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January 28, 2021January 29, 2021 by Jean-Luc Aufranc (CNXSoft) - 20 Comments

Cluster Server R2 2U rack cluster server ships with up to 72 Rockchip RK3399/RK3328 SoMs

Rockchip RK3399 and RK3328 are typically used in Chromebooks, single board computers, TV boxes, and all sort of AIoT devices, but if you ever wanted to create a cluster based on those processor, Firefly Cluster Server R2 leverages the company’s RK3399, RK3328, or even RK1808 NPU SoM to bring 72 modules to a 2U rack cluster server enclosure, for a total of up to 432 Arm Cortex-A72/A53 cores, 288 GB RAM, and two 3.5-inch hard drives. Firefly Cluster Server R2 specifications: Supported Modules Core-3399-JD4 with Rockchip RK3399 hexa-core Cortex-A72/A53 processor up to 1.5 GHz, up to 4GB RAM, and optional on-board 2.8 TOPS NPU (Gyrfalcon Lightspeeur SPR5801S) Core-3328-JD4 with Rockchip RK3328 quad-core Cortex-A53 processor up to 1.5 GHz, up to 4GB RAM Core-1808-JD4 with Rockchip RK1808 dual-core Cortex-A35 processor @ 1.6 GHz with integrated 3.0 TOPS NPU, up to 4GB RAM Configuration – Up to 9x blade nodes with 8x […]

January 28, 2021May 13, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Arduino Portenta H7 Gets Embedded Vision Shield with Ethernet or LoRa Connectivity

[Update January 28, 2021: The LoRa version of Portenta Vision Shield is now available] Announced last January at CES 2020, Arduino Portenta H7 is the first board part industrial-grade “Arduino Pro” Portenta family. The Arduino MKR-sized MCU board has plenty of processing power thanks to STMicro STM32H7 dual-core Arm Cortex-M7/M4 microcontroller. It was launched with a baseboard providing access to all I/Os and ports like Ethernet, USB, CAN bus, mPCIe socket (USB), etc… But as AI moves to the very edge, it makes perfect sense for Arduino to launch Portenta Vision Shield with a low-power camera, two microphones, and a choice of wired (Ethernet) or wireless (LoRA) connectivity for machine learning applications. Portenta Vision Shield key features and specifications: Storage – MicroSD card socket Camera – Himax HM-01B0 camera module with 324 x 324 active pixel resolution with support for QVGA Image sensor – High sensitivity 3.6μ BrightSense pixel technology […]

January 26, 2021January 26, 2021 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Rockchip RV1109 SBC’s provide access control solutions with optional 4G LTE connectivity

We’ve been writing about Rockchip RV1109 and RV1126 AI camera SoC’s in recent days, as well as evaluation boards and modules, plus some complete solutions such as Firefly dual-lens AI camera modules. Shenzhen-based JWIPC, a company specifically in embedded PCs and motherboards, has designed three SBC’s powered by Rockchip RV1109 processor especially designed for access control, leverage the face detection capabilities of the Rockchip processor. The three access control boards are: R19S – Standard 100x72mm Pico-ITX board with industrial grade materials, support for wide temperature, hardware watchdog, and “rich peripheral interface”. R19F- Same as R19S, but with a mini PCIe socket for a 4G LTE module, plus a SIM card slot R19N – Similar to R19S with a narrower 100x60mm design JWIPC R19 boards share most of the same hardware key features and specifications: SoC – Rockchip RV1109 dual-core Arm Cortex-A7 @ 1.5 GHz, plus RISC-V MCU @ 400 MHz, […]

January 25, 2021January 25, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Firefly dual-lens AI camera module comes with Rockchip RV1109 or RV1126 processor

We’ve very recently written about Rockchip RV1126 quad-core Cortex-A7 processor designed AI cameras thanks to a 2.0 TOPS AI accelerator together with its little dual-core brother: RV1109. We’ve also found some RV1109 and RV1126 evaluation boards, but prices were in the hundreds of dollars. It was then brought to our attention than the upcoming MAIX-III board would feature RV1126 at a more affordable cost, but it turns out there’s no need to wait as Firefly has just launched a dual-lens AI camera module based on either Rockchip RV1109 or RV1126 for under $100 with respectively CAM-C1109S2U and CAM-C1126S2U models. Both version of the modules have the same specifications except for the processor: SoC (one or the other) RV1109 SoC with CPU – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU – 1.2 TOPS with support for INT8/ INT16 VPU Encoder […]

