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March 29, 2024March 31, 2024 by Jean-Luc Aufranc (CNXSoft) - 15 Comments

Orange Pi Developer Conference 2024, upcoming Orange Pi SBCs and products

Orange Pi held a Developer Conference on March 24, 2024, in Shenzhen, China, and while I could not make it, the company provided photos of the event where people discussed upcoming boards and products, as well as software support for the Orange Pi SBCs. So I’ll go through some of the photos to check out what was discussed and what’s coming. While Orange Pi is mostly known for its development boards the company has also been working on consumer products including the Orange Health Watch D Pro and the OrangePi Neo handheld console. The Orange Pi Watch D Pro is said to implement non-invasive blood glucose monitoring, blood pressure monitoring, one-click “micro-physical examination” and other functions to to help users monitor their health monitoring. The Watch D Pro uses a technique that emits a green light to measure glucose levels in the blood, and we’re told it’s accurate enough to […]

March 20, 2024March 20, 2024 by Debashis Das - 1 Comment

Trenz Electronic TE0950-03-EGBE21A – An AMD Versal AI Edge VE2302 SoC FPGA evaluation board

AMD Versal AI Edge Evalboard with VE2302 SoC

Trenz Electronic recently announced the TE0950-03-EGBE21A an evaluation board with AMD Versal AI Edge XCVE2302-1LSESFVA784 SoC FPGA. This board features 8 GB of DDR4 SDRAM and 128 MB of SPI Flash (as the primary boot option), a microSD card slot, a 32 GB eMMC flash (secondary boot), and an EEPROM with a MAC address. Additionally, the board supports a range of VE-series devices, such as VE2002, VE2102, VE2202, VE2302, and VM1102, enhancing its application versatility. The AMD Versal is a family of adaptive compute acceleration platforms (ACAPs) designed by AMD. Following its acquisition of Xilinx, it integrates CPU, GPU, and FPGA technologies along with dedicated software support to create a highly flexible development environment. Trenz Electronic VE2302 Evaluation Board Specifications: SoC – AMD Versal AI Edge XCVE2302-1LSESFVA784, A784 package, compatible with multiple VE-series devices RAM – 8 GB DDR4 SDRAM Storage 128 MB SPI Flash (primary boot option) MicroSD card […]

March 19, 2024March 18, 2024 by Tomisin Olujinmi - 12 Comments

TinyVision is a compact Allwinner V851S/V851S3-powered Linux board for vision-based applications

Unrelated to tinyVision.ai, the TinyVision development board is a computer vision board from Chinese developer YuzukiTsuru powered by either the Allwinner V851S or the V851S3 and is billed as an “ultimate all-in-one solution for Linux motherboards, IPCs, servers, routers, and more.” It packs features such as a Cortex-A7 core running at 1200MHz, a 2-channel MIPI CSI input, and an independent image signal processor (ISP) capable of a maximum resolution of 2560 x 1440 in a compact form factor. TinyVision specifications: Processor – Allwinner V851SE / V851s3 with Cortex-A7 core @ 1200MHz and RISC-V E907GC core @ 600MHz NPU: 0.5TOPS (tera operations per second) @ INT8 precision Memory – 64MB DDR2 (V851se), 128MB DDR3L (V851s3) Storage – MicroSD card slot (supports UHS-SDR104), onboard SD NAND via SPI Display – 2-lane MIPI DSI (1280 x 720 @ 60fps), RGB LCD (320 x 240 @ 60fps) Video Input ISP with a maximum resolution […]

March 18, 2024March 18, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

AAEON COM-RAPC6 and COM-ADNC6 COM Express modules feature Raptor Lake and Alder Lake-N CPUs

AAEON COM-ADNC6 Alder Lake-N COM Express module

AAEON has unveiled two COM Express Type 6 Compact Computer-on-Module families with the COM-RAPC6 designed for high performance with 13th generation Raptor Lake processors from the 15W Intel Processor U300E up to 45W Intel Core i7 SKUs, and the COM-ADNC6 optimized for efficiency with Alder Lake-N processors such as the Intel Core i3-N305 or Atom x7425E CPUs. COM-RAPC6 Raptor Lake COM Express CPU modules Specifications: 13th gen Raptor Lake SoC (one or the other) – Note frequencies shown as base frequencies Intel Core i7-13800HRE 14C/20T processor @ 2.5GHz with Intel Iris Xe Graphics; PBP: 45W Intel Core i7-13800HE 14C/20T processor @ 2.5GHz with Intel Iris Xe Graphics; PBP: 45W Intel Core i5-13600HE 12C/16T processor @ 2.7GHz with Intel UHD Graphics; PBP: 45W Intel Core i3-13300HE 8C/12T processor @ 2.1GHz with Intel UHD Graphics; PBP: 45W Intel Core i7-1370PE 14C/20T processor @ 1.9GHz with Intel UHD Graphics; PBP: 28W Intel Core […]

