Quectel FLM263D 2.4 GHz WiFi 6 and BLE 5.2 RISC-V module supports Amazon Alexa Connect Kit (ACK) SDK for Matter

Quectel FLM263D WiFi 6 Smart Home module

Quectel Wireless FLM263D is a standalone WiFi 6 and Bluetooth 5.2 LE module with a 320 MHz RISC-V microcontroller that supports Alexa Connect Kit (ACK) SDK for Matter for connectivity with Amazon Alexa, Google Home, Samsung SmartThings, Apple HomeKit, and other Matter-compliant Smart Home devices. The module also implements security standards such as secure boot and Mbed TLS encryption. The FLM263D offers certifications such as Works with Alexa (WWA) and supports features such as Matter Simple Setup (MSS) that allows zero-touch setup of Matter-compliant smart home devices through Alexa. Quectel FLM263D specifications: MCU – RISC-V wireless microcontroller up to 320 MHz, with 512KB SRAM and 4MB flash (likely Beken BK7235) Wi-Fi 6 & BLE 5.2 WLAN Protocol – IEEE 802.11b/g/n/ax Wi-Fi Frequency Band – 2.4 GHz Wi-Fi Modulation Mode – CCK, BPSK, QPSK, 16QAM, 64QAM Wi-Fi Operating Mode – AP, STA, STA + AP WiFi Rx sensitivity – Up to […]

Beken BK7256 320 MHz dual-core RISC-V IoT MCU offers WiFi 6, Bluetooth 5.2, JPEG video encoder/decoder

Beken BK7256 development board

Until now, I had only heard about Beken Bluetooth audio chips, but I’ve just been informed the company is also making WiFi chips such as the BK7256 that are notably found in some Tuya Smart Home modules. Beken offers both RISC-V and Arm WiFi and Bluetooth chips with features summarized as follows: BK7235 single-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 LE, 4MB flash, 512KB SRAM, optional 4MB PSRAM BK7236 dual-core Arm MCU up to 120 to 240 MHh with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.3 dual mode, 4MB flash, 512KB SRAM, optional 4MB PSRAM BK7237 dual-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 dual mode, 4 or 8MB flash, 512KB SRAM, optional 4MB PSRAM BK7256 dual-core RISC-V MCU up to 320 MHz with 2.4 GHz WiFi 6 802.11ax and Bluetooth 5.2 […]

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