SolidRun has designed and manufactured ClearFog networking boards ever since the introduction of the Marvell ARMADA 380/388-based ClearFog Pro in 2015. Since then, more powerful models have been launched including the ClearFog GT 8K based on Marvell ARMADA A8040 quad-core Cortex A72 processor with support for 2.5GbE and 10GbE, and the ClearFog CX LX2K equipped with a 16-core Cortex-A72 NXP capable of 100GbE networking. The Israeli company unveiled its first Octeon TX2-based design last fall with ClearFog CX CN9K, a full-featured networking SBC fitted with CEx7 CN9132 COM Express Type 7 module. But now the company has launched the more compact ClearFog CN9130 Pro/Base networking boards equipped with a tiny 50x30mm Octeon TX2 module still enabling 10GbE connectivity. SolidRun SOM 9130 system-on-module Specifications: SoC – Marvell OCTEON TX2 CN9130 quad-core Cortex A72 processor @ up to 2.2 GHz (commercial) or 2.0 GHz (industrial) System Memory – Up to 8GB DDR4 […]
reServer 2-bay multimedia NAS is equipped with an Intel Core Tiger Lake SBC
Seeed Studio has just introduced reServer dual-bay multimedia NAS based on Intel Core i3/i5/i7 Tiger Lake 11th generation processor. The networked storage device is based on ODYSSEY X86 V2 single board computer that offers an upgrade to the ODYSSEY-X86J4105 and ODYSSEY-X86J4125 Gemini Lake SBC’s. reServer comes with up to to 64GB dual-channel memory, dual 2.5GbE, support for two 3.5-inch SATA drives, HDMI and DisplayPort video output, and some USB 3.0/2.0 ports. reServer (preliminary) specifications: SoC (one or the other) Intel Core i3-1115G4 dual-core/quad-thread processor with 48 EU Intel UHD Graphics @ 400 – 1250MHz; 28W TDP Unnamed Intel Core i5 with 80 EU Intel Iris Xe Graphics G7 @ 400-1300MHz; 28W TDP Unnamed Intel Core i7 with 96 EU Intel Iris Xe Graphics G7 @ 400-1300MHz; 28W TDP Co-processor – Microchip ATSAMD21G18 32-Bit Arm Cortex-M0+ microcontroller System Memory – Up to 64GB dual-channel DDR4-3200 SDRAM via two SO-DIMM sockets Storage […]
Intel 5G Solution 5000 5G M.2 module developed with MediaTek, Fibocom
Qualcomm very recently unveiled Snapdragon X65 and X62 5G M.2 card reference designs to help OEM’s develop their own 5G modules for integration into PC’s and CPE’s. But as one should have expected, more options are coming, and Intel have now announced their own “5G Solution 5000” 5G M.2 card for laptops at Computex 2021 in collaboration with MediaTek and Fibocom. Fibocom FM350-GL (Intel 5G Solution 5000) specifications: Modem technologies – 5G NR, 4G LTE, 3D WCDMA Frequency bands – Sub 6GHz for global coverage Data throughput 5G NR – Up to 4.7 Gbps downlink; up to 1.25 Gbps uplink 4G LTE – Up to 1.6 Gbps Cat 19downlink; up to 150 Mbps uplink Built-in eSIM Host interface – PCIe Gen 3 Dimensions – 30 x 52 x2.3 mm (M.2 card) Temperature Range – -10 to +55°C The 5G module targets platforms built upon Intel Tiger Lake and Alder Lake […]
Qualcomm 315 5G IoT modem announced for 5G IIoT applications
Qualcomm has announced the Qualcomm 315 5G IoT modem just a couple of days after the company’s introduction of Snapdragon 778G 5G SoC and M.2 5G card reference designs based on Snapdragon X65/62 modem. Qualcomm Technologies say it is their first purpose-built Internet of Things modem solution equipped with 5G connectivity and optimized for Industrial IoT (IIoT) applications. Qualcomm 315 5G IoT modem Qualcomm 315 5G IoT modem specifications: CPU – Cortex-A7 core running Linux Cellular connectivity 5G Technology – 3GPP Rel.15 5G NR Peak speeds – Download: 1.54 Gbps; upload: 330 Mbps Modes – SA (standalone), TDD & FDD RF – Adaptive antenna tuning, power tracking Sub-6 GHz Specs – 100 MHz bandwidth, 4×4 MIMO DL, 64 QAM DL/UL 4G LTE Technology – Rel.15 Cat.13 DL, Cat.5 UL Peak speeds – Download: 400 Mbps; upload: 75 Mbps LTE Modes – TDD & FDD LTE RF – 700 MHz to […]
Snapdragon 778G 5G SoC to power “high-tier” smartphones with up to 16GB LPDDR5
