Intel Core “Tiger Lake” processors designed for ultra-thin laptops have just been officially launched together with some laptop announcements. But Tiger Lake processors will find their way into embedded applications as well, with Congatec announcing conga-TC570 COM Express Type 6 Compact module and conga-HPC/cTLU COM-HPC high-performance module both featuring Intel Tiger Lake-UP3 (12W to 25W TDP) processors. conga-TC570 Tiger Lake COM Express Module Specifications: SoC – Intel Core i3/i5/i7 Tiger Lake-UP3 processor with up to 96 EU Intel Iris Xe graphics; 12W-28W configurable TDP System Memory – Up to 2x SO-DIMM sockets for DDR4 memory modules up to 32 GB each with 3200 MT/s ECC and non-ECC supported Networking – Intel i225 Gigabit Ethernet controller with TSN support COM Express board-to-board connectors with 440 pins Video Output – HDMI 2.0/2.1, DP 1.4, MIPI D-PHY 2.1; up to 4x independent display unit (4x 4K or 2x 8K) Storage – 2x SATA […]