development kit

Posted on by Debashis Das - 1 Comment on Topaz Tz170b FPGA devkit features hardened LPDDR4 controller, hardened MIPI D-PHY up to 2 Gbps per lane

Topaz Tz170b FPGA devkit features hardened LPDDR4 controller, hardened MIPI D-PHY up to 2 Gbps per lane

Topaz Tz170 J484 Development Kit

The Topaz Tz170b FPGA devkit from Efinix is a compact FPGA evaluation platform built around the Efinix Tz170 FPGA. This FPGA is built around a low-power, high-density 16 nm Quantum fabric and comes in a compact 484-ball FineLine BGA package. The company mentions that the board supports hardware-level MIPI D-PHY with data rates of up to 2 Gbps per lane and hardware-level LPDDR4 memory controller, making it ideal for high-speed embedded systems, vision processing, and custom SoC designs. Additionally, it includes 256 Mbit of LPDDR4 memory, dual SPI NOR flash memories, and high-speed QSE connectors for Efinix or custom daughter cards. Expansion is further enabled by a low-pin-count FMC connector, a microSD slot, user LEDs, and push buttons. Clock options include 33.33, 50, and 74.25 MHz oscillators, and a full range of onboard regulated power sources for stable operations. These features make this device useful for applications like edge AI, […]

Posted on by Debashis Das - 3 Comments on Microchip SAMA7D65 Cortex-A7 MPU comes in SoC and SiP packages with up to 2Gbit integrated DDR3L memory

Microchip SAMA7D65 Cortex-A7 MPU comes in SoC and SiP packages with up to 2Gbit integrated DDR3L memory

Microchip SAMA7D65 Cortex A7 MPU

Microchip has recently released the SAMA7D65 MPU, a high-performance Arm Cortex-A7 embedded processor designed for HMI and connectivity applications across industrial, home, medical, and appliance markets. The MPU is available in both System-in-Package (SiP) and System-on-Chip (SoC) variants and features various display interfaces, including MIPI DSI, LVDS, and 8-bit Serial RGB interfaces, along with a 2D GPU for graphical acceleration. Memory and storage options include support for 16-bit DDR2/DDR3/DDR3L and LPDDR2/3 memory, optional 1 Gbit or 2 Gbit DDR3 RAM, NAND Flash, eMMC Flash, and SD card. It features dual Gigabit Ethernet with TSN support, an I3C controller, five CAN-FD interfaces, and three high-speed USB ports. Additionally, it comes with various security features, including physically unclonable function (PUF), secure boot, key storage, and cryptographic accelerators for AES, SHA, RSA, and ECC. Microchip SAMA7D65 SoC/SiP specifications: CPU – Arm Cortex-A7 core up to 1 GHz Arm TrustZone, NEON, FPU 32KB L1 I-cache […]

Posted on by Debashis Das - 2 Comments on Pimoroni Interstate 75 W (RP2350) board is designed for HUB75 LED matrix panels

Pimoroni Interstate 75 W (RP2350) board is designed for HUB75 LED matrix panels

Interstate 75 W RGB LED Matrix Driver board

Pimoroni Interstate 75 W (RP2350) is an all-in-one RGB LED matrix driver board designed for HUB75 LED matrix panels commonly used in video walls, advertising displays, and creative signage. Built around a Raspberry Pi RP2350 chip this board also uses the Raspberry Pi’s CYW43439 module for Wi-Fi and Bluetooth and features user buttons, an RGB LED, and a Qw/ST connector for integration with Qwiic/STEMMA QT breakouts. The kit is compatible with various LED matrix sizes (32×32, 64×64, etc.) and comes in a starter kit with panels, cables, and magnetic feet for quick setup. All these features make this kit useful for applications including real-time data like bus times, air quality, or sensor outputs, dynamic signage, scrolling text, and more. Pimoroni Interstate 75 W (RP2350) specifications: SoC – Raspberry Pi RP2350A CPU Dual-core Arm Cortex-M33 @ 150 MHz with Arm Trust zone, Secure boot OR Dual-core RISC-V Hazard3 @ 150 MHz Up […]

Posted on by Debashis Das - 6 Comments on NXP EdgeLock A30 Secure Authenticator chip enables battery authentication for compliance with EU regulation 2023/1542

NXP EdgeLock A30 Secure Authenticator chip enables battery authentication for compliance with EU regulation 2023/1542

NXP EdgeLock A30 secure authenticator

NXP recently launched the EdgeLock A30 Secure Authenticator chip, a Common Criteria EAL 6+ certified secure authentication designed for IoT devices, including battery authentication applications. It complies with the EU’s Batteries Regulation 2023/1542, which mandates the inclusion of a Digital Product Passport (DPP), by 2027 to ensure traceability, sustainability, and safety in battery manufacturing and recycling. Alasdair Ross, Senior Director, NFC IoT Security, NXP explains: Secure authentication helps to ensure brand protection, consumer safety, and product traceability, fostering trust and shielding devices from physical damage. Smaller than a grain of rice, the EdgeLock A30 is designed to fit into even the smallest of devices. It supports multiple authentication use cases, making it easier for developers to support a variety of devices and accessories with a single solution, including device to device, cloud to device, counterfeit protection, and storage or protection of device identity. To address these requirements NXP’s EdgeLock A30 […]

Posted on by Debashis Das - 5 Comments on ESP32-AIVoice-Z01 is an ESP32-S3 AI voice kit with dual microphones, wake word detection, noise reduction and echo cancellation

