Some will say “finally!” After years of waiting for Rockchip RK3588 processor, ROCKPi Trading Limited/Radxa got some samples for their ROCK5 Model B single board computer and has started to take pre-orders with discounted prices starting at $79 through distributors. But let’s check out the specifications first, with the octa-core Cortex-A76/A55 Pico-ITX SBC shipping with up to 16GB RAM, M.2 NVMe storage, 2.5GbE, optional WiFi 6E, 8K video output via HDMI or USB-C ports, 4K HDMI input, and more. Radxa ROCK5 Model B (aka ROCK 5B) specifications: SoC – Rockchip RK3588 octa-core processor with four Cortex-A76 cores @ 2.4 GHz, four Cortex-A55 cores @ 1.8 GHz, an Arm Mali G610MC4 GPU, a 6TOPS NPU, 8K 10-bit decoder, 8K encoder System Memory – 4GB, 8GB, or 16GB LPDDR4x Storage M.2 2280 socket for NVMe SSD (PCIe 3.0 x4) up to 2,000 MB/s MicroSD card socket eMMC flash socket Video Output 2x […]
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)
congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]
Horizon X3 AI development board is powered by Sunrise 3 AI Edge Arm processor
Horizon X3 AI development board is powered by Horizon Robotics Sunrise 3 (aka X3) quad-core Cortex-A53 processor with a 5 TOPS NPU, and multiple camera support with the chip apparently designed for the automotive industry. [Update January 25, 2022: A third-party company, Finsbury Glover Hering, claiming to represent Horizon Robotics informed CNX Software the chip is not designed for the automotive market, and that Horizon’s AIoT business is actually limited to the domestic China market and not overseas.] The devkit is comprised of a Sunrise 3 system-on-module with 1GB LPDDR4 & 16GB EMMC memory, as well as a baseboard with Gigabit Ethernet and WiFi, HDMI up to 1080p60 and MIPI DSI interface, a camera interface, and a 40-pin header for expansion. Horizon X3 AI development board specifications: SoC – Horizon Robotics Sunrise 3 quad-core Cortex-A53 processor @ 1.2 GHz, one Cortex-R5 core, a 5 TOPS NPU (2x “Bernoulli” BPU) System […]
6x GbE Intel Tiger Lake network appliance supports pfSense
If you’re after a network appliance with a recent processor and supporting pfSense you may be in luck. HUNSN RS36a is a mini PC-like device that comes with six Gigabit Ethernet ports, and features an Intel Core i5-1135G7 Tiger Lake processor with support for up to 64GB RAM, 2.5-inch SATA and mSATA SSD that is sold on Amazon for $527.99 and up. The company says the system is compatible with many FreeBSD-based router systems, Linux distros, and Windows operating systems., and it has already been tested with pfSense, Untangle, OPNsense, and other open-source solutions for firewalls, VPN, network security, and so on. HUNSN RS36a specifications: SoC – Intel Core i5-1135G7 quad-core Tiger lake processor @ 2.50 GHz / 4.2 GHz (Turbo) with 8MB cache, 80EU Intel Iris Xe graphics; 15W TDP Syste Memory – 2x SODIMM DDR4-3200, up to 64GB RAM Storage – 1x mSATA SSD socket, 1x 2.5-inch SATA […]
COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor
We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]
Intel unveils Alder Lake desktop and mobile IoT processors
Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]
The Linux kernel could soon be 50 to 80% faster to build
The Linux kernel takes around 5 minutes (without modules) to build on an Intel Core i5 Jasper Lake mini PC with 16 GB RAM and a fast SSD based on our recent review of Beelink GTi 11 mini PC. Kernel developers may have to build for different targets and configurations, plus all modules so the build times may add up. While it is always possible to throw more hardware to quicken the builds, it would be good if significantly faster builts could be achieved with software optimizations. That’s exactly what Ingo Molnar has been working on since late 2020 with his “Fast Kernel Headers” project aiming to eliminate the Linux kernel’s “Dependency Hell”. At the time he aimed for a 20% speedup, but a little over one year later, the results are much more impressive with 50 to 80% faster builds depending on the target platform (x86-64, arm64, etc…) and […]
Year 2021 in review – Top 10 posts and statistics
As per tradition, we’ll look back at what happened during the year in the last post, and see what 2022 may have in store, plus the usual statistics from CNX Software website. The biggest story of 2021 has to be the worsening of semiconductors shortages with extremely long lead times, prices of some components going up multiple folds, constant complaints on Twitter about availability and prices. I think I even saw a website, hopefully misconfigured, showing an estimated availability of a specific STM32 MCU in 2037. This also gave rise to opportunities and board redesigns, with MotorComm Ethernet chips replacing some Realtek chips in SBCs such as NanoPi R2C and Orange Pi R1S Plus LTS, and CH9102F showing up as a replacement for CP2104 in some IoT boards. We also got some interesting Arm processors, but sadly the high-expected Rockchip RK3588 got delayed by another year, although it’s getting really […]