com-hpc News - Page 2 of 2 - CNX Software

July 26, 2022 by Jean-Luc Aufranc (CNXSoft) - No Comments

conga-HPC/uATX is a micro-ATX board for COM-HPC Client Type modules

congatec Micro-ATX Carrier Board for COM-HPC Client

congatec has just introduced the conga-HPC/uATX micro-ATX carrier board designed for COM-HPC Client modules size A, B, and C. The board is vendor independent since it is based on the COM-HPC and micro-ATX standards and designed for embedded long-term availability of at least seven years. That means the micro-ATX carrier board works congatec solutions such as the high-end conga-HPC/cALS COM-HPC Client Size C module with up to a 16-core Intel Core i9 Alder Lake-S processor or the more power-efficient conga-HPC/cALP COM-HPC Client Size A modules with Intel Celeron 7305E processor, as well as similar solutions from ADLINK Technology, Advantech, Portwell, and other vendors. conga-HPC-/uATX carrier board specifications: Compatible with COM-HPC Client Type Modules (Size A: 95 x 120mm, Size B: 120 x 120mm, and Size C: 160 x 120mm) with CPU and memory sockets Video Output 3x DP++ with 8.1 Gbps Re-driver 1x eDP (optional for LVDS) Audio HDA codec […]

March 2, 2022March 2, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

January 7, 2022 by Sponsored Post - No Comments

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

January 5, 2022February 18, 2023 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

September 16, 2021September 16, 2021 by Jean-Luc Aufranc (CNXSoft) - 15 Comments

ADLINK COM-HPC Ampere Altra 80-core Arm server module targets embedded applications

ADLINK has integrated Ampere Altra, an up to 80-core Armv8.2 server processor with up to 175W TDP, into a COM-HPC module designed for embedded applications, together with the AVA Developer Platform equipped with a 32-core processor and housed in an “ultra-silent liquid-cooled tower system”. Both the ADLINK COM-HPC Ampere Altra module and the developer kit are compliant with the just-announced Arm’s Scalable Open Architecture for Embedded Edge (SOAFEE), a “software initiative and reference implementation providing a cloud-native environment for embedded edge development”. ADLINK COM-HPC Ampere Altra COM-HPC Ampere Altra key features and specifications: SoC – Ampere Altra with 32x to 80x Armv8.2 Neoverse N1-based cores with up to 3.3 GHz frequency, up to 128 lanes of high-speed PCIe Gen4 and 8×72 ECC protected DDR4 3200 memory; TDP: 60 to 175 Watts depending on the number of cores System Memory – Up to 768GB DDR4 with 6x individual memory channels Networking […]

August 5, 2021December 22, 2021 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

August 4, 2021August 5, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

September 3, 2020August 5, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

Congatec Unveils COM Express & COM-HPC Tiger Lake Computers-on-Module

conga-TC570 Tiger Lake COM Express Module

Intel Core “Tiger Lake” processors designed for ultra-thin laptops have just been officially launched together with some laptop announcements. But Tiger Lake processors will find their way into embedded applications as well, with Congatec announcing conga-TC570 COM Express Type 6 Compact module and conga-HPC/cTLU COM-HPC high-performance module both featuring Intel Tiger Lake-UP3 (12W to 25W TDP) processors. conga-TC570 Tiger Lake COM Express Module Specifications: SoC – Intel Core i3/i5/i7 Tiger Lake-UP3 processor with up to 96 EU Intel Iris Xe graphics; 12W-28W configurable TDP System Memory – Up to 2x SO-DIMM sockets for DDR4 memory modules up to 32 GB each with 3200 MT/s ECC and non-ECC supported Networking – Intel i225 Gigabit Ethernet controller with TSN support COM Express board-to-board connectors with 440 pins Video Output – HDMI 2.0/2.1, DP 1.4, MIPI D-PHY 2.1; up to 4x independent display unit (4x 4K or 2x 8K) Storage – 2x SATA […]