som News - Page 17 of 78 - CNX Software

January 10, 2023January 10, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

MistySoM Renesas RZ/G2L or RZ/V2L SoM and devkit goes for $112 and up

MistySOM devkit Renesas RZ/G2L or RZ/V2L

We’ve previously written about several system-on-modules and SBCs based on Renesas RZ/G2L or RZ/V2L Cortex-A55/M33 processors such as Geniatech “AHAURA” RS-G2L100 and “AKITIO” RS-V2L100 single board computers, Forlinx FET-G2LD-C system-on-module, and SolidRun RZ/G2LC SOM and devkit. But most of those are hard to buy, and you need to contact the company, discuss your project, etc… before purchase, except for the SolidRun Renesas RZ/G2LC Evaluation Kit going for $249. Another option is the MistyWest MistySOM module offered for $112 and up on GroupGets with either Renesas RZ/G2L or RZ/V2L processor, as well as an optional carrier board. MistySOM system-on-module MistySOM-G2L (aka MW-G2L) and MistySOM-V2L (aka MW-V2L) specifications: SoC – Renesas RZ/G2L or RZ/V2L with dual-core Cortex-A55 processor @ 1.2 GHz, Arm Cortex-M33 core @ up to 200 MHz, Arm Mali-G31 GPU, and DRP-AI vision accelerator (RZ/V2L only) System Memory – 2GB LPDDR4/DDR4 Storage – 32GB eMMC flash 2x 120-pin high-speed mezzanine […]

January 5, 2023January 5, 2023 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Banana Pi BPI-CM4 Amlogic A311D system-on-module launched for $95

Banana Pi BPI-CM4 on Raspberry Pi CM4 IO board

Banana Pi BPI-CM4 system-on-module powered by an Amlogic A311D hexa-core Cortex-A73/A53 processor and compatible with the Raspberry Pi CM4 module has now been launched for $95 and up. Banana Pi introduced the Raspberry Pi CM4 compatible module with Amlogic A311D CPU last May with some 3D renders and specifications, and we expected a launch in Q4 2022 or Q1 2023 at the time. The Banana Pi BPI-CM4 is now available together with a carrier board so let’s have another look. Banana Pi BPI-CM4 specifications: SoC – Amlogic A311D hexa-core processor with 4x Arm Cortex-A73 @ 2.0 GHz and 2x Arm Cortex-A53, Arm Mali-G52 MP4 (6EE) GPU, 5 TOPS NPU System Memory – 4GB LPDDR4 RAM Storage – 16GB eMMC flash (up to 128GB) Networking Realtek RTL8211F Gigabit Ethernet PHY on-module Dual-band WiFi 5 up to 867Mbps and Bluetooth 5.2 via Realtek RTL8822CS module and 2x u.FL antenna connectors 2x 100-pin […]

January 4, 2023 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Forlinx FET-MX9352-C – An NXP i.MX 9352 system-on-module for industrial AIoT applications

Forlinx FET-MX9352-C is a system-on-module based on NXP i.MX 9352 dual Cortex-A55 processor with Cortex-M33 real-time core and a 0.5 TOPS AI accelerator that can be used for industrial control, IoT gateways, medical equipment, and various applications requiring machine learning acceleration. The FET-MX9352-C follows last week’s announcement of the iWave Systems iW-RainboW-G50M OSM module and SBC with a choice of NXP i.MX 93 processors. The Forlinx module comes with two board-to-board connectors instead of solderable pads and can be found in the OK-MX9352-C single board computer with dual GbE, various display and camera interfaces, RS485 and CAN Bus, etc… FET-MX9352-C i.MX 9352 system-on-module Specifications: SoC – NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7GHz (commercial) or 1.5 GHz (industrial), Cortex-M33 real-time core @ 250 MHz, 0.5 TOPS Arm Ethos U65 microNPU System Memory – 1GB/2GB LPDDR4 RAM Storage – 8GB eMMC flash 2x high-density 100-pin board-to-board […]

December 29, 2022 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Pico-ITX SBC features NXP i.MX 93 LGA system-on-module

iWave Sytems iW-RainboW-G50M is an NXP i.MX 93 OSM-L compliant LGA module with up to 2GB RAM, WiFi 5 and Bluetooth 5.2 module that is found in the company’s iW-RainboW-G50S Pico-ITX SBC designed for industrial applications. The NXP i.MX 93 single and dual-core Cortex-A55 processor with an Ethos U65 microNPU was announced in November 2021, but we had yet to see any hardware based on the new NXP i.MX 9 processor family. The iW-RainboW-G50M and iW-RainboW-G50S change that with a system-on-module and single board computer. iW-RainboW-G50M NXP i.MX 93 system-on-module Specifications: SoC (one or the other) NXP i.MX 9352 dual-core Cortex-A55 processor @ up to 1.7 GHz with Arm Cortex-M33 @ 250 MHz, 0.5 TOPS NPU NXP i.MX 9351 single-core Cortex-A55 processor @ up to 1.7 GHz with Arm Cortex-M33 @ 250 MHz, 0.5 TOPS NPU NXP i.MX 9332 dual-core Cortex-A55 processor @ up to 1.7 GHz Arm Cortex-M33 @ […]

