ADLINK has launched ROScube Pico SBC designed for robotics projects and powered by either an Intel Atom x5 Apollo Lake processor or a Rockchip PX30 Arm Cortex-A35 processor via their SMARC-compliant system-on-modules namely LEC-AL and as LEC-PX30. Both models run Ubuntu and ROS/ROS-2 operating systems simultaneously, and the company also provides NeuronBot robotics development and demo kit based on the SBC. ROScube Pico SBC and Devkit If ROScube Pico looks similar it’s because it appears to be based entirely on ADLINK previously announced ADLINK Industrial-Pi (I-Pi) SMARC Development Kit based on Rockchip PX30, and Vizi-AI development starter kit based on Atom x5-E3940 SoC and Movidius Myriad X VPU. Those are the specifications listed for ROScube Pico: SMARC Module For ROScube Pico NPS-1 – LEC-AL with Intel Atom processor, Intel Movidius Myriad X AI accelerator, 8GB LPDDR4 RAM, 32GB eMMC For ROScube Pico NPS-4 – LEC-PX30 with Rockchip PX-30 quad-core Cortex-A35 […]
Ryzen Embedded SBC is Made for Real-time AI Vision, Conveyor Belt Tracking
Axiomtek just recently introduced CAPA13R AMD Ryzen Embedded V1605B/V1807B SBC in 3.5″ embedded SBC form factor, and the company is now back with another, larger Ryzen Embedded SBC: Axiomtek MIRU130. Why would they launch yet another Ryzne Embedded board two weeks later? Different applications. While CAPA13R targets various graphics-intensive applications ranging from medical imaging to smart digital signage, MIRU130 appears to be especially focused on real-time vision-based AI applications with PoE and USB ports for cameras, and integrated “real-time vision I/Os” such as trigger inputs, LED lighting controllers, camera trigger outputs and an encoder input designed for conveyor tracking. MIRU130 SBC specifications: SoC (One or the other) – AMD Ryzen Embedded V1807B or V1605B quad-core processor with Radeon Vega 8 graphics; V1807B: 35-54W TDP; V1605B: 12-25W TDP System Memory – 2x 240-pin DDR4-2400 SO-DIMM, up to 16GB RAM Storage 1x SATA-600 1x M.2 Key B (SATA, USB 2.0, PCIe x2 […]
iWave Systems i.MX8M Mini Devkit Targets Low-cost Facial Recognition Systems
iWave Systems i.MX8M Mini Board is a development platform based on an update versions of the company’s iW-RainboW-G34M-SM i.MX 8M Mini system-on-module and designed specifically for low-cost facial recognition systems thanks to NXP eIQ ML software, and MIPI display and camera. iWave Systems i.MX8M Mini (aka iW-RainboW-G34D) specifications: SoM SoC – NXP i.MX8M Mini Q/QL/D/DL/S/SL with up to 4x Cortex-A53 cores, 1x Cortex-M4F real-time core, Vivante 3D and 2D GPUs System Memory – 1GB LPDDR4 (Expandable up to 4GB) Storage – 8GB eMMC Flash (Expandable), optional 2MB QSPI Flash optional Micro SD slot Wireless – Dual-band 802.11a/b/g/n/ac WiFi 5 and Bluetooth 5.0. PMIC – BD71847AMWV i.MX8M SODIMM Carrier Board Storage – MicroSD slot Display I/F – MIPI DSI display connector Camera I/F – MIPI CSI camera connector Audio – Audio codec, 3.5mm Line In/Out jack Networking – Up to 2x Gigabit Ethernet ports (One is Optional) USB – 2x USB […]
4K Vision Edge Computing Platform Features Xilinx Zynq UltraScale+ ZU3EG MPSoC
Last year, MyIR Tech introduced MYD-CZU3EG development board powered by a Xilinx Zynq UltraScale+ ZU3EG MPSoC with Arm Cortex-A53 cores and FPGA fabric designed for applications such as cloud computing, machine vision, flight navigation, and other complex embedded applications. The company has now announced another Zynq Ultrascale+ ZU3EG based platform dedicated to machine vision. The VECP Starter Kit (Vision Edge Computing Platform) is comprised of MYD-CZU3EG-ISP development board fitted with the company’s MYC-CZU3EG Zynq UltraScale+ MPSoC CPU module, a fansink, and a SONY IMX334 4K camera sensor. MYD-CZU3EG-ISP development board specification: MYC-CZU3EG SoM MPSoC – Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E (ZU3EG, 784 Pin Package) MPSoC with quad-core Arm Cortex-A53 processor @ 1.2 GHz, dual-core Cortex-R5 processor @ 600 MHz, Arm Mali-400MP2 GPU, and 16nm FinFET+ FPGA fabric (154K logic cells, 7.6 Mb memory, 728 DSP slices) System Memory – 4GB DDR4 @ 2,400MHz Storage – 4GB eMMC Flash, 128MB QSPI Flash […]
Boardcon RK1808 SBC Targets Smart Audio & Computer Vision Applications
