Processors Category - Page 32 of 1181 - CNX Software

January 9, 2025March 29, 2025 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Pilet is a Raspberry Pi 5-powered modular, portable computer with 5-inch or 7-inch display, optional built-in keyboard (Crowdfunding)

Pilet is a modular, open-source hardware, portable computer designed for the Raspberry Pi 5 SBC, and equipped with a choice of displays, keyboards, and an optional battery module that can last for up to 7 hours. Two models are available: the Pilet 5 with a 5-inch display, an integrated keyboard, a trackball, a scroll wheel, a navigational switch (D-Pad), and game buttons, and the Pilet 7 with a larger 7-inch display and support for detachable modules such as a keyboard, gamepad, or deck. Pilet specifications: Supported SBC – Raspberry Pi 5 Storage – MicroSD card, NVMe SSD via module Display Pilet 5 – 5-inch IPS MIPI DSI display with 1280×800 resolution, capacitive touch screen. Pilet 7 – 7-inch IPS MIPI DSI display with 1280×800 resolution, capacitive touch screen. Video Output- 2x micro HDMI ports Networking Gigabit Ethernet RJ45 port 802.11ac WiFi 5 and Bluetooth 5.0 Optional LTE cellular via module […]

January 9, 2025January 10, 2025 by Debashis Das - 20 Comments

Qualcomm QCS6490-based Rubik Pi 3 AI SBC supports Android, Linux, and LU operating systems

Thundercomm has officially launched the Rubik Pi 3 SBC built around the Qualcomm QCS6490 SoC with a 12.5 TOPS AI accelerator. The SBC comes in a “PI-CO ITX” form factor that combines the Pico-ITX standard and the 40-pin GPIO header found on Raspberry Pi SBCs. The SBC comes with a standard set of interfaces, including USB, HDMI out, MIPI-CSI camera support, Ethernet, Wi-Fi 5, Bluetooth 5.2, and much more. Additionally, the SBC features a 40-pin header for GPIO, UART for debugging, audio output, and RTC battery support. The company mentions that it is the first Pi-based system using Qualcomm’s AI platforms, hence it supports Raspberry Pi HAT/HAT+ expansion boards, making it suitable for various AI, IoT, and edge computing projects. Rubik Pi 3 SBC specifications: SoC – Qualcomm QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x […]

January 8, 2025January 8, 2025 by Tomisin Olujinmi - 4 Comments

$12 Plant Bot is an ESP32-C3 soil sensor and pump driver for fully automated indoor plant care

The Plant Bot is an open-source, Internet-enabled plant monitor powered by the ESP32-C3 microcontroller and integrating a corrosion-resistant capacitive moisture soil sensor and a pump driver on a single printed circuit board, eliminating the need for additional cabling. The Plant Bot is designed to automate indoor plant care by combining moisture sensing, light sensing, and pump activation. It can be powered via USB or a single coin cell battery which lasts up to a week with daily updates. An onboard multi-color LED visually represents the current soil condition, ranging from red (dry) to blue (moist). The “Soil Level” line on the board indicates the maximum depth to which the sensor or device should be inserted into the soil. According to the maker, the Plant Bot will remain unaffected by corrosion if the soil level does not exceed this line. Other solutions we’ve covered with a soil sensor usually separate the […]

January 8, 2025 by Debashis Das - 1 Comment

Seeed Studio introduces ESP32-C3-based Modbus Vision RS485 and SenseCAP A1102 LoRaWAN outdoor Edge AI cameras

Seeed Studio's Modbus Vision RS485 and SenseCAP A1102 outdoor Edge AI cameras

Seeed Studio has recently released the Modbus Vision RS485 and SenseCAP A1102 (LoRaWAN) outdoor Edge AI cameras based on ESP32-C3 SoC through the XIAO-ESP32C3 module for WiFi and the Himax WiseEye2 processor for vision AI. Both are IP66-rated AI vision cameras designed for home and industrial applications. The RS485 camera is designed for industrial systems and features a Modbus interface, making it suitable for factory automation and smart buildings. The SenseCAP A1102 uses LoRaWAN for long-range, low-power monitoring in remote locations. Both offer advanced AI for tasks like object detection and facial recognition. Besides its built-in RS485 interface, the Modbus Vision RS485 also supports LoRaWAN and 4G LTE connectivity via external Data Transfer Units (DTUs). With over 300 pre-trained AI models, the camera can do object detection and classification tasks making it suitable for industrial automation, smart agriculture, environmental monitoring, and other AI-driven applications requiring high performance. The SenseCAP A1102 […]

