Linux Category - Page 40 of 588 - CNX Software

April 17, 2024April 17, 2024 by Tomisin Olujinmi - 1 Comment

congatec conga-SA8 Amston Lake SMARC modules are targeted at industrial edge applications

Congatec’s new conga-SA8 SMARC modules are powered by the Intel Atom x7000RE “Amston Lake” processors. With twice the processing cores and similar power consumption to the previous generation, congatec’s new credit-card-sized modules are “intended for future-facing industrial edge computing and powerful virtualization.” An Intel Core i3‑N305 Alder Lake-N processor is also offered as an alternative to the Intel Atom x7000RE series for high-performance IoT edge applications. The conga-SA8 modules support up to 16GB LPDDR5 onboard memory, 256GB eMMC 5.1 onboard flash memory, and offer several high-bandwidth interfaces such as USB 3.2 Gen 2, PCIe Gen 3, and SATA Gen 3. The integrated Intel UHD Gen 12 graphics processing unit has up to 32 execution units and can power three independent 4K displays. The conga-SA8 is described as virtualization-ready and has a hypervisor (virtual machine monitor) integrated into the firmware. The RTS hypervisor takes complete advantage of the eight processing cores […]

April 17, 2024April 16, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

RAKwireless launches SX1303 based M.2 LoRaWAN concentrator modules and full-duplex gateway

Wislink M.2 2242 2280 LoRaWAN SX1303 concentrator modules

RAKwireless has recently introduced two new LoRaWAN products with the RAK5166/67 WisLink M.2 3042/2280 concentrator module based on the Semtech SX1303 RF transceiver and the RAK7285 WisGate Edge Ultra Full-Duplex gateway for high-density network deployments, particularly for smart city infrastructure, metering applications, and other scenarios requiring reliable two-way communication at scale. RAK5166 and RAK5167 M.2 3042 and 2280 LoRaWAN concentrator modules RAK5166/RAK5167 specifications: Wireless Semtech SX1303 baseband processor with 8 x 8 channels LoRa packet detectors, 8x SF5-SF12 LoRa demodulators, 8x SF5-SF10 LoRa demodulators, one 125/250/500 kHz high-speed LoRa demodulator, and one (G)FSK demodulator Tx power up to 27 dBm Rx sensitivity down to -139 dBm @ SF12, BW 125 kHz Supports global license-free frequency band (EU868, IN865, RU864, US915, AU915, KR920, AS923-1, AS923-2, AS923-3, AS923-4) Listen Before Talk (LBT) support Fine Timestamp Built-in ZOE-M8Q GPS module (optional) 2x MHF4 IPEX connectors for the LoRa and GNSS (optional) antennas Host […]

April 16, 2024April 16, 2024 by Jean-Luc Aufranc (CNXSoft) - 44 Comments

ODROID-H4 – A Compact Alder Lake N-Series SBC with up to dual 2.5GbE and four SATA III ports

Hardkernel has just launched an upgrade to their ODROID-H3/H3+ Jasper Lake SBC, with the ODROID-H4, ODROID-H4+, and ODROID-H4 Ultra boards powered by Intel Processor N97 or Intel Core i3-N305 Alder Lake N-Series processors. The ODROID-H4 family supports up to 48GB DDR5-4800 memory and NVMe SSD storage, comes with up to two 2.5GbE, four SATA III ports, three 4K capable video output ports (HDMI and DisplayPort), a range of USB ports, and a 24-pin GPIO header. ODROID-H4 specifications compared to previous generation ODROID-H2+ and ODROID-H3 boards. The GPIO header offers the following interfaces for all models except for the ODROID-H2+: 2x I2C, 3x USB 2.0, 1x UART, 1x HDMI-CEC, ext. power button. The H2+ header has similar interfaces, but only one USB 2.0 and two UART. Some may note the maximum RAM capacity numbers differ from the data on Intel Ark, but the latter is not usually correct, and Hardkernel have […]

April 15, 2024April 14, 2024 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Qualcomm RB3 Gen 2 Platform with Qualcomm QCS6490 AI SoC targets robotics, IoT and embedded applications

