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April 3, 2023April 3, 2023 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Pocket AI – A portable NVIDIA RTX A500 eGPU for AI developers, embedded & industrial applications

We’ve previously seen it’s possible to connect an eGPU to a mini PC through a PCIe x16 to M.2 NVMe adapter or a Thunderbolt 3 port, but while it’s fine to install on your desk for gaming or develop AI applications, the eGPU being larger than most mini PCs, it’s a little too big to integrate into products, and potentially inconvenient to carry around. ADLINK Pocket AI portable eGPU changes that with an NVIDIA RTX A500 GPU housed in a 106 x 72 x 25mm box that’s about the size of a typical power bank and connects to a host through a Thunderbolt 3 connector. The company says the upcoming eGPU is mostly designed for AI developers, professional graphics users, and embedded industrial applications, but can also be for gaming. Pocket AI specifications: GPU – NVIDIA RTX 500 Architecture – NVIDIA Ampere GA107 Base clock: 435 MHz Boost clock: 1335 […]

February 18, 2023February 18, 2023 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

IoT Prototype Kit is powered by an Alder Lake-H COM Express module with up to Core i5-12600HE CPU

IoT Prototype Kit Intel Alder Lake-P module

ADLINK has launched an IP-i IoT Prototype Kit based on their Express-ADP COM Express Type 6 Basic “Alder Lake-H” module with either an Intel Core i5-12600HE 12-core (4P+8E) processor clocked at up to 4.5 GHz or a Core i3-12300HE 8-core (4P+4E) processor reaching up to 4.3 GHz. The kit also includes the Express-BASE6 R3.1 carrier board, a thick heatsink with an active fan, a debug board (DB30 x86), and various cables for SATA storage, a DB9 COM port, and I/Os, and the kit can be used to develop applications for industrial automation and control, medical ultrasound, image processing and analysis, high-speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, etc… The Express-ADP module supports up to 64GB DDR5 memory, optional on-module NVMe storage, up to 4x 4K displays, multiple PCIe Gen4 and Gen3 interfaces, SATA 3.0, and so on. You’ll find detailed Express-ADP COM Express module specifications in […]

January 3, 2023January 27, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM Express & COM-HPC modules features Intel 13th gen Raptor Lake embedded processors

ADLINK has just announced the Express-RLP COM Express Type 6 and COM-HPC-cRLS COM-HPC size C modules based on the new Intel 13th generation Raptor Lake hybrid processors with Embedded and Industrial SKUs. The Express-RLP comes with an up to 14 cores, 20 threads Raptor Lake-P processor, 64GB DDR5 SO-DIMM, and PCIe Gen4, while the COM-HPC-cRLS offers up to a 24-core Rasptor Lake-S embedded processor, 128GB DDR5 SO-DIMM, PCIe Gen5, and 2x 2.5GbE LAN. Both modules support Intel TCC, and Time Sensitive Networking (TSN), and are suitable for hard real-time computing workloads required by applications such as industrial automation, autonomous driving, AI robots, and aviation. Express-RLP Raptor Lake-P COM Express module Specifications: Raptor Lake-P SoC (one of the other) Intel Core i7-13800HRE 6P+8E cores/20 threads processor @ up to 2.5 GHz with 24MB cache, Intel Iris Xe graphics; TDP: 45W (cTDP: 35W) Intel Core i7-1370PRE 6P+8E cores/20 threads processor @ up […]

November 18, 2022November 18, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

NVIDIA Jetson Nano based AI camera devkit enables rapid computer vision prototyping

ADLINK “AI Camera Dev Kit” is a pocket-sized NVIDIA Jetson Nano devkit with an 8MP image sensor, industrial digital inputs & outputs, and designed for rapid AI vision prototyping. The kit also features a Gigabit Ethernet port, a USB-C port for power, data, and video output up to 1080p30, a microSD card with Linux (Ubuntu 18.04), and a micro USB port to flash the firmware. As we’ll see further below it also comes with drivers and software to quickly get started with AI-accelerated computer vision applications. AI Camera Dev Kit specifications: System-on-Module – NVIDIA Jetson Nano with CPU – Quad-core Arm Cortex-A57 processor GPU – NVIDIA Maxwell architecture with 128 NVIDIA cores System Memory – 4 GB 64-bit LPDDR4 Storage – 16 GB eMMC Storage – MicroSD card socket ADLINK NEON-series camera module Sony IMX179 color sensor with rolling shutter Resolution – 8MP (3280 x 2464) Frame Rate (fps) – […]

April 7, 2022 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Arm SystemReady SR-certified Ampere Altra Developer Platform launched for $3,999

ADLINK has just announced the availability of the Arm SystemReady SR-certified Ampere Altra Developer Platform equipped with the company’s COM-HPC Ampere Altra module with 32 to 80 64-bit Arm Neoverse N1 cores, 32GB to 128GB RAM. An adaptation to the earlier AVA Developer Platform expected to sell for $5,450, the Ampere Altra Developer Platform got a price cut to $3,999 at launch for a system with a 32-core processor, and 32GB DDR4. The system targets software developers wanting to build cloud-to-edge applications using standardized Arm hardware. Ampere Altra Developer Platform specifications: SoM – COM-HPC Ampere Altra module with Ampere Altra 32 to 80-core 64-bit Arm Neoverse N1 processor up to 1.7/2.2/2.6 GHz (32/64/80 cores, TPD: 60W to 175W), 32 GB to 128GB DDR4 ECC memory Storage – 128 GB NVMe M.2 SSD Mainboard – COM-HPC Server Base carrier board Video – VGA port Audio – 3.5mm audio jack Networking 1x […]

March 2, 2022March 2, 2022 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

January 5, 2022February 18, 2023 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

December 3, 2021June 11, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK LEC-RB5 – A Qualcomm QRB5165 SMARC module designed for drones and robots

ADLINK Technology LEC-RB5 is a SMARC compliant system-on-module powered by the Qualcomm QRB5165 octa-core Cortex-A77 class processor which we’ve already seen in Qualcomm Flight RB5 high-end drone reference design and Lantronix Open-Q 5165RB system-on-module designed for robotics applications. The LEC-RB5 SMARC module ships with up to 8GB PoP LPDDR4 memory, 256GB UFS storage, provides on-device artificial intelligence capabilities (up to 15 TOPS), support for up to 6 cameras, and low power consumption. The main target applications are high-end robots and drones in the consumer, enterprise, defense, industrial, and logistics sectors. LEC-RB5 SMARC SoM specifications: SoC – Qualcomm QRB5165 octa-core Kryo 585 processor with a Kryo Gold Prime @ 2.84 GHz, 3x 3 Kryo Gold @ 2.42 GHz, 4x Kryo Silver @ 1.81 GHz, Adreno 650 GPU @ up to 587 MHz, Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9, video encode HW acceleration for […]