Horizon X3 AI development board is powered by Sunrise 3 AI Edge Arm processor

Horizon X3 AI development board

Horizon X3 AI development board is powered by Horizon Robotics Sunrise 3 (aka X3) quad-core Cortex-A53 processor with a 5 TOPS NPU, and multiple camera support with the chip apparently designed for the automotive industry. [Update January 25, 2022: A third-party company, Finsbury Glover Hering, claiming to represent Horizon Robotics informed CNX Software the chip is not designed for the automotive market, and that Horizon’s AIoT business is actually limited to the domestic China market and not overseas.] The devkit is comprised of a Sunrise 3 system-on-module with 1GB LPDDR4 & 16GB EMMC memory, as well as a baseboard with Gigabit Ethernet and WiFi, HDMI up to 1080p60 and MIPI DSI interface, a camera interface, and a 40-pin header for expansion. Horizon X3 AI development board specifications: SoC – Horizon Robotics Sunrise 3 quad-core Cortex-A53 processor @ 1.2 GHz, one Cortex-R5 core, a 5 TOPS NPU (2x “Bernoulli” BPU) System […]

6x GbE Intel Tiger Lake network appliance supports pfSense

Tiger Lake pfSense Network Appliance

If you’re after a network appliance with a recent processor and supporting pfSense you may be in luck. HUNSN RS36a is a mini PC-like device that comes with six Gigabit Ethernet ports, and features an Intel Core i5-1135G7 Tiger Lake processor with support for up to 64GB RAM, 2.5-inch SATA and mSATA SSD that is sold on Amazon for $527.99 and up. The company says the system is compatible with many FreeBSD-based router systems, Linux distros, and Windows operating systems., and it has already been tested with pfSense, Untangle, OPNsense, and other open-source solutions for firewalls, VPN, network security, and so on. HUNSN RS36a specifications: SoC – Intel Core i5-1135G7 quad-core Tiger lake processor @ 2.50 GHz / 4.2 GHz (Turbo) with 8MB cache, 80EU Intel Iris Xe graphics; 15W TDP Syste Memory – 2x SODIMM DDR4-3200, up to 64GB RAM Storage – 1x mSATA SSD socket, 1x 2.5-inch SATA […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

Intel unveils Alder Lake desktop and mobile IoT processors

Intel Alder Lake-H Mobile IoT processsor

Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]

The Linux kernel could soon be 50 to 80% faster to build

Linux kernel build faster

The Linux kernel takes around 5 minutes (without modules) to build on an Intel Core i5 Jasper Lake mini PC with 16 GB RAM and a fast SSD based on our recent review of Beelink GTi 11 mini PC. Kernel developers may have to build for different targets and configurations, plus all modules so the build times may add up. While it is always possible to throw more hardware to quicken the builds, it would be good if significantly faster builts could be achieved with software optimizations. That’s exactly what Ingo Molnar has been working on since late 2020 with his “Fast Kernel Headers” project aiming to eliminate the Linux kernel’s “Dependency Hell”. At the time he aimed for a 20% speedup, but a little over one year later, the results are much more impressive with 50 to 80% faster builds depending on the target platform (x86-64, arm64, etc…) and […]

Year 2021 in review – Top 10 posts and statistics

cnx software happy new year 2022

As per tradition, we’ll look back at what happened during the year in the last post, and see what 2022 may have in store, plus the usual statistics from CNX Software website. The biggest story of 2021 has to be the worsening of semiconductors shortages with extremely long lead times, prices of some components going up multiple folds, constant complaints on Twitter about availability and prices. I think I even saw a website, hopefully misconfigured, showing an estimated availability of a specific STM32 MCU in 2037. This also gave rise to opportunities and board redesigns, with MotorComm Ethernet chips replacing some Realtek chips in SBCs such as NanoPi R2C and  Orange Pi R1S Plus LTS, and CH9102F showing up as a replacement for CP2104 in some IoT boards. We also got some interesting Arm processors, but sadly the high-expected Rockchip RK3588 got delayed by another year, although it’s getting really […]

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

NanoCOM-TGU

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces.   NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

Sipeed Lichee RV RISC-V module gets $5+ carrier board with HDMI and USB ports, optional WiFi

Sipeed Lichee RV Starter Kit

Sipeed introduced the Lichee RV Allwinner D1 Linux RISC-V board going for just $17 with 512MB RAM last month. While with a USB-C port it could be used as a standalone part, its dual M.2 connector makes it more like a module and we noted a tiny carrier board was in the works at the time. The baseboard is now available and known as the Lichee RV Dock adding HDMI and USB ports, as well as a 40-pin GPIO header for just $5, or $8 if you’d like to get Wi-Fi 4 and Bluetooth 4.2 connectivity through a Realtek RTL8723DS module. Sipeed Lichee RV Dock specifications: Supported system-on-module (SoM) – Lichee RV module with Allwinner D1 RISC-V processor @ 1 GHz, 512MB DDR3, MicroSD card slot, and USB Type-C OTG port Storage – Optional SPI flash Display interfaces HDMI port up to 4Kp30 Optional RGB interface for up to 720p30 […]

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