad-core Cortex-A53 processor designed for industrial IoT applications and safety vehicle equipment control, and the pin-compatible, mid-range Open-Q 4290CS SIP based on Qualcomm QCS4290 octa-core Kryo 260 CPU for applications requiring artificial intelligence and machine learning capabilities. The Open-Q 2290CS module comes with 2GB LPDDR4, 16GB eMMC flash, WiFi 5 and Bluetooth 5.0 connectivity, while the Open-Q 4290CS module is equipped with up to 6GB LPDDR4, up to 256GB eMMC flash., and Wi-Fi 5 with some Wi-Fi 6 features (TWT & 8SS), and Bluetooth 5.1. Lantronix also offers the Open-Q AL2 development kit supporting either both SIP modules for evaluation and rapid prototyping. Open-Q 2290CS – Qualcomm QCS2290 SiP Specifications: SoC – Qualcomm QCS2290 quad-core Cortex-A53 processor at up to 2.0 GHz with Adreno 702 GPU at 845 MHz with support for […]
$4 Sipeed M0S Dock IoT development board features BL616 WiFi 6, BLE 5.2, and Zigbee RISC-V microcontroller
As expected, Sipeed has now launched the Sipeed M0S IoT module based on Bouffalo Lab BL616 RISC-V microcontroller with 2.4 GHz WiFi 6, BLE 5.2, and Zigbee connectivity along with the “Sipeed M0S Dock” development board. The M0S is a tiny module (11×10 mm) with a 320 MHz wireless MCU, a ceramic antenna, and castellated holes for I/Os, and the Sipeed M0S Dock places the module on an easy-to-use board with a USB Type-C port, a BOOT button, and a 12-pin 2.54mm pitch header. Sipeed M0S module specifications: MCU – Bouffalo Lab BL616 32-bit RISC-V (RV32IMAFCP) microcontroller @ up to 320 MHz (384 MHz overclocked) with 480KB SRAM, 4MB flash, 2.4 GHz WiFi 6, Bluetooth 5.2 dual mode, and 802.15.4 radio (Zigbee) Antenna – Ceramic antenna (red component on module) I/Os – 25 castellated holes with RGB LCD DVP camera USB 2.0 OTG up to 480 Mbps I2C, UART, SPI […]