5g News - Page 17 of 27 - CNX Software

July 2, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

UP Connect Plus adds 5G support, 3 GbE ports to UP Core Plus, UP Xtreme SBCs

AAEON UP Connect Plus is a carrier board with three Gigabit Ethernet (GbE) ports, and an M.2 slot plus a micro SIM card socket adding support for 5G cellular connectivity to the company’s Appolo Lake-based UP Core Plus and Whiskey Lake-powered UP Xtreme single board computers. UP Connect Plus specifications: Connectivity 3 Gigabit Ethernet RJ45 ports in two configurations: 3x Intel Ethernet Controller I211-AT 3x Intel Ethernet Controller I210-IT with wide temperature and TSN (Time-sensitive Networking) 5G cellular – M.2 3042/3052 colay socket with micro-SIM card port to support 4G/5G modules USB – 1x USB 3.0 Type-A port for UP Core Plus only PCIe – 1x 2 channel PCIe switch SBC connectors – 2x 100-pin high-speed docking connectors Power Supply – 12V/5V from the main board Power Consumption – Approximately 36 to 40 Watts with UP Core Plus + UP Connect Plus Dimensions – 90 mm x 56 mm Temperature […]

June 23, 2021June 24, 2021 by Jean-Luc Aufranc (CNXSoft) - 22 Comments

SiFive Performance P550 is the fastest 64-bit RISC-V processor so far

SiFive Performance P550 fastest RISC-V processor

SiFive has announced two RISC-V “Performance” cores with Performance P550 that should be the fastest 64-bit RISC-V processor so far with a SPECInt 2006 score of 8.65/GHz, as well as a Performance P270 Linux capable processor with full support for the RISC-V vector extension v1.0 rc. SiFive Performance P550 P550 highlights: RISC-V RV64GBC ISA 13 stage, 3-issue high-performance out-of-order pipeline Supports multicore coherence with up to 4 cores in a core complex Private 32KB+32KB L1 cache and a private 256KB L2 cache per core Up to 4MB L3 cache in a four-core cluster SPECint 2006 – 8.65/GHz 2.4 GHz in 7nm with a footprint of less than 0.25 mm SiFive compares the Performance P550 core to Arm’s Cortex-A75 with higher performance in SPECint2006 and SPECfp2006 integer/floating-point benchmark, all a much smaller area which would enable a quad-core P550 cluster on about the same footprint as a single Cortex-A75 core. There […]

June 10, 2021 by Jean-Luc Aufranc (CNXSoft) - 17 Comments

ClearFog CN9130 networking boards deliver 10GbE through a tiny Octeon TX2 module

SolidRun has designed and manufactured ClearFog networking boards ever since the introduction of the Marvell ARMADA 380/388-based ClearFog Pro in 2015. Since then, more powerful models have been launched including the ClearFog GT 8K based on Marvell ARMADA A8040 quad-core Cortex A72 processor with support for 2.5GbE and 10GbE, and the ClearFog CX LX2K equipped with a 16-core Cortex-A72 NXP capable of 100GbE networking. The Israeli company unveiled its first Octeon TX2-based design last fall with ClearFog CX CN9K, a full-featured networking SBC fitted with CEx7 CN9132 COM Express Type 7 module. But now the company has launched the more compact ClearFog CN9130 Pro/Base networking boards equipped with a tiny 50x30mm Octeon TX2 module still enabling 10GbE connectivity. SolidRun SOM 9130 system-on-module Specifications: SoC – Marvell OCTEON TX2 CN9130 quad-core Cortex A72 processor @ up to 2.2 GHz (commercial) or 2.0 GHz (industrial) System Memory – Up to 8GB DDR4 […]

June 4, 2021June 4, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

reServer 2-bay multimedia NAS is equipped with an Intel Core Tiger Lake SBC

Seeed Studio has just introduced reServer dual-bay multimedia NAS based on Intel Core i3/i5/i7 Tiger Lake 11th generation processor. The networked storage device is based on ODYSSEY X86 V2 single board computer that offers an upgrade to the ODYSSEY-X86J4105 and ODYSSEY-X86J4125 Gemini Lake SBC’s. reServer comes with up to to 64GB dual-channel memory, dual 2.5GbE, support for two 3.5-inch SATA drives, HDMI and DisplayPort video output, and some USB 3.0/2.0 ports. reServer (preliminary) specifications: SoC (one or the other) Intel Core i3-1115G4 dual-core/quad-thread processor with 48 EU Intel UHD Graphics @ 400 – 1250MHz; 28W TDP Unnamed Intel Core i5 with 80 EU Intel Iris Xe Graphics G7 @ 400-1300MHz; 28W TDP Unnamed Intel Core i7 with 96 EU Intel Iris Xe Graphics G7 @ 400-1300MHz; 28W TDP Co-processor – Microchip ATSAMD21G18 32-Bit Arm Cortex-M0+ microcontroller System Memory – Up to 64GB dual-channel DDR4-3200 SDRAM via two SO-DIMM sockets Storage […]

