ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]
Boardcon SBC3576 – A feature-rich Rockchip RK3576 SBC with HDMI, mini DP, dual GbE, WiFi 6, optional 5G/4G LTE module, and more
Boardcon SBC3576 is a feature-rich single board computer (SBC) based on the MINI3576 system-on-module powered by a Rockchip RK3576 AI SoC and equipped with two 100-pin and one 44-pin board-to-board connectors for interfacing with the carrier board. The carrier board is equipped with up to 8GB RAM, 128GB eMMC flash, two gigabit Ethernet ports, a WiFi 6 and Bluetooth 5.3 module, 4K-capable HDMI 2.1 and mini DP video outputs, a mini HDMI input port, a USB 3.0 Type-A port, RS485 and CAN Bus terminal block, and more. The Rockchip RK3576 SoC comes with the same 6 TOPS NPU found in the Rockchip RK3588/RK3588S SoC and can be used as a lower-cost alternative with less performance. Boardcon SBC3576 specifications: SoC – Rockchip RK3576 CPU 4x Cortex-A72 cores at 2.2GHz, four Cortex-A53 cores at 1.8GHz Arm Cortex-M0 MCU at 400MHz GPU – ARM Mali-G52 MC3 GPU clocked at 1GHz with support for OpenGL […]
iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module
iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]
Chipsee introduces 7-inch and 10.1-inch industrial panel PCs powered by Raspberry Pi CM5
Chipsee has introduced three new panel PCs powered by the Raspberry Pi Compute Module 5 (CM5), namely the EPC-CM5-070, PPC-CM5-070, and PPC-CM5-101, designed for automation, manufacturing, and industrial applications. The EPC-CM5-070 is a compact 7-inch open frame embedded panel PC with armored glass, the PPC-CM5-070 is also a 7-inch panel PC but with VESA/panel mounting and a rugged metal enclosure, and the PPC-CM5-101 features a 10.1-inch touchscreen display and support for an extended temperature range. Chipsee EPC-CM5-070 – A 7-inch open frame panel PC Specifications: SoM – Raspberry Pi CM5 with Broadcom BCM2712 quad-core Cortex-A76 SoC, 4GB or 8GB RAM, 32GB eMMC flash Storage MicroSD card slot M.2 M-Key 2230/2242 (PCIe Gen2 x1) socket for NVMe SSD Display – 7-inch display with 1024×600 resolution, 5-point capacitive touchscreen, 500 NIT brightness Video Output – HDMI port Audio 3.5mm audio out jack Internal 2W Speaker Buzzer Camera – Optional support Networking Gigabit […]
SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications
SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.
The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.
Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain
Toradex has introduced its first SMARC-compliant system-on-modules (SoMs) with the SMARC iMX8M Plus and SMARC iMX95 SoMs based on NXP i.MX 8M Plus and NXP i.MX 95 SoC respectively. The company has made proprietary system-on-modules for years with the Colibri, Apalis, Aquila, and Verdin families. Those typically are cost-optimized and use most or all I/Os from the selected SoC, but customers are tied to one supplier: Toradex. To offer more flexibility, the company decided to introduce its first standardized system-on-modules by selecting the SMARC 2.2 standard for compatibility with existing SMARC-compliant carrier boards and adding the Swiss company as an alternative supplier. Highlights of the SMARC iMX8M Plus module: SoC – NXP i.MX 8M Plus CPU Quad-core ARM Cortex-A53 application processor @ 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator […]
Solderable Rockchip RV1106 system-on-module features 112 castellated pins, offers WiFi 6 and Bluetooth 5.2 connectivity
Luckfox has recently released the Core1106 Core Board Rockchip RV1106 system-on-module with a compact 30x30mm size, 112 castellated pins designed to be soldered on top of a PCB, and an optional WiFi 6 and Bluetooth 5.2 module and IPEX 1.0 antenna connector. The Rockchip RV1106 camera SoC integrates 128MB (G2 version) or 256MB (G3 version) DDR3L memory, a 4th-gen 1 TOPS NPU, and a 3rd-gen Image Signal Processor (ISP) that supports hardware video encoding (H.264/H.265). Other interfaces include MIPI CSI, RGB LCD, USB, Ethernet, GPIO, SPI, I2C, UART, and more. These features make this board suitable for applications like AI-driven image recognition, smart cameras, IoT devices, and edge computing. Luckfox RV1106 system-on-module specifications SoC – Rockchip RV1106G2/G3 CPU – Arm Cortex A7 @ 1.2GHz with an integrated RISC-V co-processor. NPU 4th-gen Rockchip NPU with hybrid quantization (int4, int8, int16) 0.5 TOPS (RV1106G2) or 1 TOPS (RV1106G3) ISP – 3rd-gen 5MP high-performance ISP, HDR, WDR, […]
Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures
Linus Torvalds has just announced the release of Linux 6.13 on the Linux Kernel Mailing List: So nothing horrible or unexpected happened last week, so I’ve tagged and pushed out the final 6.13 release. It’s mostly some final driver fixes (gpu and networking dominating – normal), with some doc updates too. And various little stuff all over. The shortlog is appended for people who want to see the details (and, as always, it’s just the shortlog for the last week, the full 6.13 log is obviously much too big). With this, the merge window for 6.14 will obviously open tomorrow. I already have two dozen pull requests pending – thank you, you know who you are. Linus Release about two months ago, Linux 6.12 – the new LTS version – brought us real-time “PREEMPT_RT” support that had always required out-of-tree patchsets until now, the completion of the EEVDF (Earliest Eligible […]