Linux 6.2 release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.2 release

Linux 6.2 has just been released with Linus Torvalds making the announcement on LKML as usual: So here we are, right on (the extended) schedule, with 6.2 out. Nothing unexpected happened last week, with just a random selection of small fixes spread all over, with nothing really standing out. The shortlog is tiny and appended below, you can scroll through it if you’re bored. Wed have a couple of small things that Thorsten was tracking on the regression side, but I wasn’t going to apply any last-minute patches that weren’t actively pushed by maintainers, so they will have to show up for stable. Nothing seemed even remotely worth trying to delay things for. And this obviously means that the 6.3 merge window will open tomorrow, and I already have 30+ pull requests queued up, which I really appreciate. I like how people have started to take the whole “ready for […]

Snapdragon X75 modem brings 5G Advanced to smartphones, IoT, and FWA routers

Snapdragon X75 5G Advanced modem

Qualcomm Snapdragon X75 is the latest 5G Modem-RF System from the company bringing 5G Advanced connectivity to smartphones, PCs, industrial IoT, vehicles, and 5G Fixed Wireless Access (FWA) routers. 5G is getting more confusing than ever, as after just having launched a 5G NR-Light modem for smartwatches, industrial IoT, and XR glasses, Qualcomm introduced the first “5G Advanced” modem with the Snapdragon X75 targetting a wide range of applications that benefit from the improvements in speed, coverage, mobility, power efficiency, etc… made possible by the 5G NR Release 18. Snapdragon X75 key features and specifications: Cellular Technology –  5G NR, LTE, LAA, WCDMA, TD-SCDMA, GSM/ Edge, CBRS, Dynamic Spectrum Sharing (DSS), EN-DC, NR-DC, mmWave, sub-6 GHz 5G Spectrum – mmWave-sub6 aggregation, sub-6 carrier aggregation (FDD-TDD, FDD-FDD, TDD-TDD), FDD-TDD support for uplink-CA, Dynamic Spectrum Sharing (DSS) 5G Modes – FDD, TDD, SA (standalone), NSA (non-standalone) Up to 10CC aggregation in mmWave, […]

TI unveils ULC1001 ultrasonic lens cleaning chip for self-cleaning cameras

TI ULC1001 self cleaning camera

Texas Instruments (TI) has introduced the ULC1001 digital signal processor (DSP) ultrasonic lens cleaning (ULC) technology designed – when combined with DRV2901 piezo transducer driver – for self-cleaning camera systems to quickly detect and remove dirt, ice, and water using microscopic vibrations. Cameras used in the automotive, industrial, robotics, and smart farming industries may require cleaning from time to time and that usually means manual cleaning leading to potential downtime, higher maintenance cost, and so on. It could also be done through mechanical parts but that adds further complexity to the system, so instead, Texas Instruments ULC1001 and DRV2901 combo enables cameras to rapidly self-clear contaminants using vibrations to eliminate debris. The datasheet describes the ULC1001 as a “Configurable Ultrasonic PWM Modulator With I/V Sense Amplifiers” with the following specifications: Integrated Programmable Cleaning Modes Water (expelling) Deice (melting and expelling) Mud (dehydrating and expelling) Auto-Cleaning (detecting and expelling) Custom Cleaning […]

Qualcomm Snapdragon Satellite enables two-way messaging using the Iridium network

Snapdragon Satellite

You may soon be able to get true global coverage even in remote areas thanks to Qualcomm Snapdragon Satellite which will offer pole-to-pole coverage and two-way messaging for emergency use, SMS texting, and other messaging applications. Qualcomm made this possible through a partnership with Iridium to bring satellite-based connectivity to next-generation premium Android smartphones starting with devices based on Snapdragon 8 Gen 2 Mobile Platform, while emergency messaging support was done in collaboration with Garmin. You’ll just need to point your phone to the sky to send and/or receive messages, and the connection should take place within a few seconds. Note it can only be used for text, and the bandwitdh would not be sufficient for audio, pictures, and videos. The solution relies on Snapdragon 5G Modem-RF Systems such as the Snapdragon X70 modem to connect to the Iridium low-earth orbit satellite constellation using the L-band spectrum (1 to 2 […]

