com express News - Page 3 of 6 - CNX Software

January 3, 2023January 27, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]

March 2, 2022March 2, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

January 7, 2022 by Sponsored Post - No Comments

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

January 5, 2022February 18, 2023 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

December 31, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces. NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

November 18, 2021 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM Express Type 6 module supports up to 64GB ECC RAM, 2.5GbE, 4 displays, and more

Here’s another Tiger Lake UP3 COM Express module courtesy of AAEON with the COM-TGUC6 COM Express Compact Type 6 modules equipped with a choice of Celeron. Core i3/i5/i7 embedded processors from the 11th generation Tiger Lake family. The module supports up to 64 GB ECC RAM via two SO-DIMM sockets, 2.5 Gpbs Ethernet, up to four independent displays via LVDS, VGA, and 4K DDI interfaces, SATA storage, PCIe Gen 3 & Gen4, and more for industrial. medical, and military applications. COM-TGUC6 specifications: Tiger Lake UP3 SoC (one or the other) Intel Core i7-1185G7E/GRE quad-core/octa-thread processor @ 1.8/4.4 GHz with 12 MB cache, 96 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i7-1145G7E/GRE quad-core/octa-thread processor @ 1.5/4.1 GHz with 8 MB cache, 80 EU Intel Iris Xe graphics; TDP: 15W (Up to 28W) Intel Core i3-1115G4E/GRE dual-core/quad-thread processor @ 2.2/3.9 GHz with 6 MB cache, 48 EU […]

November 12, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

Portwell COM Express Tiger Lake-H module supports 2.5GbE, PCIe Gen 4, 8K, up to 64GB DDR4

Portwell PCOM-B657VGL COM Express TIger Lake-H

Portwell PCOM-B657VGL joins other COM Express and COM HPC modules based on Intel Tiger Lake-H Xeon, Core, and Celeron embeddded processors such as ADLINK Express-TL and Congatec conga-HPC/cTLH. Just like its competitors, the Portwell COM Express Type 6 Basic module offers 8K video output, PCIe x16 Gen 4, up to 64GB DDR4, USB 3.2 Gen 2, and 2.5GbE networking for a wide range of higher-end embedded applications such as industrial automation, medical equipment, graphics-intensive applications, and artificial intelligence. Portwell PCOM-B657VGL specifications: SoC (one or the other) General Embedded Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 16EU Intel UHD graphics, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 16EU Intel UHD graphics, 45/35W cTDP Intel Core i5-11500HE processor with 6 cores / 12 threads @ 2.6GHz (up to 4.1GHz in Turbo […]

August 5, 2021December 22, 2021 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]