ASROCK Industrial launches NUC(S) Ultra 200 (Intel Arrow Lake-H) and 4X4 AI300 (AMD Ryzen 300 AI) motherboards and BOX PCs

ASROCK Industrial NUC Ultra 200 BOX PC Motherboard

Following new SoC announcements by Intel and AMD at CES 2025, ASRock Industrial has launched the NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series powered by Intel Core Ultra 200H Arrow Lake-H processors with of to 99 TOPS of AI inferencing power, and the 4X4 BOX AI300 Series and 4X4 AI300 Motherboard Series based on  AMD Ryzen AI 300 processors with up to 50 TOPS of NPU performance. ASROCK NUC(S) Ultra 200 BOX PCs & NUC ULTRA 200 motherboards NUC(S) Ultra 200 specifications: Arrow Lake-H/U SoC (one or the other) Intel Core Ultra 7 255H (6P+8E) processor up to 5.1 GHz with 24MB cache, Intel Arc 140T GPU (74 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 Watts Intel Core Ultra 5 225H (4P+8E) processor up to 4.9 GHz with 18MB cache, Intel Arc 130T GPU (63 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 […]

Sonata v1.0 RISC-V platform combines AMD Artix-7 FPGA and Raspberry Pi RP2040 MCU, features CHERIoT technology for secure embedded systems

Sonata v1.0 CHERIoT embedded system

lowRISC has released Sonata v1.0, a stable platform developed under the Sunburst project. Designed for embedded systems engineers, Sonata supports CHERIoT technology, enabling features like compartmentalization and enhanced memory safety. It provides a reliable foundation for building secure embedded systems. CHERIoT is a security-focused technology built on lowRISC’s RISC-V Ibex core, based on CHERI research from the University of Cambridge and SRI International. It addresses memory safety issues like buffer overflows and use-after-free errors using CHERI’s capability-based architecture. The CHERIoT capability format includes permissions for memory access, object types for compartmentalization, and bounds to restrict accessible memory regions. These features enable scalable and efficient compartmentalization, making it suitable for securely running untrusted software in embedded systems. Sonata v1.0 leverages this architecture to isolate components like network stacks and kernels within the CHERIoT RTOS. The lowRISC Sonata v1.0 specifications: FPGA – AMD Xilinx Artix-7 (XC7A35T-1CSG324C) CPU – AMD MicroBlaze soft-core based on […]

SignalSDR Pro is a high-performance software-defined radio (SDR) in Raspberry Pi form factor (Crowdfunding)

Raspberry Pi SDR board with AMD Zync 7020 SoC FPGA

The SignalSDR Pro is a Raspberry Pi-sized SDR that brings a credit-card-sized twist to software-defined radios (SDRs). It is a compact, streamlined device suitable for tasks ranging “from signal processing and spectrum analysis to communication systems and beyond.” The SignalSDR Pro builds on the Analog Devices AD9361 radio transceiver and the AMD Zync 7020 SoC into a credit-card format reminiscent of Raspberry Pi single-board computers. The Raspberry Pi-sized SDR also features a 40-pin GPIO header for expansion with other hardware components and added functionality. The device offers a 70MHz – 6GHz tuning range, 12-bit sample rate, 61.44MHz RF bandwidth, and two full-duplex TX/RX channels via four I-PEX antenna connectors. It is also capable of emulating other SDR hardware such as the ADALM-PLUTO and USRP B210, making it easier to integrate into pre-existing workflows. The SignalSDR Pro is a mid-range alternative to entry-level SDR options such as the AntSDR E200, KrakenSDR, […]

AMD Versal RF Series adaptive SoCs target 6G wireless, aerospace, and electronics test equipment

AMD Versal RF Series adaptive SoC

AMD Versal RF series adaptive system-on-chips (SoCs) combines Arm Cortex-A72 and Cortex-R5F hard cores with FPGA fabric and direct radio frequency (RF)-sampling data converters for pre-6G systems, wireless 6G testers, aerospace and defense applications like radars, and electronics test equipment such as multi-channel testers, oscilloscopes, and wideband spectrum analyzers. Built upon the Xilinx Zynq RFSoC devices, the AMD Versal RF Series supports wideband-spectrum with high-resolution thanks to up to sixteen 18 GHz, 14-bit RF ADCs with up to 32 GSPS and sixteen 14-bit RFV DACs up to 16 GSPS, and delivers 80 TOPS of DSP performance in a size, weight, and power (SWaP)-optimized design. The chips also integrate hard IP such as DDR5 memory controllers, 600 Gbps Ethernet, PCIe Gen5 x4, and various high-speed transceivers. AMD Versal RF Series adaptive SoCs key features and specifications: Processing System Application Processing Unit (APU) – Dual-core Arm Cortex-A72 with 48 KB/32 KB L1 […]