May 31, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Intel 5G Solution 5000 5G M.2 module developed with MediaTek, Fibocom

Qualcomm very recently unveiled Snapdragon X65 and X62 5G M.2 card reference designs to help OEM’s develop their own 5G modules for integration into PC’s and CPE’s. But as one should have expected, more options are coming, and Intel have now announced their own “5G Solution 5000” 5G M.2 card for laptops at Computex 2021 in collaboration with MediaTek and Fibocom. Fibocom FM350-GL (Intel 5G Solution 5000) specifications: Modem technologies – 5G NR, 4G LTE, 3D WCDMA Frequency bands – Sub 6GHz for global coverage Data throughput 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink Built-in eSIM Host interface – PCIe Gen 3 Dimensions – 30 x 52 x2.3 mm (M.2 card) Temperature Range – -10 to +55°C The 5G module targets platforms built upon Intel Tiger Lake and Alder Lake […]

May 24, 2021September 25, 2021 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Qualcomm 315 5G IoT modem announced for 5G IIoT applications

Qualcomm has announced the Qualcomm 315 5G IoT modem just a couple of days after the company’s introduction of Snapdragon 778G 5G SoC and M.2 5G card reference designs based on Snapdragon X65/62 modem. Qualcomm Technologies say it is their first purpose-built Internet of Things modem solution equipped with 5G connectivity and optimized for Industrial IoT (IIoT) applications. Qualcomm 315 5G IoT modem Qualcomm 315 5G IoT modem specifications: CPU – Cortex-A7 core running Linux Cellular connectivity 5G Technology – 3GPP Rel.15 5G NR Peak speeds – Download: 1.54 Gbps; upload: 330 Mbps Modes – SA (standalone), TDD & FDD RF – Adaptive antenna tuning, power tracking Sub-6 GHz Specs – 100 MHz bandwidth, 4×4 MIMO DL, 64 QAM DL/UL 4G LTE Technology – Rel.15 Cat.13 DL, Cat.5 UL Peak speeds – Download: 400 Mbps; upload: 75 Mbps LTE Modes – TDD & FDD LTE RF – 700 MHz to […]

May 20, 2021 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Snapdragon 778G 5G SoC to power “high-tier” smartphones with up to 16GB LPDDR5

There used to be “premium mid-range” smartphones, but Qualcomm now calls those “high-tier” smartphones in the recent announcement of Snapdragon 778G 5G processor succeeding Snapdragon 765G/768G 5G mobile platforms. The octa-core Cortex-A78/A55 SoC features a Snapdragon X53 5G Modem supporting up to 3.7 Gbps downlink, support FHD+ display up to 144 Hz, up to 16GB LP-DDR5 memory, and packs 12 TOPS of AI processing power. Snapdragon 778G (SM7325) specifications: CPU – Eight Kryo 670 CPU cores including 4x Arm Cortex-A78 @ 2.4GHz and 4x Arm Cortex-A55 @ 1.8GHz GPU – Adreno 642L with Vulkan 1.1, Snapdragon Elite Gaming features, H.265 and VP9 video decode, HDR10+, HDR10, HLG DSP – Hexagon 770 Processor with fused AI Accelerator architecture, Hexagon Tensor Accelerator, Hexagon Vector eXtensions, Hexagon Scalar Accelerator 2nd generation Qualcomm Sensing Hub Memory – Up to 16 GB LP-DDR5 memory up to 3200 MHz Display On-Device Display – up to FHD+ […]

May 20, 2021 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

Qualcomm unveils Snapdragon X65 and X62 5G M.2 card reference designs

Qualcomm has introduced 5G M.2 card reference designs based on Snapdragon X65 and X62 5G modems with the aim of accelerating 5G adoption in PCs, Always-Connected PCs (ACPCs), laptops, Customer Premises Equipment (CPEs), XR, gaming, and other mobile broadband (MBB) devices. The Snapdragon X65 card will allow download speeds of up to 10 Gbps, while the Snapdragon X62 model can handle up to 4.4 Gbps with both versions compliant with 3GPP Release 16, and supporting mmWave and sub-6GHz networks. For those who may not know, reference designs are ready to be manufactured solutions provided by silicon vendors to OEM’s. So Qualcomm will not sell the cards themselves but instead, rely on partners who may manufacture them as is or with some tweaks. Companies committed to either sell cards or include them into their offering include Compal Electronics, Fibocom Foxconn, MeiG Smart, Partron, Quectel, Sierra Wireless, Telit, and others with most […]