som News - Page 12 of 78 - CNX Software

June 13, 2023June 14, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

NVIDIA Jetson AGX Orin Industrial offers ECC memory, extended temperature range, improved robustness

NVIDIA has recently introduced the Jetson AGX Orin Industrial module that comes with an extended temperature range, operating lifetime, shock and vibration specifications, as well as support for error correction code (ECC) memory, and delivers up to 248 TOPS of AI performance with power configurable between 15-75 W. The industrial-grade system-on-module is based on the Jetson AGX Orin 64GB module but with lower operating frequencies to enable a longer operating lifetime and improved endurance. It’s form-factor and pin-compatible with Jetson AGX Orin, and NVIDIA says it delivers more than eight times the AI performance of the 30 TOPS Jetson AGX Xavier Industrial introduced in 2021, but does not integrate Cortex-R5F cores. NVIDIA Jetson AGX Orin Industrial specifications: CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor @ 2.0 GHz with 2MB L2 + 4MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2,048 NVIDIA CUDA cores and 64 Tensor […]

June 13, 2023June 13, 2023 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

CompuLab UCM-iMX93 – A miniature NXP i.MX 93 module with WiFi 5 & Bluetooth 5.3

CompuLab UCM-iMX93 is a miniature system-on-module powered by the new NXP i.MX93 Cortex-A55 AI processor family with up to 2GB RAM and 64GB eMMC flash. The tiny 38x28mm features a Gigabit Ethernet PHY, a WiFi 5 and Bluetooth 5.3 wireless modules, and plenty of multimedia, communication, and peripheral interfaces through two 100-pin high-density connectors including display and camera interfaces, USB ports, CAN FD, and up to 79 GPIOs. UCM-iMX93 specifications: SoC – NXP i.MX9352 or i.MX9331 dual-core/single-core Arm Cortex-A55 @ 1.5 GHz (industrial) / 1.7 GHz (commercial) with Arm Cortex-M33 real-time core @ 250 MHz, Arm Ethos U65 microNPU System Memory – 512MB to 2GB LPDDR4 Storage – 8GB to 64GB eMMC flash Networking Gigabit Ethernet PHY Certified WiFi 5 (802.11ac) and Bluetooth 5.3 BLE module (NXP 88W8997) 2x 100-pin 0.4mm pitch high-density UCM connectors Display 4-lane MIPI-DSI up to 1920 x 1080 @ 60Hz 4-lane LVDS up to 1366 […]

June 12, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

Tiny STM32MP135 system-on-module comes with up to 512MB RAM, 256MB NAND flash or 4GB eMMC flash

MYiR Technology’s MYC-YF13X is a system-on-module powered by the latest STMicro STM32MP135 cost-optimized Cortex-A7 microprocessor with 256MB or 512MB DDR3L, 256MB NAND Flash or 4GB eMMC flash, and 32Kbit EEPROM. The new MYC-YF13X has the same 39x37mm stamp-size form factor as the company’s earlier MYC-YA15XC-T CPU module based on the STM32MP15 Cortex-A7 processor, and a development board is also provided with LCD and camera interfaces, dual Gigabit Ethernet, RS485/RS232/CAN bus interfaces, and more. MYC-YF13X specifications: SoC – STMicro STM32MP135 (STM32MP135DAF7) single-core Cortex-A7 processor up to @ 1 GHz Two configurations for memory and storage 256MB DDR3L, 256MB NAND Flash, 32KB EEPROM or 512MB DDR3L, 4GB eMMC Flash, 32KB EEPROM 148-pin stamp hole expansion interface (1.0mm pitch) Display I/F – RGB Interface Camera – Parallel camera Audio – 4x I2S, 2x SAI Networking – 2x RGMII interface USB – 2x USB 2.0 Up to 8x UART Up to 5x I2C Up […]

June 1, 2023May 31, 2023 by Leo Zachary - 3 Comments

MangoPi mCore-R818 module powers CyberPad 3.1-inch handheld android “tablet”

mCore-R818 is the first time that MangoPi adopts the design combination of a core-lite module and a carrier board. As its name suggests, it is an AllWinner R818 SoM whose SoC integrates an Imagination PowerVR GE8300 GPU for UI rendering, can drive MIPI DSI, LVDS, and RGB displays, as well as cameras through a MIPI CSI interface, 8MP/5MP/2MP interfaces. The Allwinner R818 system-on-module powers a feature-rich carrier board as well as an upcoming Cyberpad Android “tablet” with a 3.1-inch display. MangoPi mCore-R818 The package design of the processor itself is small, so the MCore-R818 core board is only 3x3cm in size, but still contains four components with the Allwinner R818, the eMMC flash, LPDDR4 memory, and the AXP717 PMU. MangoPi provides two hardware configurations: 2GB DDR with 16GB eMMC flash, and 4GB DDR with 32GB eMMC flash. MCore-R818 Core Lite Specifications: SoC – Allwinner R818 CPU – Quad-core Arm Cortex-A53 […]

