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Posted on by Leo Zachary - 3 Comments on MangoPi mCore-R818 module powers CyberPad 3.1-inch handheld android “tablet”

MangoPi mCore-R818 module powers CyberPad 3.1-inch handheld android “tablet”

CyberPad Components

mCore-R818 is the first time that MangoPi adopts the design combination of a core-lite module and a carrier board. As its name suggests, it is an AllWinner R818 SoM whose SoC integrates an Imagination PowerVR GE8300 GPU for UI rendering, can drive MIPI DSI, LVDS, and RGB displays, as well as cameras through a MIPI CSI interface, 8MP/5MP/2MP interfaces. The Allwinner R818 system-on-module powers a feature-rich carrier board as well as an upcoming Cyberpad Android “tablet” with a 3.1-inch display. MangoPi mCore-R818 The package design of the processor itself is small, so the MCore-R818 core board is only 3x3cm in size, but still contains four components with the Allwinner R818, the eMMC flash, LPDDR4 memory, and the AXP717 PMU. MangoPi provides two hardware configurations: 2GB DDR with 16GB eMMC flash, and 4GB DDR with 32GB eMMC flash. MCore-R818 Core Lite Specifications: SoC – Allwinner R818 CPU – Quad-core Arm Cortex-A53 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on SMARC 2.1 system-on-module is powered by an Intel Alder Lake-N Atom x7000E, Processor, or Core i3 processor

SMARC 2.1 system-on-module is powered by an Intel Alder Lake-N Atom x7000E, Processor, or Core i3 processor

TQEmbedded TQMxE41S Alder Lake-N system-on-module

TQ-Embedded TQMxE41S is a SMARC 2.1 system-on-module (SoM) powered by an Intel Alder Lake-N Atom x7000E, Processor Nxxx, or Core i3 processor with a TDP ranging from 6W to 15W TDP, up to 16GB LPDDR5-4800 memory and up to 256GB industrial iNAND eMMC flash. The Alder Lake-N system-on-module exposes two 2.5 Gigabit Ethernet, four PCIe, USB 3.2, and SATA through its 314-pin edge connector as per SMARC 2.1, while the 12th generation Intel UHD Graphics in the SoC supports AVX256 and advanced AI instruction sets (VNNI) making it suitable for fast AI inferencing and media transcoding. The company expects the module to be integrated into applications in healthcare, IoT, industry/robotics, retail, and video & conferencing. TQEmbedded TQMxE41S specifications: Alder Lake-N SoC (one or the other) Intel Core i3-N305 – 8C/8T, (1.8 – 3.8 GHz); 6 MB Smart Cache, 15W TDP or 9W cTDP, 32 EU, Intel UHD Graphics (up to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on iW-RainboW-G55M is an OSM-LF compliant module based on TI AM62A Cortex-A53 processor

iW-RainboW-G55M is an OSM-LF compliant module based on TI AM62A Cortex-A53 processor

TI AM62Ax OSM Module

iWave Systems iW-RainboW-G55M is an OSM Size L compliant system-on-module based on Texas Instruments AM62A single to quad-core Cortex-A53 processor with up to 8GB RAM, 128GB eMMC flash, and a wireless module with WiFi 6, Bluetooth 5.2, and 802.15.4 radios. The iW-RainboW-G55M can leverage the vision processing and deep learning accelerator and the Arm Cortex-R5F real-time cores for control and device management found in the AM62A processor, as well as its display and camera interfaces, peripheral and networking options, to develop products for “man-machine applications at the edge”. iW-RainboW-G55M SoM specifications: SoC – Texas Instruments AM62A SoC (AM62A3, AM62A3-Q1, AM62A7, or AM62A7-Q1) Application processor – Up to four Arm Cortex- A53 cores @ 1.4GHz Real-time cores 1x Cortex-R5F @ 800MHz (MPU Channel with FFI) 1x Cortex-R5F @ 800MHz to support Device Management C7xV-256 Deep Learning Accelerator up to 2 TOPS System Memory – 2GB (default) to 8GB LPDDR4 RAM Storage […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Xilinx Versal AI Edge System-on-Module

iWave Systems iW-Rainbow-G57M is a system-on-module (SoM) based on the AMD (Xilinx) Versal AI Edge series of Cortex-A72/R5 SoC FPGAs designed to deliver AI acceleration at relatively low power for demanding applications such as ADAS, robotics, and medical imaging. The module comes with up to 8GB 64-bit LPDDR4, 16GB eMMC Flash, 256MB QSPI Flash, delivers up to 45 TOPS of AI performance, and features eight transceivers that can be used for high-speed Ethernet, PCIe, MIPI DSI/CSI interfaces, and/or others as required by the customer’s specific project. iW-Rainbow-G57M specifications: FPGA SoC – AMD Xilinx Versal AI Edge/Prime SFVA784 package (VE2302, VE2202, VE2102,  or VE2002) with Dual Arm Cortex-A72 core processor @ up to 1.6 GHz Dual-core Arm Cortex-R5F Up to 328K Logic cells & 150K LUTs Programmable Network on Chip (NoC) Up to 45 TOPS (INT4) AI compute 8x GTYP Transceivers @ 28.21 Gbps (VE2302 & VE2202 only) Memory – Up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on $14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

