RAK8211-NB iTracker Battery / Solar Powered Module Comes with NB-IoT & Bluetooth 5 Connectivity, GPS, and 5 Sensors

RAK8211-NB-iTracker

Rak Wireless has recently launched a new products called RAK8211-NB iTracker based on a Quectel BC95-G NB-IoT module, Nordic Semi nRF52832 Bluetooth 5 chip, and Quectel L70-R GNSS module. The asset tracker module also comes with 5 different sensors to monitor motion and environmental data, and can optionally be powered directly by a solar panel.RAK8211-NB iTracker specifications: Connectivity NB-IoT via Quectel BC95-G (Global) wireless communication module + SIM card socket Bluetooth 5 via Nordic Semi nRF52832 Arm Cortex-M4F micro-controller (Arduino compatible) GPS/GLONASS via Quectel L70 GNSS module Sensors LIS3DH 3-axis “nano” accelerometer LIS2MDL 3-axis digital magnetic sensor. Tilt sensor BME280 pressure, humidity and temperature sensor OPT3001 intensity of light sensor Expansion – 3x headers with SWD, 2x sensor out + tilt out (also usable as GPIO and analog inputs), 3.3V, GND, and reset Power Supply – 3.5V to 18V via solar panel (P2) or battery (P3) Dimensions – 43mm x […]

hIoTron Modular & Enterprise IoT Development Kit is Designed for Fast Prototyping

Hi-Nodes

hIoTron modular & enterprise IoT development kit is described by the company has a “fully pre-programmed prototyping kit for quickly building and testing your IoT concept” with plug-n-play module allowing for flexible prototyping. Beside the hardware comprises of a gateway and nodes, the kit also integrates with the company’s enterprise IoT Platform enabling easy design of custom mobile application & GUI dashboard. The company offers standard, advanced, and custom kits, but to keep things simple, let’s focus on the content of their standard kit first: Hi-Gate IoT gateway: WiSoC – Texas Instruments CC3200 Arm Cortex-M4 @ 80 MHz with 1MB flash, 256KB RAM Storage – 1MB serial flash, 512KB EEPROM Connectivity 802.11 n/g/n Wi-Fi,  2G GSM/GPRS (optional 3G/4G), ZigBee, BLE 4.0, sub-1GHz RF/NON RF to REST/MQTT gateway Expansion – 2x GPIO port pins, 2x analog port pins Power Supply – 9-12V DC 3x modular Hi-Nodes (up to 25 supported per […]

Intrinsyc Introduces Open-X 8M SoM and Mini-ITX Development Kit with Optional LCD Display

Intrinsyc announced their own NXP i.MX 8M system-on-module, as well as a corresponding development kit back in February 2018 for Embedded World 2018. Somehow I missed it until today when the company tweeted about the kit unboxing video, so let’s have a look, starting with the module itself.Open-X 8M SoM specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ up to 1.5 GHz, Arm Cortex-M4 core with 256 KB tightly coupled memory (TCM), Vivante GC7000Lite GPU System Memory – 3GB LPDDR4 RAM Storage – 16GB eMMC Flash Video – 4Kp60 HEVC/H.265 main, and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder On-module Connectivity – WiFi  802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module 3x 100 pin board to board connectors exposing: Display Interfaces HDMI 2.0a up to 4096 x 2160 at 60 Hz 4-lane MIPI […]

Banana Pi BPI-AI-Voice is a $169 Speech Recognition Development Kit based on MicroSemi ZL38063

BPI-AI-Voice

SinoVoIP has just launched BPI-AI-Voice development platform for speech recognition on Aliexpress for $169, and excluding the different PCB color, it is a clone of the official $299 Microsemi AcuEdge Development Kit for Amazon AVS, which is based on MicroSemi ZL38063 audio processor and comes with two microphones. BPI-AI-Voice key features: Audio Processor – MicroSemi ZL38063 Storage – U2 SPI flash to store ZL38063 firmware Audio 4x on-board digital microphones (AKU441) supporting a 2 microphone configuration for 180° and 360° audio pick-up. 2x low cost class D audio amplifier (NCP2820) Expansion Headers JMMA1 audio header for digital microphone, analog out, and 3 GPIOs JM1-4 digital microphone headers for off-board microphones 40-pin P2 header to connected to Raspberry Pi 3  (I2S, SPI and 8x GPIO used) Debugging – JAIB2/2 auto tuning headers, micro USB port. Power Supply – 5V via micro USB port Dimensions – 70 mm × 66 mm Temperature […]

