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Posted on by Debashis Das - No Comments on SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SOM SMARC QCS5430 SoM

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex launches its first SMARC modules with NXP SoCs for improved compatibility and supply chain

Toradex SMARC modules with NXP i.MX 8MPlus and i.MX 95

Toradex has introduced its first SMARC-compliant system-on-modules (SoMs) with the SMARC iMX8M Plus and SMARC iMX95 SoMs based on NXP i.MX 8M Plus and NXP i.MX 95 SoC respectively. The company has made proprietary system-on-modules for years with the Colibri, Apalis, Aquila, and Verdin families. Those typically are cost-optimized and use most or all I/Os from the selected SoC, but customers are tied to one supplier: Toradex. To offer more flexibility, the company decided to introduce its first standardized system-on-modules by selecting the SMARC 2.2 standard for compatibility with existing SMARC-compliant carrier boards and adding the Swiss company as an alternative supplier. Highlights of the SMARC iMX8M Plus module: SoC – NXP i.MX 8M Plus CPU Quad-core ARM Cortex-A53 application processor @ 1.6 GHz Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC380 2D GPU and GC7000UL 3D GPU VPU – 1080p60 video decoder & encoder AI accelerator […]

Posted on by Debashis Das - 4 Comments on Solderable Rockchip RV1106 system-on-module features 112 castellated pins, offers WiFi 6 and Bluetooth 5.2 connectivity

Solderable Rockchip RV1106 system-on-module features 112 castellated pins, offers WiFi 6 and Bluetooth 5.2 connectivity

Luckfox Core1106 Core Board

Luckfox has recently released the Core1106 Core Board Rockchip RV1106 system-on-module with a compact 30x30mm size, 112 castellated pins designed to be soldered on top of a PCB, and an optional WiFi 6 and Bluetooth 5.2 module and IPEX 1.0 antenna connector. The Rockchip RV1106 camera SoC integrates 128MB (G2 version) or 256MB (G3 version) DDR3L memory, a 4th-gen 1 TOPS NPU, and a 3rd-gen Image Signal Processor (ISP) that supports hardware video encoding (H.264/H.265). Other interfaces include MIPI CSI, RGB LCD, USB, Ethernet, GPIO, SPI, I2C, UART, and more. These features make this board suitable for applications like AI-driven image recognition, smart cameras, IoT devices, and edge computing. Luckfox RV1106 system-on-module specifications SoC – Rockchip RV1106G2/G3 CPU – Arm Cortex A7 @ 1.2GHz with an integrated RISC-V co-processor. NPU 4th-gen Rockchip NPU with hybrid quantization (int4, int8, int16) 0.5 TOPS (RV1106G2) or 1 TOPS (RV1106G3) ISP – 3rd-gen 5MP high-performance ISP, HDR, WDR, […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.13 Release – Main changes, Arm, RISC-V, and MIPS architectures

Linux 6.13 Changelog

Linus Torvalds has just announced the release of Linux 6.13 on the Linux Kernel Mailing List: So nothing horrible or unexpected happened last week, so I’ve tagged and pushed out the final 6.13 release. It’s mostly some final driver fixes (gpu and networking dominating – normal), with some doc updates too. And various little stuff all over. The shortlog is appended for people who want to see the details (and, as always, it’s just the shortlog for the last week, the full 6.13 log is obviously much too big). With this, the merge window for 6.14 will obviously open tomorrow. I already have two dozen pull requests pending – thank you, you know who you are. Linus Release about two months ago, Linux 6.12 – the new LTS version – brought us real-time “PREEMPT_RT” support that had always required out-of-tree patchsets until now, the completion of the EEVDF (Earliest Eligible […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on The LattePanda Mu SoM is now available with Intel Core i3-N305 octa-core SoC

The LattePanda Mu SoM is now available with Intel Core i3-N305 octa-core SoC

LattePanda Mu Intel Core i3-N305 CPU

Launched last year with an Intel Processor N100, the LattePanda Mu system-on-module is now available with an Intel Core i3-N305 octa-core processor delivering both higher single-core and multi-core performance, and faster 3D graphics acceleration. All interfaces are the same all exposed through a 260-pin SO-DIMM edge connector including up to 9x PCIe Gen3 lanes, two SATA, eDP, HDMI, and DisplayPort interfaces, twelve USB interfaces, and more.  The LattePanda Mu launched with 8GB RAM last year, but both the N100 and Core i3-N305 models are now available with up to 16GB LPDDR5 IBECC memory, while the eMMC flash capacity remains at 64GB for all variants. LattePanda Mu specifications: SoC (one or the other) Intel Processor N100 quad-core Alder Lake-N processor @ up to 3.4 GHz (Turbo) with 6MB cache, 24EU Intel HD graphics @ 750 MHz; TDP: 6W Intel Core i3-N305 octa-core Alder Lake-N processor @ up to 3.8 GHz (Turbo) […]

Posted on by Tomisin Olujinmi - 12 Comments on MNT Reform Next is an open-source, RK3588-powered modular 12.5-inch laptop (Crowdfunding)

MNT Reform Next is an open-source, RK3588-powered modular 12.5-inch laptop (Crowdfunding)

MNT Reform Next RK3588 modular laptop

The MNT Reform Next brings the Rockchip RK3588 processor to the modular laptop series. It retains the open-hardware nature of the older MNT Reform and introduces a lighter and more modular design, complete with a much faster processor. The MNT Reform Next separates the three port boards from the main motherboard, allowing for greater customization and modification than its predecessors. The standard processor module (RCORE) can be swapped with other modules such as the Raspberry Pi CM4, as well as NXP i.MX 8M Plus, NXP LayerScape 1028A, and AMD Kintex-7 FPGA modules. Like the classic MNT Reform and the MNT Pocket Reform, the enclosure for the Reform Next is milled from anodized, bead-blasted aluminum. Apart from being repairable and customizable, the RK3588 modular laptop is powerful enough to be a daily driver for browsing, writing, programming, gaming, graphics design, sound creation, and video editing. MNT Reform Next specifications: SoM SoC […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on I-Pi SMARC Amston Lake development kit features Intel Atom x7433RE SoC, 8GB LPDDR5, two Raspberry Pi GPIO headers

I-Pi SMARC Amston Lake development kit features Intel Atom x7433RE SoC, 8GB LPDDR5, two Raspberry Pi GPIO headers

I-Pi SMARC Amston Lake devkit

ADLINK’s I-Pi SMARC Amston Lake is a fanless development kit based on SMARC 2.1-compliant system-on-module with an Intel Atom X7433RE quad-core SoC, 8GB LPDRR5 memory, and up to 256GB eMMC flash, plus a carrier board with dual 2.5GbE with TSN, two Raspberry Pi-compatible GPIO headers, and a range of other interfaces. Those include 4-lane MIPI DSI, HDMI, eDP, and dual-channel LVDS display interfaces, two MIPI CSI camera interfaces, a 3.5mm audio jack, four USB Type-A ports, three PCIe M.2 sockets for storage, wireless, and cellular connectivity. I-Pi SMARC Amston Lake devkit specifications: LEC-ASL SMARC 2.1 module Amston Lake SoC  – Intel Atom x7433RE quad-core processor with 6MB cache, 32EU Intel UHD graphics; 9W TDP System Memory – 8GB LPDDR5 Storage – 32GB to 256GB eMMC flash Host interface – 314-pin MXM edge connector Storage – 1x SATA III (6 Gbps) Display – Dual-channel 18-/24-bit LVDS Camera – 2-lane MIPI CSI, […]

UP 7000 x86 SBC