Linux Category - Page 8 of 580 - CNX Software

September 26, 2024September 25, 2024 by Debashis Das - No Comments

reServer Industrial J501 – An NVIDIA Jetson AGX Orin carrier board with 10GbE, 8K video output, GMSL camera support

Seeed Studio’s reServer Industrial J501, a Jetson AGX Orin carrier board designed for building Edge AI systems. With up to 275 TOPS of exceptional AI performance, this carrier board is designed for advanced robotics and edge AI applications for industrial environments. The carrier board features GbE and 10GbE LAN via RJ45 ports, three USB 3.1 ports, an HDMI 2.1 output, and multiple M.2 slots for expansion, including support for wireless connectivity via the M.2 Key B socket. Additionally, it has support for 8K video decoding and up to 8 GMSL cameras via an optional extension board. reServer Industrial J501 Jetson AGX Orin carrier board specification System-on-Module (one or the other) SoM – NVIDIA Jetson AGX Orin 64GB with CPU – 12-core Arm Cortex-A78AE v8.2 64-bit processor with 3MB L2 + 6MB L3 cache GPU / AI accelerators NVIDIA Ampere architecture with 2048 NVIDIA CUDA cores and 64 Tensor Cores @ […]

September 25, 2024September 25, 2024 by Debashis Das - No Comments

Portwell PEB-2274 3.5-inch fanless Intel Atom x6425E SBC offers triple display support, dual GbE, three M.2 sockets, and more

Portwell has recently launched PEB-2274, a 3.5-inch fanless SBC built around Intel Atom x6425E Elkhart Lake SoC. Key features include up to 32GB DDR4 memory, two Gigabit Ethernet ports, three M.2 sockets for storage and expansion, and a wide 9V to 36V DC power input. Additionally, it has various display interfaces (HDMI, DP, LVDS), multiple serial ports, USB, and audio options. We have already covered several other 3.5-inch inch Elkhart Lake SBCs with dual Ethernet ports including the Avalue ECM-EHL 3.5-inch SBC, Congatec Conga-PA7 Pico-ITX board, the iBase IB836 3.5-inch SBC, and the AAEON GENE-EHL5 SBC. All these boards support dual Ethernet and some of them have support for triple ethernet ports. But what’s unique about the PEB-2274 is that it has dual GbE ethernet, triple display, and a design specifically for industrial applications. Portwell PEB-2274 specifications: SoC – Intel Atom x6425E quad-core processor @ 2.00 GHz / 3.00 GHz […]

September 25, 2024September 24, 2024 by Jean-Luc Aufranc (CNXSoft) - 11 Comments

Intel RealSense Depth Module D421 offers a low-cost depth-sensing solution at just $80

Intel RealSense Depth Module D421 is an entry-level stereo depth module with a 0.2 to 3-meter recommended range, a global shutter to capture motion without artifacts, and a 75° × 50° field of view (FoV). Intel has made RealSense Depth cameras for years, including the popular RealSense D435i with 6 DoF tracking introduced in 2018 that currently sells for about $320. But not all projects need the most advanced features and/or are viable when needing to spend several hundred dollars on the camera itself. The RealSense Depth Module D421 is a much cheaper way to integrate depth-sensing into projects at a much lower price point. It’s fairly similar to the earlier D435 but lacks an RGB camera. Intel RealSense Depth Module D421 specifications: Based on the Intel D4 Vision Processor Image sensor technology – Global Shutter Recommended Range – 0.2 m to over 3 m (varies with lighting conditions) Depth […]

September 24, 2024September 24, 2024 by Sayantan Nandy - 5 Comments

D-Robotics RDK X3 Development Board features Sunrise X3 quad-core Arm Cortex-A53 SoC with a 5TOPS “Bernoulli” BPU

The D-Robotics RDK X3 development board is designed for edge AI applications and features a Sunrise X3 quad-core Arm Cortex-A53 processor running at 1.5GHz with a dual-core BPU (Brain Processing Unit) with 5 TOPS of edge inference capability. The board includes a 40-pin GPIO interface, ensuring compatibility with Raspberry Pi 4B accessories for versatile project development. The RDK X3 offers 2GB or 4GB of LPDDR4 RAM and includes a MicroSD card slot for storage expansion. Designed for real-time applications like robot control and intelligent monitoring, its 5 TOPS inference capability makes it ideal for computer vision workloads such as object detection, body segmentation, scene parsing, etc… Previously, we covered the Horizon X3 AI development board, which uses the same Horizon Robotics Sunrise X3 processor. We’ve also written about several other edge AI development boards, including the Synaptics Astra Platform SL1680, SagireEdge AI 600, and MYiR Tech’s MYC-LR3568. Feel free to […]

