Only a few years ago, 5G was only found in premium smartphones, but with the launch of the Snapdragon X35, Qualcomm aims to bring 5G cellular connectivity to wearables, industrial IoT applications, and eXtended Reality (XR) glasses. The Snapdragon X35 specifically supports 5G NR-Light, aka RedCap, which is described as ” a new class of 5G” that “fills the gap in between high-speed mobile broadband devices and extremely low-bandwidth NB-IoT devices” and delivers link rates of up to 220 Mbps. Snapdragon X35 modem key features and specifications: Cellular Technology: 5G NR-Light, FDD, SA (standalone), TDD, sub-6 GHz, HD-FDD, LTE Multi-Mode NR – Sub-6 SA, LTE Cat 4 3GPP Release 17 “RedCap” modem Number of Antennas: 1 Tx antenna, 2 Rx antennas Cellular Modem-RF Specs: 20 MHz bandwidth (sub-6 GHz), 1RX/2RX, 1TX, and Half-Duplex FDD (HD-FDD) Calling Services: VoLTE, VoNR Peak Upload QAM – 64 QAM Peak Upload Speed: 100 Mbps […]
Robustel R5020 Lite 5G router targets industrial applications
Robustel R5020 Lite is an industrial 5G router with 4G LTE Cat 18 fallback, two Gigabit Ethernet ports and WiFi 5 connectivity, as well as features such as an RS232 or RS485 serial port, wide 12-36V DC power input, and support for an extended temperature range. The company says the R5020 Lite is especially well suited for “Enterprise / SD-WAN applications as a ‘5G managed modem’”, and it can also be used as a backup for fixed line broadband, for primary broadband access, as well as for Industrial IoT (IIoT) applications like industrial automation, autonomous robots, and Smart Transportation applications. Robustel R5020 Lite 5G router specifications: SoC – Undisclosed System Memory – “Available for SDK”: 128MB RAM Storage – “Available for SDK”: 5MB flash Connectivity Cellular – 5G/4G/3G Global frequency bands 5G: NR SA/NSA: n1/n2/n3/n5/n7/n8/n12/n13/n14/n20/n25/n26/n28/n29/n30/n38/n40/n41/n48/n66/n71/n75/n76/n77/n78/n79 4G LTE FDD: B1/B2/B3/B4/B5/B7/B8/B12/B13/B14/B17/B18/B19/B20/B25/B26/B28/B29/B30/B32/B66/B71 LTE TDD: B34/B38/B39/B40/B41/B42/B43/B48 LAA: B46 (only supports 2 x 2 MIMO) […]
Year 2022 in review – Top 10 posts and statistics
It’s the last day of the year and the time to look at some of the highlights of 2022, some traffic statistics from CNX Software website, and speculate on what 2023 may bring us. The semiconductors shortage continued in 2022, but things are looking brighter in 2023 with the full reopening of the world mixed with forecasts of difficult economic times that should keep the demand/supply equation in check. On the Arm processor front the biggest news of the year, at least in this corner of the Internet, was the launch of the Rockchip RK3588 octa-core Cortex-A76/A55 processor together with interesting single board computers that we’ll discuss below. Announced last year, the Amlogic A311D2 octa-core Cortex-A73/A53 was finally made available in a few SBC’s, and we finally got some news about the Amlogic S928X Cortex-A76/A55 SoC showcased in 8K TV boxes, but we have yet to see it in action. […]
Lattice Avant mid-range FPGA platform features up to 500K logic cells, 25 Gbps SERDES, Hard PCIe Gen4
Lattice Avant is a new low-power and small form factor mid-range FPGA platform, manufactured with a 16nm FinFET process, and equipped with 25 Gb/s SERDES, hardened PCI Express, external memory PHY interfaces, a high DSP count, and a security engine. Lattice Semi is better known for its entry-level FPGAs such as the iCE40 which is popular in the community thanks to low-cost hardware and support for open-source tools, but the Avant platform marks the company’s entry into the mid-range FPGA market, defined by chips with 100k to 500k logic cells (LCs). Lattice Avant highlights: FPGA fabric – 200K to 500K logic cells up to 350 MHz DSP – 700 to 1,8000 18×18 multipliers @ up to 650 MHz to support the latest AI algorithms Memory 14-36 Mbit embedded memory up to 650 MHz DDR3L/DDR4/LPDDR4 and DDR5 support I/Os 4x to 28x 25 Gbps multi-protocol SERDES Hard PCIe Gen4 200 to […]