Vulkan 1.4 3D graphics and compute API released

Vulkan 1.4

The Khronos Group has just announced the release of Vulkan 1.4 cross-platform 3D graphics and compute API. The new release makes some of the optional extensions and features mandatory, adds streaming transfers, and supports 8K rendering on up to eight targets. Minimum hardware limits have also been increased including at least seven maxBoundDescriptorSets and eight maxColorAttachments. Vulkan 1.4 highlights: Streaming Transfers: new implementation requirements to ensure applications can stream large quantities of data to a device while simultaneously rendering at full performance. Previously optional extensions and features critical to emerging high-performance applications are now mandatory in Vulkan 1.4, ensuring availability across multiple platforms. These include push descriptors, dynamic rendering local reads, and scalar block layouts. Maintenance extensions up to and including VK_KHR_maintenance6 are now part of the core Vulkan 1.4 specification. 8K rendering with up to eight separate render targets is now guaranteed to be supported, along with several other […]

AMD Versal Premium Gen2 SoC FPGA family features Arm Cortex-A72/R5F cores, high-end FPGA fabric, PCIe Gen6, CXL 3.1 interfaces

AMD Versal Premium Series Gen 2 SoC FPGA combines dual-core Cortex-A72 and dual-core Cortex-R5F processors with high-end FPGA fabric with up to 3.2 million logic cells and CXL 3.1 (Compute Express Link), PCIe Gen6, and DDR5/LPDDR5X high-bandwidth interfaces for data center, communication equipment, test & measurement, and aerospace & defense data-intensive applications. AMD Versal Premium Gen2 specifications: CPU cores Dual-core Arm Cortex-A72 application core, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC Memory – 256MB on-chip with ECC FPGA fabric System Logic Cells – Up to 3,273,480 LUTs – Up to 1,496,448 DSP Engines – Up to 7,616 Interfaces connected to CPU cores 2x Ethernet 2x UART, 2x SPI, 2x I2C 2x CAN-FD 1x USB 2.0 FPGA memory, interfaces, I/Os, and transceivers Up to 327 Mbit memory @ 273 […]

Vecow EVS-3000 AI computing systems combine 14th Gen Intel Core CPUs and MXM Graphics for Edge AI applications

EVS 3000

Vecow has introduced the EVS-3000 series, a new line of AI computing systems powered by Intel Core i9/i7/i5/i3 (14th Gen) processors with embedded MXM graphics. These systems deliver high computing power, come with multiple PCIe slots for expansion, and support remote monitoring making them ideal for edge AI applications such as autonomous robotics, public security, and machine vision. The EVS-3000 series includes both fan and fanless models: EVS-3100, EVS-3200, EVS-3300, EVS-3400 without fans, and EVS-3100(F), EVS-3200(F), EVS-3300(F), EVS-3400(F) with fans. All systems are powered by Intel R680E chipsets and feature compact NVIDIA or AMD MXM graphics, with support for 2.5GbE LAN, Out-of-Band (OOB) management, and multiple PCIe Gen 4 slots. These systems deliver high performance for AI computing at the edge for applications such as machine vision and robotics. As you may know, we’ve previously covered several Vecow AI computing systems, including the TGS-1000 Series, SPC-9000 fanless embedded system, ECX-3200, […]

ASRock IMB-A8000 industrial Ryzen Embedded 8000 mini-ITX motherboard takes up to 96GB DDR5 RAM

ASRockI MB A8000 Mini ITX Industrial Motherboard

ASRock Industrial recently launched the IMB-A8000, an industrial and embedded motherboard in a mini-ITX form factor. As an embedded motherboard, it is powered by AMD Ryzen Embedded 8000 series APU which features 8 cores and 16 threads, built with 4nm technology, and including a 16 TOPS AI accelerator. The motherboard supports up to 96GB of dual-channel DDR5-5600MHz memory and includes one 2.5GbE LAN port and one GbE LAN port. With a wide temperature range of -20ºC to 70ºC this motherboard can be used in applications like manufacturing, robotics, machine vision, and more. Previously we have seen SolidRun introduce the Bedrock R8000 industrial PC built around the Ryzen Embedded 8000 APU family. Other than that we have written about other Ryzen Embedded mini-ITX motherboards/SBCs such as the Flex Logic InferX Hawk combining an AMD Ryzen Embedded R2314 SoC with AI accelerators, the DFI RNO171 with Ryzen Embedded V2000 family, or more […]

EmbeddedTS embedded systems design