September 20, 2024September 20, 2024 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

ASUS Tinker Board 3 – A credit-card sized Rockchip RK3566 SBC with 12V to 19V DC input

ASUS Tinker Board 3 is a credit card-sized SBC based on Rockchip RK3566 SoC with an HDMI port, a 3.5mm audio jack, gigabit Ethernet, an M.2 socket for WiFi and Bluetooth, four USB ports, and a 40-pin GPIO header with a layout similar to the Raspberry Pi 3 Model B. When I first wrote about the Tinker Board 3 in 2023, it was a larger (100 x 100 mm) SBC based on Rockchip RK3568 SoC that was later renamed to Tinker Board 3N, now also available as a complete rugged system (more about that in a subsequent post). The new Tinker Board 3 (2024) is a completely different design that competes against Radxa ROCK 3C and Orange Pi 3B boards also based on RK3566 and offered in a business card/credit card form factor similar to the Raspberry Pi 3B. Tinker Board 3 specifications: SoC – Rockchip RK3566 CPU – Quad-core […]

September 19, 2024 by Debashis Das - 1 Comment

AAEON GENE-ASL6 – A 3.5-inch industrial Amston Lake SBC with triple display interfaces and triple 2.5GbE

AAEON GENE-ASL6 is an Intel Atom x7000RE-series Amston Lake powered 3.5-inch single board computer (SBC) featuring three 2.5GbE RJ45 ports and three independent display outputs via HDMI, LVDS, and VGA. The GENE-ASL6 can be configured with up to 16GB of LPDDR5 memory and supports a variety of storage options including SATA, mSATA, and M.2 NVMe SSD options. There is also an M.2 2230 E-Key slot for Wi-Fi and Bluetooth connectivity and the other M.2 3052 B-Key slot can be used for storage or to connect 4G or 5G modules. Other than that, this board features a variety of connectivity options including USB 3.2 Gen 2 ports, serial ports, GPIO, SMBus/I2C, optional audio header, and much more. AAEON GENE-ASL6 3.5-inch industrial SBC specification Amston Lake SoC (one or the other) Intel Atom x7213RE dual-core processor @ 2.0 to 3.4 GHz with 6MB cache, 16EU Intel UHD graphics; 9W TDP Intel Atom x7433RE […]

September 18, 2024 by Sayantan Nandy - No Comments

Vecow RAC-1000 rugged Edge AI systems feature NVIDIA Jetson AGX Orin, waterproof ports, GMSL2 camera connectors

Vecow RAC 1000 Jetson AGX Orin computing system

Vecow’s RAC-1000 series Edge AI systems are powered by NVIDIA Jetson AGX Orin 32GB or 64GB system-on-modules, offering up to 275 TOPS of AI performance. These systems are energy-efficient and come with rugged I/O options and an IP67-rated enclosure, making them suitable for AI and robotics applications such as automated agricultural machinery, construction automation, and mobile robotics in extreme outdoor conditions. The series includes two models: the RAC-1000, which supports 8 GMSL2 cameras through FAKRA-Z connectors for autonomous mobile robots, agricultural vehicles, and ADAS; and the RAC-1100, which features 6 GigE LAN ports with 4 PoE+ for vision AI applications. Both models are built for industrial environments and support various AI-driven tasks. As you may know, we’ve previously covered several Vecow AI computing systems, including EAC-5000, EVS-3000, TGS-1000 Series, SPC-9000 fanless embedded system, ECX-3200, and EPBC-1000. Feel free to explore these options if you’re interested. The Vecow RAC-1000 series specifications: […]

September 17, 2024September 16, 2024 by Tomisin Olujinmi - 6 Comments

Teledatics HaloMax Wi-Fi HaLow LGA or M.2 module supports over 1000 clients, have been tested at a 100+km range (Crowdfunding)

Teledatics has launched a crowdfunding campaign for the TD-HALOM HaloMax Wi-Fi HaLow module available in LGA and M.2 form factors for long-range and low-power connectivity, as well as HaLow development boards based on the module and various daughterboards for expansion. The wireless module, powered by Newracom’s NRC7394 SoC, is the product of a collaboration between Newracom and Teledatics. According to Zac Freeman, VP of Marketing & Sales at Newracom, the HaloMax module is “the highest output power Wi-Fi HaLow module available on the market. The Teledatics TD-HALOM module transmits at the highest allowable FCC power output and offers a Maximum Range HaLow solution.” Earlier this year, Teledatics broke the record for the longest distance for a Wi-Fi HaLow connection using the HaloMax wireless module and TE Connectivity Yagi antennas. Two Raspberry Pi 4 Model B units were able to communicate over a distance of 106km between Mount Greylock and Mount […]