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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on conga-SMX95 NXP i.MX 9596 SMARC 2.1 SoM supports M.2 1216 WiFi 6 and Bluetooth 5.3 modules

conga-SMX95 NXP i.MX 9596 SMARC 2.1 SoM supports M.2 1216 WiFi 6 and Bluetooth 5.3 modules

conga-SMX95 NXP i.MX9596 SoM M.2 1216 WiFi 6 module

We had already written about NXP i.MX 95 SMARC 2.1 system-on-modules from ADLINK, iWave Systems, Avnet, and Advantech, but congatec has now launched its own with the conga-SMX95 featuring the NXP i.MX 9596 hexa-core Arm Cortex-A55 AI processor and up to 16GB LPDDR5 memory. The conga-SMX95 also comes with up to 256GB flash, is available on both commercial and industrial temperature grade variants, and exposes most of the same interfaces as competing products. What might be different is that the conga-SMX95 is offered with an optional M.2 1216 WiFi 6 and Bluetooth 5.3 wireless module. We’ve seen M.2 1216 wireless modules before, and they don’t use any M.2 socket but are LGA packages that need to be soldered to the target board/module. conga-SMX95 specifications: SoC – NXP i.MX 9596 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz (industrial) or 2.0 GHz (commercial) with 32K I-cache and […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on Orange Pi CM5 – A Raspberry Pi CM4 alternative with up to 16GB RAM, 256GB eMMC flash

Orange Pi CM5 – A Raspberry Pi CM4 alternative with up to 16GB RAM, 256GB eMMC flash

Orange Pi CM5 Raspberry Pi CM4 alternative

Orange Pi CM5 is a system-on-module mostly compatible with the Raspberry Pi CM4 (and upcoming Raspberry Pi CM5?) powered by a Rockchip RK3588S octa-core Cortex-A76/A55 processor that supports up to 16GB LPDDR4 and 256GB eMMC flash compared to the Pi CM4 module that is limited to 8GB RAM and 32GB flash. Since the Rockchip RK3588S has more interfaces than the Broadcom BCM2711 found in the Raspberry Pi CM4, the company added an extra 100-pin board-to-board connector with extra interfaces such as native USB 3.0, SATA III, CAN Bus, and an additional PCIe 2.0 x1 interface for a total of two. Orange Pi CM5 specifications: SoC – Rockchip RK3588S octa-core processor with 4x CortexA76  cores @ up to 2.4GHz, 4x CortexA55 core @ 1.8GHz Arm Mali-G610 MP4 “Odin” GPU with support for OpenGL ES1.1/2.0/3.2, OpenCL 2.2 and Vulkan 1.2 Video decoder – 8Kp60 H.265, VP9, AVS2, 8Kp30 H.264 AVC/MVC, 4Kp60 AV1, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Allwinner T527 digital signage and Smart Display board offers HDMI, eDP, MIPI DSI, and LVDS display interfaces

Allwinner T527 digital signage and Smart Display board offers HDMI, eDP, MIPI DSI, and LVDS display interfaces

Allwinner T527 digital signage board

MYiR Tech’s MYD-LT527-SX is a board designed for digital signage and Smart Display applications based on the MYC-LT527 Allwinner T527 system-on-module from the company and offering a range of display interfaces namely HDMI, eDP, MIPI DSI and dual-channel LVDS. The digital signage board builds upon MYiR Tech’s MYD-LT527 development board with a larger design featuring many of the same ports (dual GbE, USB 3.0, audio jack, HDMI output), and plenty of connectors for expansion including additional USB 2.0 interfaces, speaker and microphone, RS232, RS485, CAN Bus, and more. MYiR Tech’s MYD-LT527-SX specifications: SoM – MYC-LT527 system-on-module with SoC – Allwinner T527 CPU Octa-core Arm Cortex-A55 processor with four cores @ 1.80 GHz and four cores @ 1.42GHz E906 RISC-V core up to 200 MHz DSP – 600MHz HIFI4 Audio DSP GPU – Arm Mali-G57 MC1 GPU System Memory – 2GB LPDDR4 Storage – 16GB eMMC flash, 32Kbit EEPROM 381-pad LGA […]

Posted on by Debashis Das - 3 Comments on Forlinx FET3562J-C SoM features Rockchip RK3562(J) SoC with 1 TOPS NPU, dual Ethernet, camera, display interfaces

Forlinx FET3562J-C SoM features Rockchip RK3562(J) SoC with 1 TOPS NPU, dual Ethernet, camera, display interfaces

Forlinx FET3562J-C SoM features

The Forlinx FET3562J-C is a Rockchip RK3562/RK3562J powered System-on-Module (SoM) built with a 22nm process and features four high-performance ARM Cortex-A53 cores running at up to 2GHz. It also can support up to 2GB LPDDR4 RAM and can be configured with up to 16GB eMMC storage. Additionally, it has 1 TOPS NPU and standard peripherals like Ethernet, Wifi, Bluetooth, LVDS, MIPI DSI, and much more. All these features make this SoM useful for IoT, automation, and consumer electronic applications. Previously, we have seen Forlinx launch similar SoM with development boards such as the Forlinx RZ/G2L, the FET-MX9352-C, the OK335xS-II and much more feel free to check those out if you are interested in the topic. Forlinx FET3562J-C SoM and carrier board specifications SoM Specifications SoC (one or the other) Rockchip RK3562J – ARM Cortex-A53 quad-core @ 1.8GHz Rockchip RK3562 ARM Cortex-A53 quad-core @ 2.0 GHz NPU – 1 TOPS INT8 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Sipeed Tang Mega 138K Dock is a lower-cost GOWIN GW5AST FPGA + RISC-V development board

