STMicro has added three new families to its STM32U5 Cortex-M33 microcontroller series with the entry-level STM32U535/545 with as little as 128KB flash, the STM32U595/5A5 with up to 4MB of Flash and 2,514KB of RAM, and the STM32U599/5A9 with similar features as the STM32U595/5A5 by adding the new NeoChrom 2.5D GPU plus TFT-LCD and DSI display interfaces. STMicro also announced that STM32U5 series MCUs were the first general-purpose MCUs to receive NIST-embedded random-number entropy source certification. As of now, along with the STM32U575/585 introduced in February 2021 with an optional Chrom-ART 2D GPU, STMicro offers eight product lines as part of the STM32U5 MCU series as shown in the table below. That means the STM32U5 microcontroller can address a wider range of applications with the STM32U535/545 targetting lower-cost applications with less flash and RAM, the “legacy” STM32U575/U585 for mid-range applications, and the STM32U59X/5AX for applications where more storage and memory is […]
Silicon Labs FG25 Arm Cortex-M33 SoC targets Wi-SUN FAN networks
Silicon Labs announced various new products at its annual Works With Developer Conference including the FG25 Arm Cortex-M33 SoC designed for sub-GHz Wi-SUN FAN networks for Smart Cities and applications such as smart metering, street lighting, electricity distribution automation, municipal infrastructure, and more. The microcontroller runs at up to 97.5 MHz, features 512KB RAM and up to 1920 KB flash, operates at up to 125°C, consumes as little as 2.6 μA in deep sleep mode, and can offer a range of up to 3 km when used in combination with the new EFF01x front-end module delivering up to +30 dBm output power. Silicon Labs FG25 (EFR32FG25) specifications: CPU core – Arm Cortex-M33 core @ 97.5 MHz with DSP instruction and floating-point unit for signal processing Memory – Up to 512 kB RAM data memory Storage – Up to 1920 kB flash program memory Radio Sub-GHz radio operation TX power up […]
u-blox XPLR-IOT-1 explorer kit embeds cellular IoT, Wi-Fi, BLE, GNSS, and sensors for IoT evaluation
u-blox XPLR-IOT-1 explorer kit is an all-in-one IoT evaluation platform with cellular IoT, Wi-Fi, Bluetooth Low Energy, and GNSS, plus some sensors to evaluate various IoT products and enable proofs of concepts such as logistics container trackers, industrial automation, sensor-to-cloud applications, and fleet management solutions. The device’s main module is the u-blox NORA-B106 with a dual-core Arm Cortex M33 microcontroller and Bluetooth LE 5.2 radio that host the application software and control the other modules, namely the SARA-R510S module for LTE-M and NB-IoT cellular connectivity, NINA-W156 2.4 GHz Wi-Fi module, and the MAX-M10S GNNS module. The XPLR-IOT-1 platform is also equipped with an accelerometer, a gyroscope, a magnetometer, and temperature, humidity, pressure, and ambient light sensors. u-blox XPLR-IOT-1 specifications: Main MCU – Nordic Semi nRF5340 dual-core Arm Cortex M33 @ 128/64 MHz with 512 + 64 kB RAM memory and 1024 + 256 kB flash (found in NORA-B106 module) Wireless […]
NXP i.MX RT1180 Cortex-M7/M33 crossover MCU integrates GbE TSN for industrial IoT communication
NXP i.MX RT1180 is the latest member of the company’s i.MX RT Series crossover MCUss with application processor-like performance. The 800 MHz dual-core Arm Cortex-M7/M33 microcontroller is specifically designed for industrial IoT communication with a Gigabit Ethernet port supporting time-sensitive networking (TSN). NXP also highlights that it is the first crossover MCU to include an EdgeLock secure enclave that “eases the complexity of implementing robust, system-wide security intelligence for industrial IoT applications”, and the new processor aims to bridge the gap between existing industrial systems and Industry 4.0 system. NXP i.MX RT1180 key features and specifications: CPUs – Arm Cortex-M7 @ 800 MHz + Arm Cortex-M33 @ 240 MHz (Optional: single-core Arm Cortex-M33) On-chip Memory – Up to 1.5 MB SRAM (ECC protected) with 512 KB of TCM for Cortex-M7 and 256 KB of TCM for Cortex-M33 Memory & Storage I/F – 2x FlexSPI for HyperRAM or HyperFlash 8/16/32-bit SDRAM/LPSDRAM […]