UP Xtreme i12 Alder Lake SBC supports up to four 4K displays @ 60 Hz, Raspberry Pi HATs
AAEON has just introduced the UP Xtreme i12 single board computer (SBC) with Intel 12th generation Alder Lake-P hybrid SoC with up to 12 cores/16 threads, up to 32GB LPDDR5 memory, support for four 4Kp60 displays, and equipped with high-speed interfaces such as USB 4.0 and 2.5 GbE. The board also features four M.2 sockets for NVMe storage, Wi-Fi 6 and 5G cellular connectivity, a SATA III port, several USB 3.2/2.0 Type-A ports, and a 40-pin GPIO header and mounting thread for Raspberry Pi HATs, which should make it especially suitable for IoT, robotics, and smart retail applications, as well as smart manufacturing with a 12 to 36V wide supply voltage range. UP Xtreme i12 specifications: Alder Lake-P SoC (One or the other) Intel Core i7-1270PE 12-core/16-thread processor @ 3.30GHz / 4.50GHz (Turbo) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP Intel Core i5-1250PE 12-core/16-thread processor […]
DFI EC70A-TGU embedded computer promises long-term support until 2035 (at least)
Some industries require long-term support of hardware, and DFI’s EC70A-TGU rugged embedded computer could fit the bill as the Tiger Lake IOTG processor used in this model has a 15-Year CPU life cycle guaranteeing availability until Q3 2035. The fanless computer is equipped with 8GB RAM, supports M.2 NVMe SSD storage, also well M.2 expansion slots for 5G modules, features HDMI and VGA video output, four serial DB3 ports, and offers up to four Ethernet ports and up to six USB ports through three SKUs with a different number of USB and Ethernet ports. DFI EC70A-TGU specifications: Tiger Lake UP3 “IoTG” SoC (one or the other) @ 1.5GHz to 4.4GHz depending on SKU Embedded Intel Core i7-1185G7E quad-core processor with Iris Xe graphics; TDP: 28W Intel Core i5-1145G7E quad-core processor with Iris Xe graphics; TDP: 28W Intel Core i3-1115G4E dual-core processor with Intel UHD graphics; TDP: 28W Industrial-grade Intel Core […]
Sony ALT1350 5G cellular IoT chip supports NTN connectivity, integrates sub-GHz and 2.4GHz radios
Sony ALT1350 is a new ultra-low-power 5G LPWA LTE-M/NB-IoT chip that supports Non-Terrestrial Networks (NTN) for satellite connectivity and also integrates sub-GHz and 2.4 GHz radios for short-range communication and improved efficiency. The chip is comprised of an Arm Cortex-M4 microcontroller core as well as an Arm Cortex-M0+ always-on core for sensors and will be upgradable to 3GPP Release 17 to support higher bitrates for Cat-M1 (eMTC) and Cat-NB2 (NB-IoT). It also implements GNSS, cellular and wifi-based location, supports AI acceleration, and embeds a secure element for secure communication. Sony ALT1350 specifications: MCU cores Arm cortex-M4 with 1MB NVRAM and 752KB RAM Arm Cortex-M0+ low power always-on sensing hub Memory & Storage I/F – Quad SPI flash and PSRAM Wireless Cellular 3GPP Release 15, future proof to support 3GPP up to 17 through SW upgrade CAT-M1: Up to 588 Kbps in DL, and 1119 Kbps in uplink (up to 1.2mbps […]
Radxa E25 modular 2.5GbE router supports WiFi 6 and 4G/5G cellular connectivity
Radxa E25 is a modular router with two 2.5GbE ports based on the Radxa CM3 Industrial (CM3I) system-on-module equipped with a Rockchip RK3568 quad-core Cortex-A55 processor, and optional support for WiFi 6 and 4G or 5G cellular connectivity. I got an early sample of the Radxa E25 carrier board in January, but the company has now refined the design with version 1.4 of the board and will launch the Radxa E25 as a complete router with an enclosure similar to NanoPi R5S and LinkStar H68K we’ve covered previously. Radxa E25 specifications: SoM – Radxa CM3I with Rockchip RK3568 quad-core Cortex-A55 processor @ 2.0 GHz with Arm Mali-G52, up to 8GB RAM, up to 128GB eMMC flash (250MB/s max), optional WiFi and Bluetooth Storage – MicroSD card socket, M.2 SATA 2242 SSD (multiplexed with 4G) Networking 2x 2.5GbE ports via Realtek RTL8125B 2.5 Gbps Ethernet transceiver (Tested by Radxa at 2.2 […]