If you ever wanted to develop applications for the latest Qualcomm Snapdragon processor, Intrinsyc is always the first company to provide Snapdragon hardware development kits and we’ve covered many over the years including Open-Q 845 HDK and Open-Q 855 HDK.
The company has recently been bought by Lantronix, a provider of solutions for the Internet of Things (IoT) and Out of Band Management (OOBM), and we covered one of their products – an RJ45 connector running Linux – over 6 years ago.
Lantronix Snapdragon 865 Mobile Hardware Development Kit is the first devkit announced since the acquisition. The board is powered by the latest Snapdragon 865 (SM8250) processor combined with 6GB LPDDR5 RAM, 128GB UFS 3.0 storage. The development kit currently supports Android 10, but it will be one of the first hardware to officially run Android 11 just previewed by Google.
Snapdragon 865 Mobile HDK specifications:
- SoC – Qualcomm Snapdragon 865 (SM8250) mobile platform with
- CPU – Octa-core Kryo 585 processor featuring 1x high-performance Gold Prime core (Cortex-A77 class) at 2.84 GHz, 3x high-performance Gold cores (Cortex-A77 class) at 2.42 GHz, 4x low-power Kryo cores (Cortex-A55 class) at 1.8 GHz
- GPU – Qualcomm Adreno 650 GPU
- DSP – Qualcomm Hexagon 698 DSP
- ISP – Qualcomm Spectra 480 Image Sensor Processor
- System Memory – 6GB LPDDR5 PoP RAM
- Storage – 128GB UFS3.0 Flash; 1x microSD/UFS Card Socket
- Display Interfaces
- 2x 4-Lane MIPI DSI DPHY or 2x 3-Trio MIPI DSI CPHY via 2x 60-pin High-Speed Display Connector
- Optional Display/Expansion board mates to DSI connectors
- HDMI 2.0 via DSI -> HDMI bridge chip (on-board), up to 4K @ 60Hz
- DisplayPort 1.4 over USB3.1 Type-C
- Video
- Adreno VPU 665 fifth-generation UHD Video Processing Unit supporting video decode up to 4K240 or 8K60, video encode up to 4K120 or 8K30
- Concurrent 4K60 decode and 4K30 encode for wireless display
- New computer vision processor (CVP) for object detection and tracking
- Camera Interfaces
- 4x 4-Lane MIPI CSI camera ports with separate I2C control busses (CCI0/1/2/3) on 160-pin expansion header for the optional camera board
- Support for 3D Camera Configuration
- Additional 2x 4-Lane MIPI CSI camera ports available on high-speed expansion header
- Audio
- Qualcomm WCD9385 audio codec on-board
- 3.5mm headphone output
- Audio Expansion Headers – 1x loud-speaker output, 1x earpiece output, 2x Analog MIC input, 5x Digital MIC input
- Wireless Connectivity
- Qualcomm Wi-Fi 6 (QCA6391) 802.11a/b/g/n/ac/ax 2×2 with MU-MIMO
- Bluetooth 5.1 + HS and backward compatible with 1.x, 2.x + EDR
- On-board PCB trace antennas
- USB
- 1x USB3.1 Gen 2 (10.0 Gbps) Type-C with DisplayPort video out
- 2x USB 3.0 Type-A host via on-board hub
- 1x USB micro-B debug UART
- Expansion
- M.2 socket with 2-lane PCIe Gen3
- Sensor expansion headers
- Low-speed GPIO expansion header
- Power Supply
- 12V/5A input from a wall adapter or battery
- Qualcomm Power and battery management (PM8250, PM8150A, PM8150B, and PM8009)
- Dimensions – 100 x 85 mm
Lantronix provides several optional accessories for the development board including a camera accessory board with a 20MP Front Camera, 16MP+ 5MP Rear Camera, and TOF Sensor, a display + expansion board with a 5.99″ AMOLED WQHD (1440 x 2880) display with touchscreen, audio connectors, additional sensor connectors, and a JTAG connector. as well as a sensor accessory board.
Lantronix/Intrinsyc Snapdragon 865 Mobile Hardware Development Kit and accessories can be purchased now with the board going for $1,149 on the company’s online store. Further details may be found on the product page.
Via LinuxGizmos
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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Actually the Intrinsyc brand will keep being used, even though the company is now part of Lantronix. I know as I asked: