While doing some research, I noticed an Intel Core i7-11850HE “Tiger Lake-H” processor on the OpenVino Toolkit website. Parts that end with “E” are usually processors designed for the embedded market. I had never heard about the Tiger Lake-H embedded family, so I looked for “i7-11850HE” processor, and it’s not in Intel Ark, or much anywhere else except on a page in Google Cache, about a COM-HPC module “with the 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® processors (formerly Tiger Lake-H) for FuSa application”. There we have a list of Xeon, Core, and Celeron 11th generation processors that I don’t think have ever been announced: Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 35W TDP Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 45/35W cTDP Intel Core vPRO i5-11500HE processor […]
Intel packaging & process roadmap to 2025 and beyond
Intel has a mixed history with its ability to keep production schedules for new processes, with notably its 10nm process suffering from years of delays before finally being deployed into chips. But the US company has now held an event unveiling the process & package roadmap through 2025 and beyond, which includes 7nm, 4nm, 3nm, and even the switch the angstrom scale (1A = 0.1 nm) with a 20A process expected in 2024/2025. Intel Process roadmap to 2025 and beyond On the process node sides of things, here’s what to expect in the next few years: Intel 7 delivers 10% to 15% performance-per-watt improvements, and will be found in Alder Lake for client in 2021 and Sapphire Rapids for the data center, with the latter expected to be in production in Q1 2022. Intel 4 promises a 20% performance-per-watt increase over Intel 7, and is the first Intel FinFET node […]
Intel Alder Lake hybrid mobile processor family to range from 5W to 55W TDP (leak)
Intel’s first foray into hybrid processors using Foveros 3D stacking technology did not end well with the company just announcing the end of the life for Lakefield hybrid processors. But the company is not giving up on hybrid technology, and a recent leak shows the Intel Alder Lake family comprised of more powerful mobile hybrid processors will be offered for a wide range of applications from tablets with 5-7W M5 processors and up to “muscle laptops” or mobile workstations (MWS) with H55 processor at 45-55W TDP. Alder Lake hybrid processors will be comprised of high-performance CPU “Golden Cove” cores and energy-efficient Atom-based “Gracemont” CPU cores, in a way that’s similar to Arm’s Cortex-A7x big cores and Cortex-A5x LITTLE cores with big.LITTLE or DynamIQ processing with the goal of optimizing power consumption. The Intel Alder Lake Mobile SKU stack includes processors for 6 market segments including three “new” segments/TDP ranges according […]
Tiger Lake UP3 single board computer offers quad displays, 2.5 GbE, PCIe Gen4, up to 32GB RAM
Taiwan Commate Computer Inc, also known as just Commell, has unveiled LE-37O 3.5-inch single board computer based on Intel Tiger Lake UP3 embedded processors for industrial applications. The SBC supports up to 32GB DDR4 single-channel memory, up to four displays through DisplayPort, HDMI, VGA, and LVDS interfaces, and offers both Gigabit Ethernet and 2.5 GbE ports, as well as PCIe Gen4 via an M.2 socket. Commell LE-37O specifications: SoC – Intel Tiger Lake UP3 processor with Iris Xe graphics; FBCGA1449 package; 12-28W TDP; default: Core i7-1185G7E quad-core/octa-thread processor; option: Celeron 6305E dual-core processor System Memory – 1x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB non-ECC, unbuffered memory Storage – 2x SATA III ports with RAID 0,1 support, M.2 and mSATA storage (see Expansion section) Video Outputs HDMI port DisplayPort port 24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply; 1x LCD inverter connector VGA connector Quad independent display support Optional […]
End-of-life notice issued for Intel Lakefield hybrid processors
Intel launched Core i3-L13G4 and Core i5-L16G7 penta-core Lakefield Hybrid processors last year with one high-performance Sunny core, and four high-efficiency Atom Tremont cores, in a way that’s similar to what Arm is doing with DynamIQ and before that, big.LITTLE technology. The new processors were found in Lenovo ThinkPad X1 Fold foldable tablet and Samsung Galaxy Book S laptop, both premium products sold for over $2,000. Even some large websites never got hold of a testing sample of those products, and Anandtech has just reported that Intel published a product change notification (PCN) with the title “Select Intel Core Processors with Intel Hybrid Technology, PCN 118334-00, Product Discontinuance, End of Life”. The discontinuance of Lakefield hybrid processors is a shocker considering they were just introduced last year, but I don’t think it will affect many people as I hadn’t heard about any upcoming boards or products based on Intel’s hybrid […]
15.6-inch Panel PC supports Intel Comet Lake socketed processors
AAEON OMNI-2155-CML is an industrial touch panel PC with a 15.6-inch display, and a choice of 10th generation Intel Core and Celeron Comet Lake processors, as well as various I/O features. The system comes with two SO-DIMM sockets for up to 64GB DDR4 RAM, M.2 and SATA storage, dual Gigabit Ethernet, two serial ports, four USB 3.2 ports, and support for a wide input voltage range. AAEON OMNI-2155-CML specifications: Supported socketed processors Intel Core i9-10900TE 10-core/20-thread processor @ 1.80 GHz / 4.50 GHz (Turbo) with 20 MB Smart Cache, Intel UHD Graphics 630 @ 350 MHz / 1.20 GHz; TDP: 35 W Intel Core i7-10700TE 8-core/16-thread processor @ 2.00 GHz / 4.40 GHz with 16 MB Smart Cache, Intel UHD Graphics 630 @ 350 MHz / 1.15 GHz; TDP: 35W Intel Core i5-10500TE 6-core/12-thread processor @ 2.30 GHz / 3.70 GHz with 12 MB Smart Cache, Intel UHD Graphics 630 […]
UP Connect Plus adds 5G support, 3 GbE ports to UP Core Plus, UP Xtreme SBCs
AAEON UP Connect Plus is a carrier board with three Gigabit Ethernet (GbE) ports, and an M.2 slot plus a micro SIM card socket adding support for 5G cellular connectivity to the company’s Appolo Lake-based UP Core Plus and Whiskey Lake-powered UP Xtreme single board computers. UP Connect Plus specifications: Connectivity 3 Gigabit Ethernet RJ45 ports in two configurations: 3x Intel Ethernet Controller I211-AT 3x Intel Ethernet Controller I210-IT with wide temperature and TSN (Time-sensitive Networking) 5G cellular – M.2 3042/3052 colay socket with micro-SIM card port to support 4G/5G modules USB – 1x USB 3.0 Type-A port for UP Core Plus only PCIe – 1x 2 channel PCIe switch SBC connectors – 2x 100-pin high-speed docking connectors Power Supply – 12V/5V from the main board Power Consumption – Approximately 36 to 40 Watts with UP Core Plus + UP Connect Plus Dimensions – 90 mm x 56 mm Temperature […]
Vecow ABP-3000 AI Edge gateway combines Hailo-8 AI accelerator with Intel Whiskey Lake processor
We first discovered Hailo-8 AI accelerator with claims of up to 26 TOPS performance and 3TOPS/W efficiency in October 2020. Since then, we’ve seen several integrate an Hailo-8 M.2 module into their design including EdgeTuring Edge AI camera and Vecow VAC-1000 gateway with a 24-core Foxconn processor. Vecow has now integrated the Hailo-8 AI accelerator into another gateway, but instead of relying on an Arm processor, the Vecow ABP-3000 AI computing system features an 8th generation Intel Core Whiskey Lake processor. Vecow ABP-3000 specifications: SoC – Intel Core i7-8665UE or i3-8145UE quad-core Whiskey Lake processor with Intel UHD Graphics 620; 15W TDP System Memory – 2x DDR4 2400MHz SO-DIMM, up to 64GB Storage – 1x M.2 Key B Socket (PCIe x2/SATA) AI Accelerator – Hailo-8 AI Processor, up to 26 TOPS with TensorFlow, ONNX frameworks support System IO chip – IT8786E Video Output – 2x DisplayPort up to 4096 x […]