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Posted on by Debashis Das - No Comments on ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

ADLINK AVA-1000 is a rugged EN50155-compliant T2G gateway for railway and industrial applications

ADLINK AVA 1000 T2G gateway top view

The ADLINK AVA-1000 T2G gateway is a rugged, EN50155-compliant T2G (Train-to-Ground) gateway designed for railway and industrial environments. Powered by a choice of NXP i.MX8M Plus Quad Cortex-A53 processor or an Intel Processor N50 Alder Lake-N processor. The i.MX8M Plus model is equipped with up to 8GB LPDDR4 and a 64GB eMMC flash whereas the Alder Lake variant features up to 4GB LPDDR5 memory and a 32GB eMMC flash. In terms of connectivity, the gateway features three M12 GbE ports and supports a wide range of options including 5G, WiFi 6, and GNSS. The AVA-1000 T2G gateway’s fanless design, wide operating temperature range, and 24-110V DC input ensure reliable operation in industrial environments. Additionally, its compliance with EN50155 and other industrial standards makes it ideal for various industrial applications. AVA-1000 T2G gateway specifications System Processor (multiple options) NXP i.MX8M Plus quad-core Cortex-A53 processor @ up to 1.8 GHz with Cortex-M7 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK SBC35-ALN 3.5-inch Intel N97 SBC features SBC-FM expansion connector with PCIe, USB, SMBus

ADLINK SBC35-ALN 3.5-inch Intel N97 SBC features SBC-FM expansion connector with PCIe, USB, SMBus

ADLINK SBC35-ALN 3.5-inch Intel N97 SBC

ADLINK SBC35-ALN is a 3.5-inch Intel N97 SBC with up to 16GB DDR5, an M.2 socket for M.2 storage, and a custom SBC-FM expansion connector with PCIe Gen3 x1, USB 2.0, and SMBus interfaces. The 3.5-inch board also features two gigabit Ethernet ports, three display interfaces with HDMI, DisplayPort, and LVDS or eDP, several USB ports and RS232/RS422/RS485 serial interfaces, 40-pin box headers, and M.2 E-Key and B-Key sockets for wireless expansion. ADLINK SBC35-ALN specifications: SoC – Intel Processor N97 quad-core Alder Lake-N processor @ up to 3.6 GHz with 6MB Cache, Intel UHD Graphics; 12W TDP System Memory – Up to 16GB DDR5 4800 MHz via SODIMM slot Storage 1x SATA III + SATA power connector 256 Mbit SPI flash for BIOS Display 1x DisplayPort 1.4 1x HDMI 2.0 through DP to HDMI Redriver LVDS/eDP (default: LVDS) Supports 3 independent displays Audio Realtek ALC888S audio codec 1x Line-in, 1x […]

Posted on by Sponsored Post - No Comments on High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

COM-HPC Mini Academy

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on NXP i.MX 95 SMARC 2.1 system-on-modules – ADLINK LEC-IMX95 and iWave iW-RainboW-G61M

NXP i.MX 95 SMARC 2.1 system-on-modules – ADLINK LEC-IMX95 and iWave iW-RainboW-G61M

SMARC 2.1 development board NXP i.MX95

Several companies have unveiled SMARC 2.1 compliant system-on-modules powered by the NXP i.MX 95 AI SoC, and today we’ll look at the ADLINK LEC-IMX95 and iWave Systems iW-RainboW-G61M and related development/evaluation kits. The NXP i.MX 95 SoC was first unveiled at CES 2023 with up to six Cortex-A55 application cores, a Cortex-M33 real-time core, and a low-power Cortex-M7 core, as well as an eIQ Neutron NPU for machine learning applications. Since then a few companies have unveiled evaluation kits and system-on-modules such as the Toradex Titan evaluation kit or the Variscite DART-MX95 SoM, but none of those were compliant with a SoM standard, but at least two SMARC 2.1 system-on-modules equipped with the NXP i.MX 95 processor have been introduced. ADLINK LEC-IMX95 Specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

Intel Amston Lake COM Express module

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93

ADLINK OSM-IMX93 is an OSM r1.1 Size-L module based on NXP i.MX 93 Arm Cortex-A55 & Cortex-M33 AI processor, and the first from the company to comply with the Open Standard Module (OSM) standard. The 45x45mm module is fitted with up to 2GB LPDDR4L, 128GB eMMC flash, an optional WiFi/Bluetooth module, and its 662 contacts provide a range of interfaces that include LVDS and DSI graphics output, 2x GbE (including 1x TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and more. ADLINK OSM-IMX93 specifications: SoC – NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System Memory – 1 or 2GB LPDDR4L Storage […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK MXA-200 5G IIoT gateway ships with Debian or Yocto Linux

ADLINK MXA-200 5G IIoT gateway ships with Debian or Yocto Linux

ADLINK MXA-200 5G industrial gateway

ADLINK MXA-200 is an NXP i.MX8M Plus-based 5G IIoT gateway running Debian or a Yocto-based Linux distribution with two RS-232/422/485 isolated serial ports, two gigabit Ethernet ports, two USB 3.0 port, and an operating temperature range of -20 to 70°C. The fanless gateway also features two M.2 slots for integrating Wi-Fi and/or 4G LTE or 5G modules, and ADLINK expected the MXA-200 to find its way into renewable energy applications, EV chargers, smart city and smart factory applications that require big data collection, cloud-based applications, and video related monitoring solutions. ADLINK MXA-200 specifications: SoC – NXP i.MX8M Plus CPU – Quad-core Arm Cortex-A53 processor @ 1.6/1.8GHz MCU – Arm Cortex-M7 real-time core @ 400 MHz GPU – Vivante GC520L 2D GPU, Vivante GC7000UL 3D GPU VPU – 1080p60 hardware decoder (HEVC, H.264, VP9, and VP8) and encode (H.265/H.264) AI accelerator – 2.3 TOPS NPU System Memory – 2GB or 4GB […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

COM Express Type 6 Compact module features 14th gen Intel Core Ultra “Meteor Lake” processor

Intel Core Ultra COM Express

ADLINK cExpress-MTL is a COM Express Type 6 Compact module based on the just-announced 14th gen Intel Core Ultra “Meteor Lake” processor family with up to fourteen CPU cores in 6P+8E configuration, eight Xe-cores (128 EUs), and an NPU (11pTOPS/8.2eTOPS) in a 15 or 28W TDP thermal configuration delivering up to 1.9x the GPU performance of the previous generation (Raptor Lake). The power consumption will also be lower thanks to Intel Core Ultra’s new Low-Power E-cores that are 30 to 50% more efficient than the E-cores in 13th gen Intel Core processors, and the faster GPU and built-in NPU will enable hardware-accelerated AV1 encoding/decoding and various devices leveraging AI such as portable medical ultrasound devices, industrial automation, autonomous driving, AI robots, and more. cExpress-MTL specifications: Meteor Lake-H/U SoC (one of the other) Intel Core Ultra 7 MS3 165H 16-core (6P+8E+2LPE) processor @ 1.4 / 5.0 GHz with 24MB cache, Intel […]

EmbeddedTS embedded systems design