The HL7900 5G LPWA module from Semtech (Sierra Wireless) is a globally certified solution built around Sony’s Altair ALT1350 chip and designed for low-power IoT applications. It is certified by major U.S. carriers, including AT&T, T-Mobile, and Verizon, as well as Japan’s KDDI, and has achieved global regulatory certifications (FCC, CE, ISED, etc.) and industry certifications (PTCRB, GCF) for carrier interoperability. This chip features an ultra-low-power sensor hub MCU for efficient environmental monitoring. Additionally, it includes integrated sub-GHz and 2.4GHz radios supporting short-range protocols such as Wi-SUN including U-Bus Air, NB-IoT, and 5G NTN along with GNSS and Wi-Fi-based indoor/outdoor tracking. Furthermore, this chip supports embedded SIM support, secure edge-to-cloud connectivity, and over-the-air updates. These features make this chip useful for applications such as asset tracking, urban navigation, and other IoT solutions requiring reliable, low-power connectivity with global reach. Semtech HL7900 specifications: MCU – Sony ALT1350 5G cellular IoT chip […]
Infineon PSOC Control C3x real-time Cortex-M33 MCUs are designed for motor control and HVAC systems
Infineon recently launched the PSOC Control C3x family of Arm Cortex-M33 MCUs for real-time control applications in motor control and power conversion systems. The family includes 18 MCUs categorized into two lines, the Entry Line (C3P2, C3M3) and the Main Line (C3P5, C3M5). These MCUs can be used for various applications including home appliances, industrial drives, robots, light electric vehicles (LEVs), solar systems, and HVAC systems. The Entry Line operates at up to 100 MHz and supports a 12-bit SAR ADC with a sampling rate of up to 6 Msps, making it suitable for basic motor control and power conversion tasks. In contrast, the Main Line offers higher performance with up to 180 MHz operation, a faster 12-bit SAR ADC up to 12 Msps, and 4-channel High-Resolution PWM (HRPWM) for precise control. It also supports Wide Bandgap (WBG) switches for high-frequency power systems. Other features of this MCU include DSPs, FPUs, […]
NXP EdgeLock A30 Secure Authenticator chip enables battery authentication for compliance with EU regulation 2023/1542
NXP recently launched the EdgeLock A30 Secure Authenticator chip, a Common Criteria EAL 6+ certified secure authentication designed for IoT devices, including battery authentication applications. It complies with the EU’s Batteries Regulation 2023/1542, which mandates the inclusion of a Digital Product Passport (DPP), by 2027 to ensure traceability, sustainability, and safety in battery manufacturing and recycling. Alasdair Ross, Senior Director, NFC IoT Security, NXP explains: Secure authentication helps to ensure brand protection, consumer safety, and product traceability, fostering trust and shielding devices from physical damage. Smaller than a grain of rice, the EdgeLock A30 is designed to fit into even the smallest of devices. It supports multiple authentication use cases, making it easier for developers to support a variety of devices and accessories with a single solution, including device to device, cloud to device, counterfeit protection, and storage or protection of device identity. To address these requirements NXP’s EdgeLock A30 […]
STM32H7-powered open-source hardware 3D printer mainboard supports up to 6 stepper drivers
Designed by Boltz R&D, the SmartPrintCoreH7x 3D printer mainboard is an open-source mainboard built around an STM32H7 microcontroller and designed to work with 3D printers from Creality, Anet, and Voron. It supports up to 6 stepper drivers (5 standard drivers plus 1 dedicated driver) and can be expanded further using the “SmartPrintCore Extravaganza” module for additional stepper drivers. Key features of this motherboard include a jumper-less setup, automatic power source switching, and support for both 12V and 24V power supplies. It uses high-efficiency TI buck converters to provide power for multiple fan and servo ports, and there is a dedicated power supply for peripherals, SBCs, and Wi-Fi modules. The board is equipped with a variety of connectors, including Molex, Ultra-Fit, Mini-Lock, and JST-GH for power, motors, and peripherals. SmartPrintCoreH7x specifications: MCU – STMicro STM32H723 Arm Cortex-M7 32-bit core @ 550 MHz with 1MB Flash, 564 KB RAM, FPU, DSP, Ethernet, USB […]
Phison’s aiDAPTIV+ AI solution leverages SSDs to expand GPU memory for LLM training
While looking for new and interesting products I found ADLINK’s DLAP Supreme series, a series of Edge AI devices built around the NVIDIA Jetson AGX Orin platform. But that was not the interesting part, what got my attention was it has support for something called the aiDAPTIV+ technology which made us curious. Upon looking we found that the aiDAPTIV+ AI solution is a hybrid (software and hardware) solution that uses readily available low-cost NAND flash storage to enhance the capabilities of GPUs to streamline and scale large-language model (LLM) training for small and medium-sized businesses. This design allows organizations to train their data models on standard, off-the-shelf hardware, overcoming limitations with more complex models like Llama-2 7B. The solution supports up to 70B model parameters with low latency and high-endurance storage (100 DWPD) using SLC NAND. It is designed to easily integrate with existing AI applications without requiring hardware changes, […]
Intel N50 fanless open-frame panel PCs features 7” and 10” PCAP touch display, HDMI 2.0a, RS-485/232
BCM Advanced Research has recently introduced two new fanless open-frame panel PCs powered by an Intel Processor N50 CPU – the OFT07W-ADLN (7-inch) and OFT10W-ADLN (10-inch) – which are low-cost all-in-one embedded computers designed for tablet-like usability. Both modules feature 8GB LPDDR5 memory, 64GB eMMC storage, and an M.2 E-key slot for Wi-Fi/Bluetooth connectivity. These panel PCs come with PCAP touchscreens (800×1280 for 7-inch and 1200×1920 for 10-inch) with various connectivity options including USB, HDMI 2.0a, RS-232/485, and Gigabit Ethernet. With 12-24V DC input supply, fanless operation, and a durable steel frame, these compact open-frame panel PCs are meant for space-constrained applications like HMIs, self-service kiosks, gaming consoles, medical terminals, smart vending machines, digital signage, and more. BCM OFT07W-ADLN and OFT10W-ADLN specifications: SoC – Intel Processor N50 dual-core processor up to 3.4 GHz with 6MB cache, 16EU Intel UHD Graphics; TDP: 6W System Memory – Up to 8GB LPDDR5 onboard Storage – […]
Waveshare ESL color e-paper displays support Bluetooth & NFC, offer 5-year battery life, cloud management
Waveshare recently launched a series of dot matrix ESL color e-paper displays with Bluetooth and NFC connectivity designed for various IoT, retail, industrial, and similar applications. These Electronic Shelf Label (ESL) displays can be updated through a wireless base station that enables device management using Waveshare’s cloud platform. The displays come with a 1,200mAh coin cell battery which according to Waveshare can last approximately 5 years and support four colors: red, yellow, black, and white. With a wide 178° viewing angle and housed in a durable ABS plastic case, they are ideal for applications such as price tags, shelf labels, asset tracking, and conference name tags. Waveshare ESL color e-paper displays specifications Display technology – E-Paper (Electrophoretic) Display colors – Red, Yellow, Black, White Display sizes – 2.13″, 2.66″, 2.9″, 3.5″ (Dot Matrix) Resolution / Pixel density / Display area 2.13″ – 250 × 122 pixels / 130 DPI / 48.55 × […]
SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications
SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.
The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.