March 16, 2024March 16, 2024 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Firefly Core-3562JQ Rockchip RK3562J industrial SoM works in the -40 to +85°C temperature range

Firefly Core-3562JQ is a system-on-module based on Rockchip RK3562J SoC – the industrial-grade version of the Rockchip RK3562 quad-core Cortex-A53 Tablet SoC – designed to operate in the -40 to 85°C industrial temperature range and suitable for digital signage, industrial control systems, industrial PLCs, energy data concentrators, smart healthcare, self-service terminals, and more. The CPU module features up to 8GB RAM, 64GB flash, and a Rockchip RK809-5A PMIC, plus three 80-pin board-to-board connectors exposing video output and input interfaces, audio (SPDIF, PDM, I2S) interfaces, networking (GbE and Fast Ethernet), various USB interface, a 1-lane PCIe 2.1 interface, and more. Firefly Core-3562JQ specifications: SoC – Rockchip RK3562J CPU – Quad-core Arm Cortex-A53 processor @ up to 1.2 GHz (against 2.0 GHz for the Rockchip RK3562) GPU – Arm Mali-G52 EE with support for OpenGL ES 3.2, Vulkan 1.1, OpenCL 2.0 AI accelerator – None listed in the specs (Rockchip RK3562 comes […]

March 7, 2024March 6, 2024 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Allwinner T527 System-on-Module features octa-core Cortex-A55 CPU, 2 TOPS AI accelerator

MYiR MYC-LT527 is a compact System-on-Module (SoM) based on Allwinner T527 octa-core Arm Cortex-A55 SoC with a 2 TOPS AI accelerator, up to 4GB RAM, 32GB flash, and a land grid array (LGA) comprised of 381 pads with a range of interfaces for displays and cameras, networking, USB, and PCIe, and more. The company also introduced the MYD-LT527 development board to showcase the capabilities of the Allwinner T527 CPU module suitable for a range of applications such as industrial robots, energy and power management, medical equipment, display and controller machines, edge AI boxes and boards, automotive dashboards, and embedded devices that require media and AI functionalities. MYC-LT527 Allwinner T527 System-on-Module MYC-LT527 specifications: SoC – Allwinner T527 CPU Octa-core Arm Cortex-A55 processor with four cores @ 1.80 GHz and four cores @ 1.42GHz E906 RISC-V core up to 200 MHz DSP – 600MHz HIFI4 Audio DSP GPU – Arm Mali-G57 MC1 […]

February 26, 2024February 25, 2024 by Tomisin Olujinmi - 1 Comment

Particle’s M-series multi-radio devices connect anywhere with WiFi, cellular, NTN satellite, and LoRaWAN connectivity

Particle Industries Inc., an IoT Platform-as-a-Service company, has announced a new line of multi-radio boards and modules that offer multiple connectivity options in a single product. Particle is a complete edge-to-cloud IoT development platform that offers hardware products and software tools for creating IoT solutions. The company’s latest product, the M-series, has a bold tagline: connect anywhere. Although wireless connectivity has come a long way, there is no single wireless technology that works everywhere. Particle’s M-series aims to address that problem by bundling multiple radios – Wi-Fi, cellular, satellite, and LoRaWAN – into one product. Particle is looking to expand from its two primary wireless technologies: Wi-Fi and cellular, and add two more radios, satellite and LoRaWAN, for broader coverage. These two radios will cover devices in areas such as enclosed spaces (boiler rooms, elevator shafts, basements, and mines) and remote locations (methane sensors in oil and gas plants, boats, […]

January 15, 2024January 13, 2024 by Tomisin Olujinmi - 3 Comments

iW-RainboW-G58M is a compact module based on the Intel Agilex 5 SoC FPGA series

iW-RainboW-G58M Agilex 5 Dev Kit Top View

iWave Systems, an embedded systems solutions company based in India, has announced the launch of the iW-RainboW-G58M system-on-module (SoM). The module is based on Intel’s Agilex 5 SoC FPGA E-series family, a lineup of affordable, midrange FPGAs for intelligent edge and embedded applications. The Agilex 5 E-series is optimized to deliver better performance-per-watt than its predecessors at a smaller form factor. They feature an asymmetric applications processor system comprising two Arm Cortex-A76 cores and two Cortex-A55 cores for optimized performance and power efficiency. The Arm cores in the Agilex 5 SoC FGPA family are more powerful than the Cortex-A53 cores in the Intel Agilex 7 and 9 products, but those have faster high-speed interfaces and more logic elements. The Agilex 5 SoM is suitable for development in fields like wireless communications, video/broadcast, and industrial test and measurement sectors. The last iWave module we covered, the iW-RainboW-G55M, was based on a […]