Qualcomm had two main announcements at Embedded World 2024: the ultra-low-power Qualcomm QCC730 WiFi microcontroller for battery-powered IoT devices and the Qualcomm RB3 Gen 2 Platform hardware and software solution designed for IoT and embedded applications based on the Qualcomm QCS6490 processor that we’re going to cover today. The kit is comprised of a QCS6490 octa-core Cortex-A78/A55 system-on-module with 12 TOPS of AI performance, 6GB RAM, and 128GB UFS flash connected to the 96Boards-compliant Qualcomm RBx development mainboard through interposer, as well as optional cameras, microphone array, and sensors. Qualcomm QCS6490/QCM6490 IoT processor Specifications: CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU – Adreno 643L GPU @ 812 MHz with support for Open GL ES 3.2, Open CL 2.0, Vulkan 1.x, DX FL 12 DSP – Hexagon […]

April 12, 2024November 13, 2024 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

April 12, 2024April 12, 2024 by Tomisin Olujinmi - 1 Comment

SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

Bedrock 8000 AMD Ryzen Embedded 8000 industrial PC

Israeli embedded systems manufacturer, SolidRun, has recently introduced the Bedrock R8000, a new fanless, Industrial PC targeted at edge AI applications. The Bedrock R8000 integrates the newly-announced AMD Ryzen Embedded 8000 series processors with 8 Zen 4 cores and 16 threads clocked at up to 5.1 GHz. The Ryzen Embedded 8000 Series has a 16 TOPS NPU for AI workloads and offers up to 10 years of guaranteed availability. Also, up to 3 AI accelerators (either Hailo-10 or Hailo 8) can be combined with the onboard NPU to achieve over 100 TOPS for generative or inferencing AI workloads. Apart from the Ryzen Embedded 8000 series, the Bedrock R8000 series also supports other Accelerated Processing Units (APU) in the “Hawk Point” family. The CPU power limit can be adjusted in the BIOS within a range of 8W to 54W. Memory goes up to 96GB DDR5 ECC/non-ECC and three NVME PCIe Gen4 […]

April 12, 2024April 11, 2024 by Debashis Das - 6 Comments

8devices TobuFi SoM is designed for drones, robotics, and advanced audio systems

8devices has recently introduced TobuFi, a Qualcomm QCS405-powered System-on-Module (SoM) featuring dual-band Wi-Fi 6 and Wi-Fi 5 capabilities. The device also features 1GB LPDDR3, 8GB of eMMC storage, and multiple display resolutions. It also offers various interfaces, including USB 3.0, HDMI, I2S, DMIC, SDC, UART, SPI, I2C, and GPIO. In previous posts, we covered 8devices product launches like the Noni M.2 WiFi 7 module, Rambutan and Rambutan-I modules, Habanero IPQ4019 SoM, Mango-DVK OpenWrt Devkit, and many more innovative products. If you’re interested in 8devices, feel free to check those out for more details. 8devices TobuFi SoM specifications: SoC – Qualcomm QCS405 CPU – Quad-core Arm Cortex-A53 at 1.4GHz; 64-bit GPU – Qualcomm Adreno 306 GPU at 600MHz; supports 64-bit addressing DSP – Qualcomm Hexagon QDSP6 v66 with Low Power Island and Voice accelerators Memory – 1GB LPDDR3 + 8GB eMMC Storage 8GB eMMC flash SD card – One 8-bit (SDC1, 1.8V) and one […]

April 12, 2024August 20, 2024 by Jean-Luc Aufranc (CNXSoft) - 22 Comments

Orange Pi 5 Pro – A low-cost Rockchip RK3588S SBC with up to 16GB LPDDR5 RAM, dual HDMI video output

As mentioned in the Orange Pi Developer Conference 2024 article, the Orange Pi 5 Pro launch was just around the corner, and the latest Rockchip RK3588S SBC is now available on Amazon or Aliexpressfor $109 and up with 16GB LPDDR5 RAM, but cheaper 4GB ($60) and 8GB ($80) variants are coming soon. One would think the Orange Pi 5 Pro would be an evolution of the Orange Pi 5 SBC with LPDDR4 memory, and in some ways it is, but there are enough changes to display ports, storage, wireless, GPIO header, and even the form factor that make a direct comparison challenging. Orange Pi 5 Pro specifications: SoC – Rockchip RK3588S CPU – Octa-core processor with 4x Cortex-A76 cores @ up to 2.4 GHz, 4x Cortex-A55 cores @ up to 1.8 GHz GPU – Arm Mali-G610 MP4 GPU with OpenGL ES 3.2, OpenCL 2.2, and Vulkan 1.2 support VPU – […]