ESP32-AIVoice-Z01 is an ESP32-S3 AI voice kit with dual microphones, wake word detection, noise reduction and echo cancellation

ESP32 AIVoice Z01 Development Kit

The ESP32-AIVoice-Z01 is an affordable ESP32-S3-powered AI voice kit designed for creating voice-controlled AI applications. It features Wi-Fi and Bluetooth connectivity through the ESP32-S3 SoC, a dual digital microphone array for accurate voice recognition, and an onboard amplifier. The system also implements audio algorithms for noise reduction and echo cancellation. The ESP32-AIVoice-Z01 board supports Espressif’s WakeNet voice wake-up framework and integrates with the AiLinker open-source backend service framework to enable the connection to various large AI model services like OpenAI, ZhiPu QingYan, TongYi QianWen, and DouBao. These features make this device suitable for developing AI-powered toys, IoT devices, mobile devices, and smart home applications. ESP32-AIVoice-Z01 ESP32 AI voice kit specifications Wireless module – ESP32-S3-WROOM-1U SoC – Espressif Systems ESP32-S3 dual-core Xtensa LX7 processor Memory – 8MB PSRAM Storage – 16MB flash Wireless – WiFi 4 and Bluetooth 5.0 connectivity with external antenna Storage – MicroSD card slot Audio Dual digital microphone array […]

Posted on by Debashis Das - No Comments on SO-ARM100 is an open-source AI robotic arm kit with LeRobot integration and NVIDIA Jetson support

SO-ARM100 is an open-source AI robotic arm kit with LeRobot integration and NVIDIA Jetson support

SO ARM100 AI Arm Kit

Seeed Studio has recently started selling the SO-ARM100 AI Robotic Arm kit, a low-cost AI arm designed for real-world robotics applications. This open-source hardware device features a 6-degree-of-freedom design with high-torque STS3215 bus servos, a 12-bit magnetic encoder for precise angle sensing, and UART for communication. The arm comes with motors, driver boards, power adapters, and other 3D-printed parts like arm segments, base, grippers, and motor mounts. Designed to work with the NVIDIA Jetson edge platform, it is ideal for grasping and placing. All these features make this device suitable for education, research, and AI-driven robotics projects. SO-ARM100 AI robotic arm kit specifications Degrees of Freedom (DOF) – 6 Motor control Total servo – 12x STS3215 bus servos Servo torque Arm kit Standard – 19.5 kg.cm @ 7.4V Arm kit pro – 30 kg.cm @ 12V (Pro) Angle Sensor – 12-bit magnetic encoder USB – USB-C for programming and testing […]

Posted on by Tomisin Olujinmi - No Comments on LoRaWAN no code ESP32-S3 development platform offers Arduino MKR, MikroBus, FeatherWing, and Grove expansion (Crowdfunding)

LoRaWAN no code ESP32-S3 development platform offers Arduino MKR, MikroBus, FeatherWing, and Grove expansion (Crowdfunding)

WAN-4-ALL LoRaWAN no code module

Sheffield-based IoT company, inx-systems has developed a programmable LoRaWAN IoT module and a development breakout board that integrates with Arduino MKR, Adafruit FeatherWing, Grove, and mikroBUS shields. The module is powered by an ESP32-S3 microcontroller which comes preloaded with inx’s no-code LoRaWAN software development platform, Lucid. The WAN-4-ALL module has built-in Wi-Fi, Bluetooth, and LoRaWAN connectivity via the ESP32-S3 microcontroller and Seeed Studio Wio-E5 module. This makes the module suitable for short-range, medium-range, and long-range IoT applications such as remote monitoring, home automation, industrial control, and smart agriculture. We have covered other LoRaWAN development platforms such as SB Component’s RAKWireless-based products, Particle’s multi-radio devices, and the UnPhone. The WAN-4-ALL module differentiates itself with the preloaded no-code LoRaWAN development environment and multiple connectivity options. WAN-4-ALL module specifications: SoC – Espressif Systems ESP32-S3 dual-core microcontroller @ 240MHz with Wi-Fi 4, Bluetooth LE 5 LoRaWAN Module – Seeed Studio Wio-E5 Module based on […]

Posted on by Debashis Das - No Comments on VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

VOIPAC iMX93 industrial development kit targets AI, HMI, and Edge Computing applications

Voipac iMX93 Industrial Development Kit

VOIPAC Technologies has recently launched its iMX93 Industrial Development Kit (iMX93 module and iMX development baseboard) which comes in Max, Pro, Basic, and Lite configurations. The system-on-module (SoM) is built around the NXP i.MX93 SoC with dual-core Arm Cortex-A55 application processor running at up to 1.7GHz, a Cortex-M33 co-processor running at up to 250MHz, and an Arm Ethos-U65 microNPU with up to 0.5 TOPS of AI performance. Other features include DDR4 memory, eMMC Flash, and industrial-grade 100-pin shielded connectors for signal integrity and thermal performance. Additionally, the devkit also exposes CAN, PWM, ADC, etc.. signals and supports WiFi 6, Bluetooth 5.3, and dual GbE. These features make the VOIPAC iMX93 industrial development kit suitable for applications including AI, machine learning, human-machine interface (HMI) solutions, and more. iMX93 Industrial Development Kit specifications: System-on-Module (four options) iMX93 Industrial Module Max SoC – NXP i.MX 93 dual-core @ 1.7 GHz with real-time Cortex-M33 co-processor NPU […]

UP 7000 x86 SBC