May 26, 2023May 26, 2023 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

SMARC 2.1 system-on-module is powered by an Intel Alder Lake-N Atom x7000E, Processor, or Core i3 processor

TQEmbedded TQMxE41S Alder Lake-N system-on-module

TQ-Embedded TQMxE41S is a SMARC 2.1 system-on-module (SoM) powered by an Intel Alder Lake-N Atom x7000E, Processor Nxxx, or Core i3 processor with a TDP ranging from 6W to 15W TDP, up to 16GB LPDDR5-4800 memory and up to 256GB industrial iNAND eMMC flash. The Alder Lake-N system-on-module exposes two 2.5 Gigabit Ethernet, four PCIe, USB 3.2, and SATA through its 314-pin edge connector as per SMARC 2.1, while the 12th generation Intel UHD Graphics in the SoC supports AVX256 and advanced AI instruction sets (VNNI) making it suitable for fast AI inferencing and media transcoding. The company expects the module to be integrated into applications in healthcare, IoT, industry/robotics, retail, and video & conferencing. TQEmbedded TQMxE41S specifications: Alder Lake-N SoC (one or the other) Intel Core i3-N305 – 8C/8T, (1.8 – 3.8 GHz); 6 MB Smart Cache, 15W TDP or 9W cTDP, 32 EU, Intel UHD Graphics (up to […]

May 25, 2023May 24, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

iW-RainboW-G55M is an OSM-LF compliant module based on TI AM62A Cortex-A53 processor

iWave Systems iW-RainboW-G55M is an OSM Size L compliant system-on-module based on Texas Instruments AM62A single to quad-core Cortex-A53 processor with up to 8GB RAM, 128GB eMMC flash, and a wireless module with WiFi 6, Bluetooth 5.2, and 802.15.4 radios. The iW-RainboW-G55M can leverage the vision processing and deep learning accelerator and the Arm Cortex-R5F real-time cores for control and device management found in the AM62A processor, as well as its display and camera interfaces, peripheral and networking options, to develop products for “man-machine applications at the edge”. iW-RainboW-G55M SoM specifications: SoC – Texas Instruments AM62A SoC (AM62A3, AM62A3-Q1, AM62A7, or AM62A7-Q1) Application processor – Up to four Arm Cortex- A53 cores @ 1.4GHz Real-time cores 1x Cortex-R5F @ 800MHz (MPU Channel with FFI) 1x Cortex-R5F @ 800MHz to support Device Management C7xV-256 Deep Learning Accelerator up to 2 TOPS System Memory – 2GB (default) to 8GB LPDDR4 RAM Storage […]

May 12, 2023May 12, 2023 by Jean-Luc Aufranc (CNXSoft) - No Comments

AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Xilinx Versal AI Edge System-on-Module

iWave Systems iW-Rainbow-G57M is a system-on-module (SoM) based on the AMD (Xilinx) Versal AI Edge series of Cortex-A72/R5 SoC FPGAs designed to deliver AI acceleration at relatively low power for demanding applications such as ADAS, robotics, and medical imaging. The module comes with up to 8GB 64-bit LPDDR4, 16GB eMMC Flash, 256MB QSPI Flash, delivers up to 45 TOPS of AI performance, and features eight transceivers that can be used for high-speed Ethernet, PCIe, MIPI DSI/CSI interfaces, and/or others as required by the customer’s specific project. iW-Rainbow-G57M specifications: FPGA SoC – AMD Xilinx Versal AI Edge/Prime SFVA784 package (VE2302, VE2202, VE2102, or VE2002) with Dual Arm Cortex-A72 core processor @ up to 1.6 GHz Dual-core Arm Cortex-R5F Up to 328K Logic cells & 150K LUTs Programmable Network on Chip (NoC) Up to 45 TOPS (INT4) AI compute 8x GTYP Transceivers @ 28.21 Gbps (VE2302 & VE2202 only) Memory – Up […]

May 11, 2023 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

$14+ Allwinner T113-S3 CPU module comes with 128MB RAM, 256MB NAND flash or 4GB eMMC flash

MYiR MYC-YT113X is a low-cost solderable CPU module powered by an Allwinner T113-S3 dual-core Cortex-A7 processor with 128MB on-chip DDR3 RAM, and fitted with either a 256MB NAND flash or a 4GB eMMC flash for storage. The industrial temperature grade module provides a lower-end alternative to the company’s earlier MYC-YT507H Allwinner T507-H Cortex-A53 CPU module, and offers various display, camera, audio, Ethernet, USB, and low-speed I/Os through a 140-pin stamp hole design. It is designed for HMI, industrial automation, as well as display and control terminals. MYiR MYC-YT113X specifications: SoC – Allwinner T113-S3 CPU – Dual-core Arm Cortex-A7 @ 1.2 GHz with 32 KB L1 I-cache + 32 KB L1 D-cache per core, and 256 KB L2 cache DSP – Single-core HiFi4 VPU – H.265/H.264 video decoding up to 1080p60 and JPEG/MJPEG video encoding up to 1080p60 Memory – 128 MB DDR3 Storage – 4GB eMMC or 256MB NAND flash, […]