PHYTEC Introduces phyCORE SoMs & Devkits Based on NXP i.MX8, i.MX 8M, or i.MX 8X Processors

PHYTEC, an embedded systems company headquartered in Germany with global offices, has updated their phyCORE systems-on-module family with 3 sub-families of modules based on NXP i.MX 8, i.MX 8X, or i.MX 8M dual or quad core processors for a total of 9 modules. phyCORE-i.MX 8 Specifications: SoC – NXP i.MX 8Quad,  i.MX 8QuadPlus or  i.MX 8QuadMax Arm Cortex-A72/A53/M4F processor @ up to 1.6 GHz with  Tensilica HiFi 4 DSP @ 666 MHz, 2x Vivante GC7000XSVX GPUs System Memory – 1  to 8GB LPDDR4 RAM Storage – 64MB to 256MB Octal SPI/DualSPI SPI NOR Flash, 4 GB to 128 GB eMMC flash, 4kB EEPROM Connectivity – 2x Gigabit Ethernet PHY 4x 120-pin Board-to-board connectors with: Display – 2x LVDS, 2x MIPI DSI, 1x HDMI Video Input / Camera – 1x HDMI, 2x MIPI CSI Audio – 2x ESAI, up to 4x SAI Networking – 2x 10/100/1000 Mbit/s Ethernet USB – 1x […]

Emcraft Introduces NXP i.MX 8M SoM and $299 Starter Kit

I first discovered Emcraft Systems in 2011 through their work porting uCLinux to Arm Cortex M3/M4 microcontrollers, and since then the company has kept on working microcontroller software and hardware, but also moved to Arm Cortex A class solutions. Like most embedded systems companies, Emcraft engineers have also designed their own NXP i.MX 8M system-on-module, but while many have still not announced pricing, and/or show “in development” or “early product announcement” in their product page, Emcraft has started taking pre-order for their i.MX 8M SoM Starter Kit for $299, with shipping scheduled for May 21, 2018 or before. Let’s check out SOM-IMX8M specifications first: SoC – NXP i.MX8M Quad processor with 4x Cortex A53 cores, 1x Cortex-M4F core, and a Vivante GC7000Lite GPU System Memory – 512MB to 4GB DDR3L/LPDDR4 SDRAM Storage – 4 to 64GB eMMC flash Connectivity – Wireless module supporting 802.11 a/b/g/n/ac 2×2 MIMO WiFi, Bluetooth 4.2, […]

NXP Unveils A71CH Secure Element Chip for Secure Peer-to-Peer or Cloud Connections

The industry clearly has an issue at hand with the security of the Internet of Things, and the problem is complex as some devices are easily accessible due to bad configuration (e.g. default username/password), while others may have security flaws at various levels of the software stack from the low level bootloaders to the operating systems, and applications. Nowadays, devices also need to be upgradeable, and communicate with the cloud, and that introduces other attack vectors in case malignant firmware is installed instead, or a man-in-the-middle attack occurs. While some people may claim security can be achieved by software only, we are seeing security evolving towards combined software and hardware solutions, for example with Arm Trustzone built into SoCs, but some companies are also introducing Secure Element chip, which Samsung has already done and integrated into their Artik  modules to secure data from the hardware to the cloud. NXP has […]

Intrinsyc Open-Q 845 HDK Development Kit for Snapdragon 845 Processor Available for $1079

Qualcomm Snapdragon 845 based devices such as Samsung Galaxy S9/S9+ smartphones and Windows 10 Always-Connected Mobile PCs should start shipping in the next few weeks, and as usual with every new premium Qualcomm Snapdragon Mobile Platform, we get an Open-Q development from Intrynsyc. Intrinsyc Open-Q 845 HDK is also equipped with 6GB LPDDR4x RAM, 128GB UFS2.1 Flash, a wireless module with 802.11ac/ad WiFi and Bluetooth 5.0, Gigabit Ethernet, USB interfaces, HDMI and DisplayPort video output, up to 3 cameras, and plenty more. Intrinsyc Open-Q 845 HDK specifications: SoC – Qualcomm Snapdragon SDA845 Octa-core 64-bit processor with 4x high-performance Kryo 385 cores up to 2.80 GHz, 4x low-power Kryo 385 cores up to 1.8 GHz, Qualcomm Adreno 630 GPU with support for OpenGL ES 3.2, OpenCL 2.0 Full, Vulkan, DX12, and Qualcomm Hexagon 685 DSP System Memory – 6GB LPDDR4x RAM Storage – 128GB UFS2.1 Flash, micro SD 3.0 UHS-1 slot […]

EmbeddedTS embedded systems design