Allwinner T113-S3 CPU module

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 4 Comments on Rongpin DR4-S905/DR4-A311D SoM features Amlogic S905D3 or A311D processor

Rongpin DR4-S905/DR4-A311D SoM features Amlogic S905D3 or A311D processor

DR4-A311D Amlogic A311D system-on-module

Shenzhen Rongpin Electronic Technology (Rongpin) DR4-S905 and DR4-A311D are SO-DIMM system-on-modules (SoM) respectively powered by Amlogic S905D3 quad-core Cortex-A55 processor and Amlogic A311D octa-core Cortex-A73/A53 processor. The modules come with 2GB LPDDR4 and 16GB eMMC flash by default, but can be ordered with up to 4GB RAM and 128GB storage, and the company offered a feature-rich carrier board to test all interfaces provided but the system-on-modules. DR4-S905 system-on-module specifications: SoC – Amlogic S905D3 quad-core Cortex-A55 processor @ 1.9GHz with Arm Mali-G31MP2 GPU up to 800MHz supporting OpenGL ES 3.2, Vulkan 1.0 and OpenCL 2.0, real-time Cortex-M4 core for always-on processing, and 1.2 TOPS NPU System Memory – 2GB LPDDR4 by default (1GB/4GB options) Storage – 16GB eMMC 5.1 flash by default (8GB, 32GB, 64GB, 128GB options) SO-DIMM edge connector for connection to a carrier board Power management – Discrete design Dimensions – 69.6 x 30mm Temperature Range – -25℃ to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 13 Comments on MediaTek Genio 1200 system-on-module powers Cortex-A78/A55 AIoT & robotics development kit

MediaTek Genio 1200 system-on-module powers Cortex-A78/A55 AIoT & robotics development kit

I-Pi SMARC 1200

ADLINK Technology’s SMARC 2.1 compliant LEC-MTK-I12000 system-on-module (SoM) features the MediaTek Genio 1200 octa-core Cortex-A78/A55 AIoT processor coupled with up to 8GB RAM and 256GB UFS storage, and powers the I-Pi SMARC 1200 development kit designed for robotics and AIoT applications. LEC-MTK-I1200 MediaTek Genio 1200 system-on-module LEC-MTK-I1200 SoM specifications: SoC – MediaTek Genio 1200 (MT8395) octa-core processor with 4x Cortex-A78 cores @ 2.2GHz, 4x Cortex-A55 cores @ 2.0GHz with penta-core Arm Mali-G57 GPU @ 880MHz with support for OpenGL ES 3.2/2.0/1.1, Vulkan 1.1/1.0, OpenCL 2.2, 5.0 TOPS NPU, HiFi 4 audio DSP, etc… System Memory – 4 or 8 GB LPDDR4X Storage – 32, 64, 128, or 256 GB UFS storage, compatible with UFS gear 2.1 Wireless – 802.11b/g/n/ac WiFi 5 2×2 MU-MIMO, Bluetooth 5.0 314-pin MXM connector with Storage – 1x SDIO (4-bit) compatible with SD/SDIO standard, up to version 3.0 Display HDMI 2.0b up to 4Kp60 Dual-channel LVDS […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 38 Comments on Lichee Pi 4A RISC-V SBC takes on Raspberry Pi 4 with TH1520 processor

Lichee Pi 4A RISC-V SBC takes on Raspberry Pi 4 with TH1520 processor

Lichee Pi 4A RISC V SBC

Lichee Pi 4A is a single board computer (SBC) powered by Alibaba T-Head TH1520 quad-core RISC-V Xuantie C910  processor @ 2.0 GHz with an Imagination GPU and a 4 TOPS NPU for AI that can compete against the Raspberry Pi 4 in terms of performance and features. We previously mentioned the Lichee Pi 4A (LPi4A) in our article about the Sipeed LM4A RISC-V system-on-module, but at the time we only had some benchmarks for the board and no photos and specifications about the SBC. Sipeed has now released photos, published detailed specifications, and is taking orders for the board. So let’s have a closer look. Lichee Pi 4A specifications against the ones for Raspberry Pi 4.   The TH1520 used to be advertised at up to 2.5 GHz, but it seems to have now come down to 2.0 GHz. Software support will include Debian, OpenWrt, and Android which should then […]

EmbeddedTS embedded systems design