Sipeed Tang Mega 138K Dock is a lower-cost GOWIN GW5AST FPGA + RISC-V development board

Sipeed Tang Mega 138K Dock

The Sipeed Tang Mega 138K Dock is a low-cost version of the Tang Mega 138K Pro development board launched last year with the GOWIN GW5AST FPGA + RISC-V SoC, two SPF+ cages, a PCIe 3.0 x4 interface, and DVI Rx and Tx ports. The new Tang Mega 138K Dock keeps a GW5AST FPGA SoC but with a 484-ball package that fits on a smaller system-on-module, and does without the SPF+ cages, replaces the PCIe 3.0 x4 interface with a PCIe 2.0 x4 interface, and only uses a single HDMI port for DVI Rx or Tx. Sipeed Tang Mega 138K system-on-module Let’s first have a look at the specifications of the SoM itself: SoC FPGA – GOWIN GW5AST-LV138FPG484A with 138,240 LUT4 1,080 Kb Shadow SRAM (SSRAM) 6,120 Kb Block SRAM (BSRAM) Number of BSRAM – 340 298x DSP slices 12x PLLs 16x global clocks 24x HCLK 8x transceivers at 270Mbps to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on AAEON uCOM-ADN SMARC SoM features Intel Processor N97, Core i3-N305, or Atom x7425E CPU

AAEON uCOM-ADN SMARC SoM features Intel Processor N97, Core i3-N305, or Atom x7425E CPU

Intel Alder Lake-N SMARC COM

AAEON uCOM-ADN is a SMARC-compliant system-on-module (SoM) based on an Intel Core i3-N305, Intel Atom x7425E, or Intel Processor N97 Alder Lake-N SoC and mainly designed for the digital signage and smart kiosk markets. The module is equipped with up to 8GB LPDDR5, up to 64GB eMMC flash, two 2.5GbE controllers, and offers a range of interfaces through a standard 314-pin MXM 3.0 connector such as SATA III, three PCIe Gen3 x1, DP++ and eDP video outputs, MIPI CSI camera input, and more. uCOM-ADN SMARC module specifications: Alder Lake N-series SoC (one or the other) Intel Atom x7425E quad-core processor up to 3.4 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.00 GHz; TDP: 12W Intel Processor N97 quad-core processor up to 3.6 GHz with 6MB cache, 24EU Intel UHD Graphics @ 1.20 GHz; TDP: 12W Intel Core i3-N305 octa-core processor up to 3.8 GHz with 6MB cache, 32EU […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 3 Comments on LattePanda Mu review – Part 1: an Intel N100 Compute Module tested with Windows 11, carrier boards with PCIe slots

LattePanda Mu review – Part 1: an Intel N100 Compute Module tested with Windows 11, carrier boards with PCIe slots

LattePanda Mu Full Carrier Windows 11 Review

Last April, DFRobot launched the LattePanda Mu x86 Compute Module powered by an Intel N100 Alder-Lake processor with 8GB RAM and a 64GB eMMC flash along with Lite and Full function carrier boards for evaluation. End customers will typically design their own carrier board without having to take of high-speed signals for the LPDDR5 memory and other complexities during the PCB layout. DFRobot has sent us the LattePanda Mu module for review along with the Lite and Full Function carrier boards, a heatsink for passive cooling, and an active cooler so we can compare both cooling solutions.  Let’s have a look at the LattePanda Mu module and accessories before testing the kit with the Windows 11 operating system, including the PCIe x4 slot. LattePanda Mu kit unboxing The parcel included three retail boxes. The smallest box housed the LattePanda Mu Compute Module, a heatsink, and an active cooler. The second […]

Posted on by Debashis Das - 7 Comments on NiCE5340 SoM packs Nordic nRF5340 MCU, Lattice iCE40 FPGA, and 11 sensors into a tiny 29x16mm form factor

NiCE5340 SoM packs Nordic nRF5340 MCU, Lattice iCE40 FPGA, and 11 sensors into a tiny 29x16mm form factor

Stefano Viola's NiCE5340 SoM

Stefano Viola’s NiCE5340 SoM is built around a Nordic Semi nRF5340 Bluetooth SoC, an iCE40 FPGA, 11 sensors, a battery charger, and various other peripherals in a 29×16 mm form factor. The nRF5340 used in the SoM is a low-power, dual-core Arm Cortex-M33 SoC with Bluetooth 5.4, Bluetooth LE (BLE), Thread, Zigbee, and other proprietary protocols. Meanwhile, the Lattice iCE40 FPGA features 3520 logic cells, 80 Kbits of embedded Block RAM, I2C, and SPI blocks, and many other features that make it suitable for applications like environmental monitoring, health tracking, and others. Previously, we have written about Unexpected Maker NANOS3, TinyS3, FeatherS3, and ProS3 boards, and ESP32-S3 4G dev board which all fall under the tiny and compact board category but this is the first time we have seen an MCU board with so many features built into a module of that size. Stefano Viola’s NiCE5340 SoM Specification ICs Nordic […]

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