NXP i.MX 95 processor features Cortex-A55, Cortex-M33, and Cortex-M7 cores, eIQ Neutron NPU

NXP i.MX 95 CPU

NXP i.MX 95 is an upcoming Arm processor family for automotive, industrial, and IoT applications with up to six Cortex-A55 application cores, a Cortex-M33 safety core, a Cortex-M7 real-time core, and NXP eIQ Neutron Neural Network Accelerator (NPU). We’re just only starting to see NXP i.MX 93 modules from companies like iWave Systems and Forlinx, but NXP is already working on its second i.MX 9 processor family with the i.MX 95 application processor family equipped with a higher number of Cortex-A55 cores, an Arm Mali 3D GPU, NXP SafeAssure functional safety, 10GbE, support for TSN, and the company’s eIQ Neutron Neural Processing Unit (NPU) to enable machine learning applications. NXP i.MX 95 specifications: CPU Up to 6x Arm Cortex-A55 cores with 32KB I-cache, 32KB D-cache, 64KB L2 cache, 512KB L3 cache with ECC 1x Arm Corex-M7 real-time core with 32KB I-cache, 32KB D-cache, 512KB TCM with ECC 1x Arm Cortex-M33 […]

Geniatech DS-3566 digital signage board is powered by a Rockchip RK3566 SoC

Geniatech DS-3566

Geniatech DS-3566 is a board based on Rockchip RK3566 designed for digital signage applications with a low-profile, multiple video interfaces such as HDMI, LVDS, eDP, and MIPI DSI, and plenty of headers and connectors for expansion. The single board computer ships with up to 8GB RAM, 128GB eMMC flash, and supports Gigabit Ethernet, WiFi 5, Bluetooth 4.1, as well as cellular connectivity as an option. Some of the interfaces available through connectors include RS232, RS485, CAN Bus, I2C, SPI, etc… Geniatech DS-3566 specifications: SoC – Rockchip RK3566 quad-core Arm Cortex-A55 processor @ 1.8 GHz with Arm Mali-G52 EE GPU, 0.8 TOPS NPU System Memory – 2GB to 8GB LPDDR4 Storage – 16GB to 128GB eMMC flash, MicroSD card slot Video Interfaces 1x HDMI 2.1 up to 4Kp60 1x LVDS header and backlight header 1x eDP header and backlight header 1x 4-lane MIPI DSI connector Camera – 1x 4-lane MIPI CSI […]

Linux 6.1 LTS release – Main changes, Arm, RISC-V and MIPS architectures

Linux 6.1 LTS

Linus Torvalds announced the release of Linux 6.1, likely to be an LTS kernel, last Sunday: So here we are, a week late, but last week was nice and slow, and I’m much happier about the state of 6.1 than I was a couple of weeks ago when things didn’t seem to be slowing down. Of course, that means that now we have the merge window from hell, just before the holidays, with me having some pre-holiday travel coming up too. So while delaying things for a week was the right thing to do, it does make the timing for the 6.2 merge window awkward. That said, I’m happy to report that people seem to have taken that to heart, and I already have two dozen pull requests pending for tomorrow in my inbox. And hopefully I’ll get another batch overnight, so that I can try to really get as […]

Lattice Avant mid-range FPGA platform features up to 500K logic cells, 25 Gbps SERDES, Hard PCIe Gen4

Lattice Avant

Lattice Avant is a new low-power and small form factor mid-range FPGA platform, manufactured with a 16nm FinFET process, and equipped with 25 Gb/s SERDES, hardened PCI Express, external memory PHY interfaces, a high DSP count, and a security engine. Lattice Semi is better known for its entry-level FPGAs such as the iCE40 which is popular in the community thanks to low-cost hardware and support for open-source tools, but the Avant platform marks the company’s entry into the mid-range FPGA market, defined by chips with 100k to 500k logic cells (LCs). Lattice Avant highlights: FPGA fabric – 200K to 500K logic cells up to 350 MHz DSP – 700 to 1,8000 18×18 multipliers @ up to 650 MHz to support the latest AI algorithms Memory 14-36 Mbit embedded memory up to 650 MHz DDR3L/DDR4/LPDDR4 and DDR5 support I/Os 4x to 28x 25 Gbps multi-protocol SERDES Hard PCIe Gen4 200 to […]

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