NXP i.MX 93 processor combines Cortex-A55 cores with Ethos U65 microNPU
NXP has unveiled the i.MX 93 processor family comprised of i.MX 935x, 933x, 932x, and 931x parts at this time with up to two Cortex-A55 cores, one Arm Cortex-M33 real-time core, as well as an Ethos U65 microNPU for machine learning (ML). We wrote about i.MX 9 family back in March with NXP telling us it would include an Arm Ethos U-65 microNPU and EdgeLock secure enclave, be manufactured with a 16/12nm FinFET class process, and includes the “Energy Flex” architecture to optimize power consumption by turning on/off specific blocks in the processor. The NXP i.MX 93 is the first family leveraging those new features, and we know have some more details. NXP i.MX 93 processor specifications: CPU 1x or 2x Arm Cortex-A55 @ 1.7 GHz with 32KB I-cache, 32KB D-cache, 64KB L2 cache, 256KB L3 cache with ECC 1x Arm Cortex-M33 @ 250 MHz low power microcontroller with 256KB […]
NXP i.MX RT500 Cortex-M33 Crossover MCU integrates DSP, 2D GPU for wearables and IoT devices
NXP i.MX RT500 is the second Cortex-M33 Crossover MCU following the NXP i.MX RT600 Series announced in 2018, and optimized for low-power HMI applications such as wearables and Smart Home & IoT devices. NXP Crossover MCUs are typically clocked at 600 MHz or more, but NXP i.MX RT500 Cortex-M33 is limited to 200 MHz, and combined with 200 MHz Tensilica Fusion F1 DSP as well as a 2D GPU, and power optimizations that enable long battery life of up to 40 days on a charge for wearables like smartwatches. NXP i.MX RT500 key features and specifications: MCU Core – Cortex-M33 @ up to 200 MHz with Arm TrustZone, M33 built-in Memory Protection Unit (MPU), PowerQuad hardware accelerator for DSP functions, CASPER crypto coprocessor for asymmetric cryptographic algorithms DSP Core – Cadence Tensilica Fusion F1 DSP @ up to 200 MHz On-Chip Memory Up to 5 MB of system SRAM accessible […]
$2 MXCHIP EMC3080 WiFi and Bluetooth LE IoT module integrates Cortex-M33 MCU
While nowadays most people from the maker community are working with ESP8266 or ESP32 modules or boards for IoT projects requiring Bluetooth LE and/or WiFi connectivity, we’ve also covered some low-cost alternatives such as Bouffalo Labs BL602 or Realtek RTL8710. MXCHIP EMC3080 module offers yet an alternative with 2.4 GHz 802.11 b/g/n WiFi and Bluetooth LE 4.2/5.0. Where it differentiates against other solutions is that it features a more secure Cortex-M33 core clocked at 100 MHz, as found in UNISOC V5663 and Ameba RTL8722DM wireless SoCs, but still getting a fairly low price tag of $2.35 on Seeed Studio, which drops to $2.10 per pieces for orders of 10 or more units. MXCHIP EMC3080 module specifications: MCU – MX1300CF Cortex-M33 processor at up to 100 MHz with 256KB SRAM, 2MB XIP flash, 384 or 512 bytes OTP memory Connectivity WiFi 802.11 b/g/n 1T1R WiFi @ 2.4GHz Single Frequency HT20 support […]
Infineon AIROC CYW5557x WiFI 6/6E targets IoT and streaming devices
WiFi 6E is a new wireless standard that operates in the 6 GHz frequency band. We’ve already seen it used in consumer products such as premium smartphones and routers, as well as some embedded SBCs that take Qualcomm WiFI 6E cards. But now Infineon, who purchased Cypress Semiconductors last year, has unveiled the AIROC CYW5557x family of WiFI 6/6E chipsets designed for the IoT, enterprise and industrial applications for the 1×1 models, and for multimedia, consumer and automotive applications with 2×2 MIMO. Infineon AIROC CYW5557x has three SKUs that share most of the same specifications: Devices CYW55573 with Wi-Fi 6E, 2×2 MIMO CYW55572: with Wi-Fi 6, 2×2 MIMO CYW55571 with Wi-Fi 6E, 1×1 (80MHz) Wireless features WiFI Arm Cortex-R4 core Wi-Fi 6/6E, Tri-band (2.4/5/6 GHz) OFDMA, MU-MIMO, TWT, DCM 2×2 MIMO or 1×1 SISO 20/40/80 MHz channels, 1024-QAM, up to 1.2 Gbps PHY data rate STA and Soft AP mode […]