January 22, 2021February 16, 2025 by Jean-Luc Aufranc (CNXSoft) - 19 Comments

Rockchip RV1126 AI Camera SoC features 2.0 TOPS NPU, promises 250ms fast boot

The Rockchip Developer Conference that took place at the end of November 2020 allowed us to learn more about RK3588, RK3566, and RK3568 64-bit Arm processors for AIoT applications. But the company also presented additional details about camera SoC’s, namely the dual-core RV1109 and quad-core RV1126, equipped with a 1.2 TOPS and 2.0 TOPS respectively, and both capable of delivering a 250ms fast boot. Rockchip RV1109 and RV1126 share many of the same specifications: CPU RV1109 – Dual-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz RV1126 – Quad-core Arm Cortex-A7 @ 1.5 GHz + RISC-V MCU @ 400 MHz GPU – 2D graphics engine NPU RV1109 – 1.2 TOPS with support for INT8/ INT16 RV1126 – 2.0 TOPS with support for INT8/ INT16 Memory – 32-bit DDR3/DDR3L/LPDDR2/LPDDR3/DDR4/LPDDR4 up to 4GB RAM Storage – eMMC 4.51, Serial SPI NOR Flash or NAND flash with fast booting support, […]

January 22, 2021June 22, 2022 by Abhishek Jadhav - No Comments

Zora P1 Amlogic A311D Development Board interfaces with Orbbec 3D Cameras

We have already seen the powerful Amlogic A311D powered Khadas VIM3 SBC, and Orbbec announced the Zora P1 development board for Orbbec 3D cameras, supporting robotics, gaming, smart homes, etc. Some of the other products showcased at the CES 2021 by Orbbec include its first 3D sensor with time-of-flight (TOF) technology, the latest Astra+ camera, and a real-time industrial 3D camera. “Innovations in 3D imaging, combined with broader advances like 5G, artificial intelligence, and ultra-fast processors, are transforming the application landscape for designers and engineers,” said David Chen, co-founder, and director of engineering at Orbbec. “Our new camera with time-of-flight (TOF) technology is a great example. Its high resolution and tracking capabilities make it perfect for all kinds of products including fall detection, security, even at-home yoga and exercise products.” Orbbec’s Zora P1 Development Board Zora P1 is a processing board for developers and enthusiasts to integrate 3D imaging and associated computing tasks for demanding industrial applications. Orbbec has specially designed this long-lasting solution to work with its 3D […]

January 20, 2021April 3, 2023 by Saumitra Jagdale - 7 Comments

Renesas RZ/G2L MPUs Feature Cortex-A55 & Cortex-M33 Cores for AI Applications

Renesas Electronics Corporation announced RZ/G2L MPUs, allowing enhanced processing for an extensive variety of AI applications. The RZ/G2L group of 64-bit MPUs includes three new MPU models featuring Arm Cortex-A55, and an optional Cortex-M33 core. These are RZ/G2L, RZ/G2LC, and RZ/G2UL MPUs. The Cortex-A55 CPU core typically delivers approximately 20 percent improved processing performance compared with the previous Cortex-A53 core, and according to Renesas, is around six times faster in “essential processing for AI applications”. The company already has four mid to high-end design level MPUs including RZ/G2E, RZ/G2N, RZ/G2M, and RZ/G2H, with combinations of Cortex-A53 and Cortex-A57 cores. The new RZ/G2L group of three MPUs forms the entry-level design with Cortex-A55. Hence, the seven MPU models together provide scalability from entry-level to high-end design. Common Key Features in RZ/G2L, RZ/G2LC, and RZ/G2UL MPUs Up to 2x Cortex-A55 cores Cortex-M33 core Camera interface (MIPI-CSI) Display interface (Parallel-IF) USB 2.0 interface […]

January 19, 2021January 19, 2021 by Saumitra Jagdale - No Comments

MicroMod modular ecosystem offers M.2 microcontrollers cards and carrier boards

MicroMod is a modular interface ecosystem for quick embedded development and prototyping. MicroMod comes with two components, that is a microcontroller “processor board” and a carrier board. PC industry’s M.2 connector is the interface between these two components. The carrier boards are for the usage of various peripherals and the processor board act as the brain of the application system. MicroMod processor board has a dimension of 22×22 mm that can be easily fitted on the carrier boards. Although, the original M.2 standard was dedicated to swapping out peripherals where a user could swap one component with the other one. The MicroMod standard is for swapping out microcontrollers according to the functional and application requirements. MicroMod Processor Boards Artemis Processor Board comes with an Ambiq Apollo 3 Blue Arm Cortex-M4F with BLE 5.0 running up to 96MHz and a power rating of less than 5mW. It also supports the TensorFlow […]