January 8, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Arduino Portenta Proto Kit ME aims to ease prototyping for professionals

Arduino has introduced the Portenta Proto Kit ME (Motion Environment) at CES 2025 with the kit designed to allow engineers, designers, and innovators to turn ideas into functional prototypes quickly. The kit does not include new hardware, but it is based on the Arduino Portenta H7, Mid Carrier, and Nicla Sense ME module, as well as other off-the-shelf parts such as a 4G LTE and GNSS module and some Modulino modules, plus three months of Arduino Cloud access. The company expects the prototyping kit to be used for predictive maintenance, environmental sensing, and industrial automation prototypes. Arduino Portenta Proto Kit ME kit content: Portenta H7 board based on STMicro STM32H747 Arm Cortex-M7 @ 480 MHz + M4 @ 200 MHz MCU capable of handling ML workloads and advanced processing Portenta Mid Carrier with gigabit Ethernet, USB 2.0 port, MIPI CSI and Arduino camera connectors, CAN Bus, mPCIe socket, GPIO header, […]

January 7, 2025January 7, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

ASROCK Industrial launches NUC(S) Ultra 200 (Intel Arrow Lake-H) and 4X4 AI300 (AMD Ryzen 300 AI) motherboards and BOX PCs

ASROCK Industrial NUC Ultra 200 BOX PC Motherboard

Following new SoC announcements by Intel and AMD at CES 2025, ASRock Industrial has launched the NUC(S) Ultra 200 BOX Series and NUC Ultra 200 Motherboard Series powered by Intel Core Ultra 200H Arrow Lake-H processors with of to 99 TOPS of AI inferencing power, and the 4X4 BOX AI300 Series and 4X4 AI300 Motherboard Series based on AMD Ryzen AI 300 processors with up to 50 TOPS of NPU performance. ASROCK NUC(S) Ultra 200 BOX PCs & NUC ULTRA 200 motherboards NUC(S) Ultra 200 specifications: Arrow Lake-H/U SoC (one or the other) Intel Core Ultra 7 255H (6P+8E) processor up to 5.1 GHz with 24MB cache, Intel Arc 140T GPU (74 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 Watts Intel Core Ultra 5 225H (4P+8E) processor up to 4.9 GHz with 18MB cache, Intel Arc 130T GPU (63 TOPS), and Intel AI Boost (13 TOPS); PBP: 28 […]

January 7, 2025 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

Qualcomm Snapdragon X octa-core Arm SoC to power $600+ mainstream AI PCs with Copilot+ support

Qualcomm has unveiled the Snapdragon X octa-core Arm SoC at CES 2025 designed for mainstream AI PCs with Copilot+, which should start at $600 and up. This follows the announcements of the high-end 4.3GHz Snapdragon X Elite 12-core SoC in 2023, and the Snapdragon X Plus 10-/8-core processors last year, and should make AI PCs affordable to a wider range of consumers. The new Snapdragon X is clocked at up to 3.0 GHz, still features a 45 TOPS Hexagon NPU, supports NVMe storage, up to 64GB LPDDR5, up to 2560 x 1440 built-in displays, up to three external displays at 4Kp60, and a single camera up to 36MP resolution. Systems based on the new octa-core processor can support WiFi 7, WiFi 6E, and/or 5G LTE connectivity. Qualcomm Snapdragon X (X1-26-100) specifications: CPU – Octa-core 64-bit Armv8 Oryon processor clocked at up to 3.0 GHz (2976 MHz) with 30MB cache GPU […]

January 7, 2025January 6, 2025 by Jean-Luc Aufranc (CNXSoft) - 4 Comments

FOSDEM 2025 schedule – Embedded, Open Hardware, RISC-V, Edge AI, and more

FOSDEM 2025 will take place on February 1-2 with over 8000 developers meeting in Brussels to discuss open-source software & hardware projects. The free-to-attend (and participate) “Free and Open Source Software Developers’ European Meeting” grows every year, and in 2025 there will be 968 speakers, 930 events, and 74 tracks. Like every year since FOSDEM 2015 which had (only) 551 events, I’ll create a virtual schedule with sessions most relevant to the topics covered on CNX Software from the “Embedded, Mobile and Automotive” and “Open Hardware and CAD/CAM” devrooms, but also other devrooms including “RISC-V”, “FOSS Mobile Devices”, “Low-level AI Engineering and Hacking”, among others. FOSDEM 2025 Day 1 – Saturday 1 10:30 – 11:10 – RISC-V Hardware – Where are we? by Emil Renner Berthing I’ll talk about the current landscape of available RISC-V hardware powerful enough to run Linux and hopefully give a better overview of what to […]