Rockchip RK1808 neural network processing unit was initially an IP Block inside RK3399Pro, but the company eventually launched RK1808 Cortex-A35 processor as a standalone solution now providing up to 3.0 TOPS for AI inferencing in modules, USB sticks, and development kits. Boardcon offers another option with EM1808, a Rockchip RK1808 SBC equipped with the processor. The board should be suitable for two main types of AI applications, namely smart audio applications thanks to four audio ports, speaker header, & an onboard 4-mic array, and computer vision with MIPI CSI & DSI interfaces. Boardcon EM1808 board is comprised of a baseboard and CPU module with the following overall specifications: SoC – Rockchip RK1808 dual Cortex-A35 processor up to 1.6GHz with 3.0 TOPS (for INT8) NPU, VPU supporting H.264 1080p60 decode, 1080p30 encode System Memory- 2GB LPDDR3 Storage – 8GB eMMC flash, MicroSD slot, M.2 NVMe SSD interface Display I/F – 26-pin […]
ADLink Launches Vizi-AI Development Starter Kit for Industrial Machine Vision & Artificial Intelligence
ADLINK has recently launched Vizi-AI development starter kit for industrial machine vision and artificial intelligence (AI) at the edge in collaboration with Intel and Arrow Electronics. Vizi-AI is comprised of a carrier board that looks to be the same as used in the company’s I-Pi SMARC development kit equipped with an Intel Movidius Myriad X VPU and combined with LEC-AL Intel Atom Apollo Lake SMARC computer module. Vizi-AI SBC Let’s have a look at the hardware features and specifications of Vizi-AI SBC (aka VIZI-AI LEC-AL-E3940-AI-4G-32G): SoC – Intel Atom x5-E3940 quad-core Apollo Lake-I processor @ up to 1.6 / 1.8 GHz (Turbo) with 12EU Intel HD Graphics 500; 9.5W TDP System Memory – 4GB LPDDR4 (Option up to 8GB) Storage – 1x MicroSD card slot AI Accelerator – Intel Movidius Myriad-X VPU (Vision Processing Unit) Video – 1x HDMI port, single-channel LVDS/eDP interface via flat cable Audio – On-carrier audio […]
Toradex AI Embedded Vision Starter Kit Leverages Amazon Web Services for AI and ML Applications
Toradex, Amazon Web Services (AWS), and NXP Semiconductors collaborated to create the AI Embedded Vision Starter Kit aiming to ease the development of cloud-connected computer vision and machine learning applications in industries such as industrial automation, agriculture, medical equipment, and many more. The AI Embedded Vision Starter Kit includes the following items: Toradex Apalis iMX8 System on Module (SoM) powered by NXP i.MX 8QuadMax applications processor Toradex Ixora Carrier Board Allied Vision Alvium 1500 industrial-grade MIPI CSI-2 camera All required cables and a 12VDC (30W) power supply Full software stack, including source code for running the device as well as for cloud deployment Extensive documentation 50 USD AWS credit The kit will help developers meet the must-have requirements of smart connected devices including secure connectivity, remote monitoring, OTA updates, maximum uptime & reliability, compact form factor, cost-optimized hardware, computer vision and machine learning algorithms optimized for low-power hardware, and more. […]
Rockchip RK3566, RK3588, RV1109 SoC’s Coming in 2020 based on Rockchip Processor Roadmap
Last year, Rockchip had a presentation in China where they highlighted their processor roadmap for 2020, and we learned about processors such as Rockhip RK3588 Cortex-A76/A55, RK3530 Cortex-A55 SoC’s, and RV1109 camera processor, but we had limited details about the processors at the time. CNX Software has now received a more detailed roadmap that reveals some of the specifications about the new processors, and some Rockchip products that people may not be aware of such as a 3D structured light module and a 4G module. Rockchip RK3566 Rockchip RK3530 is not shown in the roadmap, but there’s a similar RK3566 processor, so I assume the company just changed the name. Rockchip RK3566 specifications: CPU – Quad-core Arm Cortex-A55 @ 1.8GHz GPU – Arm Mali-G52 2EE NPU – 0.5 TOPS with support for INT8/ INT16 Multi-Media 8M ISP 2.0 with 3F HDR(Line-based/Frame-based/DCG) Support MIPI-CSI2,4-lane 1080p60 H.265, H.264 encoding 4K H.264/H.265/VP9 60fps […]