December 14, 2022 by Jean-Luc Aufranc (CNXSoft) - 18 Comments

Sipeed LM4A – T-Head TH1520 RISC-V module to power Raspberry Pi 4 competitor and cluster board

Sipeed LM4A is a quad-core RISC-V system-on-module based on the T-Head TH1520 SoC found in the ROMA laptop and destinated to be found in a Raspberry Pi SBC competitor as well as a cluster board. The LM4A, which stands for Lichee Module 4 Model A, comes with 4GB to 16GB RAM, and up to 64GB flash, and connects to the carrier board through a 260-pin SO-DIMM connector. The TH1520 is one of the rare RISC-V SoCs with a 3D GPU, and the SBC based on LM4A has been shown to outperform the Raspberry Pi 4 in benchmarks as we’ll see below. Sipeed LM4A specifications: SoC – Alibaba T-Head TH1520 quad-core RISC-V Xuantie C910 (RV64GCV) processor @ 2.5 GHz, Xuantie C906 audio DSP @ 800 MHz, low power Xuantie E902 core, 50 GFLOPS Imagination 3D GPU, and 4 TOPS NPU System Memory – 4GB, 8GB, or 16GB RAM Storage – Optional […]

December 14, 2022 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Rockchip RK3588 system-on-module exposes 400 pins through high-density connectors

Rockchip RK3588 system -on-module with 400 pins

Forlinx FET3588-C is a relatively compact Rockchip RK3588 system-on-module measuring 68x50mm and exposing many of the processor’s I/Os through four 100-pin high-density connectors. The module ships with up to 8GB LPDDR4x and 64GB eMMC flash, and the company also provides the OK3588-C development board for evaluation with HDMI output and input, two MIPI DSI interfaces, five camera connectors, dual Gigabit Ethernet, M.2 sockets for WiFi and 4G/5G cellular connectivity, and more. Forlinx FET3588-C RK3588 system-on-module Specifications: SoC – Rockchip RK3588 octa-core processor with 4x Arm Cortex-A76 cores @ up to 2.4 GHz, 4x Arm Cortex-A55 cores, Arm Mali-G610 MP4 GPU with support for OpenGL ES3.2, OpenCL 2.2, Vulkan1.1, 6 TOPS NPU, 48MP ISP, 8Kp60 video decoding, 8Kp30 video encoding System Memory – 4GB or 8GB LPDDR4x (16GB planned) Storage – 32GB or 64GB eMMC 5.1 flash (128GB planned) Carrier board interface – 4x high-density 100-pin board-to-board connectors Storage – Up […]

December 13, 2022December 14, 2022 by Jean-Luc Aufranc (CNXSoft) - 10 Comments

Raspberry Pi availability improves, “unlimited supplies” expected by H2 2023

The Raspberry Pi SBCs have been in short supply for a couple of years, especially for individual buyers since Raspberry Pi Trading prioritizes commercial customers, but Eben Upton has just announced some good news with over 100,000 boards comprised of a mix of Raspberry Pi Zero W, Pi 3A+, and Raspberry Pi 4 2GB and 4GB variants being made available for single-unit sales through approved resellers. Eben however notes there’s more to do, and recommends buying from an approved reseller to get the boards at the recommended retail price (RRP), checking rpilocator to check for availability, and potentially considering switching to the Raspberry Pi Pico or Pico W if the project allows it as there’s plenty of stock for the MCU boards. Industrial and enterprise customers who still have issues can get in touch with the company by email using business <at> raspberrypi.com. But based on some feedback I received, […]

December 12, 2022May 28, 2024 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Credit card-sized COM-HPC Mini modules to support PCIe Gen4 and Gen5 interfaces

PICMG has announced that the COM-HPC Mini form factor’s pinout and dimensions definitions were finalized, with the tiny credit card-sized modules able to handle PCIe Gen4 and Gen5 interfaces, of course, depending on whether the selected CPU supports those. The COM-HPC “High-Performance Computing” form factor was created a few years ago due to the lack of interfaces on the COM Express form factor with “only” 440 pins and potential issues to handle PCIe Gen 4 clock speeds and throughputs. So far, we had COM-HPC Client Type modules from 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules with either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 70 mm) credit card-sized form factor to the COM-HPC standard. The way they cut the size of the COM-HPC Size A form factor by half […]