There used to be “premium mid-range” smartphones, but Qualcomm now calls those “high-tier” smartphones in the recent announcement of Snapdragon 778G 5G processor succeeding Snapdragon 765G/768G 5G mobile platforms. The octa-core Cortex-A78/A55 SoC features a Snapdragon X53 5G Modem supporting up to 3.7 Gbps downlink, support FHD+ display up to 144 Hz, up to 16GB LP-DDR5 memory, and packs 12 TOPS of AI processing power. Snapdragon 778G (SM7325) specifications: CPU – Eight Kryo 670 CPU cores including 4x Arm Cortex-A78 @ 2.4GHz and 4x Arm Cortex-A55 @ 1.8GHz GPU – Adreno 642L with Vulkan 1.1, Snapdragon Elite Gaming features, H.265 and VP9 video decode, HDR10+, HDR10, HLG DSP – Hexagon 770 Processor with fused AI Accelerator architecture, Hexagon Tensor Accelerator, Hexagon Vector eXtensions, Hexagon Scalar Accelerator 2nd generation Qualcomm Sensing Hub Memory – Up to 16 GB LP-DDR5 memory up to 3200 MHz Display On-Device Display – up to FHD+ […]
Qualcomm unveils Snapdragon X65 and X62 5G M.2 card reference designs
Qualcomm has introduced 5G M.2 card reference designs based on Snapdragon X65 and X62 5G modems with the aim of accelerating 5G adoption in PCs, Always-Connected PCs (ACPCs), laptops, Customer Premises Equipment (CPEs), XR, gaming, and other mobile broadband (MBB) devices. The Snapdragon X65 card will allow download speeds of up to 10 Gbps, while the Snapdragon X62 model can handle up to 4.4 Gbps with both versions compliant with 3GPP Release 16, and supporting mmWave and sub-6GHz networks. For those who may not know, reference designs are ready to be manufactured solutions provided by silicon vendors to OEM’s. So Qualcomm will not sell the cards themselves but instead, rely on partners who may manufacture them as is or with some tweaks. Companies committed to either sell cards or include them into their offering include Compal Electronics, Fibocom Foxconn, MeiG Smart, Partron, Quectel, Sierra Wireless, Telit, and others with most […]
MediaTek Dimensity 900 6nm SoC brings UFS 3.1, LPDDR5 to mid-range 5G smartphones
Arm Cortex-A78 and LPDDR5 would have been premium features not so long ago, but time flies, and the just-announced MediaTek Dimensity 900 5G SoC for mid-range smartphones includes two Cortex-A78 cores, six Cortex-A55 cores, support for LPDRR5/4 memory, UFS 3.1 storage, and of course 5G cellular connectivity up to 2.77Gbps. The mobile processor’s multimedia capabilities are pretty good as well with support for displays up to 2520 x 1080 resolution at 120 Hz, up to 108MP camera, 4Kp30 video with H.265, H.264, AV1, as well as an Arm Mali-G68 MC4 GPU and third-generation APU 3.0 AI accelerator. MediaTek Dimensity 900 specifications: CPU – Octa-core DynamIQ processor with 2x Arm Cortex-A78 @ Up to 2.4GHz, 6x Arm Cortex-A55 @ Up to 2GHz GPU – Arm Mali-G68 MC4 AI Accelerator – MediaTek APU 3.0 VPU Video Encoding – H.264, H.265 / HEVC up to 4K @ 30FPS Video Playback – H.264, H.265 […]
Armv9 architecture to focus on AI, security, and “specialized compute”
Armv8 was announced in October 2011 as the first 64-bit architecture from Arm. while keeping compatibility with 32-bit Armv7 code. Since then we’ve seen plenty of Armv8 cores from the energy-efficient Cortex-A35 to the powerful Cortex-X1 core, as long as some custom cores from Arm partners. But Arm has now announced the first new architecture in nearly ten years with Armv9 which builds upon Armv8 but adds blocks for artificial intelligence, security, and “specialized compute” which are basically hardware accelerators or instructions optimized for specific tasks. Armv9 still supports Aarch32 and Aarch64 instructions, NEON, Crypto Extensions, Trustzone, etc…, and is more an evolution of Armv8 rather than a completely new architecture. Some of the new features brought about by Armv9-A include: Scalable Vector Extension v2 (SVE2) is a superset of the Armv8-A SVE found in some Arm supercomputer core with the addition of fixed-point arithmetic support, vector length in multiples […]