Panasonic industry has recently introduced the PAN B511-1C Bluetooth 6.0 and 802.15.4 module based on the Nordic Semi nRF54L15 SoC and designed for ultra-low-power wireless communication.
The compact module integrates a chip antenna, 32MBit flash memory, two Crystals, and the Nordic nRF54L51 which provides a 128 MHz Arm Cortex-M33 microcontroller with Bluetooth 6.0 (LE), Thread, Zigbee, and Matter, along with multiple peripherals such as SPI, UART, I2S, PWM, and ADC. The PAN B511-1C also implements security features to support secure boot, secure firmware updates, cryptographic acceleration, and tamper detection, making it suitable for a range of IoT, industrial automation, smart home, medical (wearables), and battery-powered applications.
PAN B511-1C module specification:
- SoC – Nordic Semiconductor nRF54L15
- MCU cores
- Arm Cortex-M33 with Arm TrustZone @ 128MHz
- RISC-V coprocessor for software-defined peripheral
- Memory – 256KB SRAM
- Storage – 1.5MB non-volatile memory
- Wireless
- Bluetooth 6.0
- Data rates – 2Mbps, 1Mbps, 500kbps, 125kbps
- Features
- AoA / AoD
- Channel Sounding
- 802.15.4 radio for Thread / Zigbee / Matter
- Nordic Proprietary 2.4 GHz protocol up to 4 Mbps
- Frequency – 2402 to 2480 MHz
- Tx Power – Up to +8dBm
- Rx Sensitivity (Bluetooth) – -98 dBm at 1 Mb/s and -106 dBm at 125 kb/s in LE-mode (long range)
- Bluetooth 6.0
- MCU cores
- Antenna – on-board chip antenna with an RF-bottom pad
- Peripherals
- 32x GPIOs
- High-speed SPI/UART
- 4x SPI/UART/TWI
- PDM, I2S, PWM, QDEC, ADC (14-bit)
- Security – Arm TrustZone-M
- Supply Voltage – 1.7V to 3.6V
- Dimensions – 10.35 x 9.8 x 1.9 mm (Hybrid castellated holes & LGA footprint)
- Temperature Range – -40°C to 85°C
- Certifications – To be certified for CE RED, FCC, ISED, and MIC
The PAN B511-1C module supports the nRF Connect SDK, which includes Zephyr RTOS, communication stacks, and security features. Development tools include nRF Connect for Desktop and Segger Embedded Studio for programming and debugging.
The company also talks about the PAN B511-1C EVB (ENW89861AXKF) evaluation board, which provides access to GPIO, UART, SPI, I2C, ADC, and PWM interfaces. It features an onboard Segger J-Link debugger for firmware development. The board supports current measurement and external peripheral integration for prototyping and testing. Sadly, Panasonic did not share any photos, datasheets, or other information regarding the board at this stage.
The product brief lists three different part numbers for the module:
- ENW89861A1KF – The Premium variant with a slow clock and an additional 4 MB flash memory
- ENW89861A2KF – The Standard version with a slow clock but no extra Flash.
- ENW89861A3KF – The Economy variant with neither the slow clock nor extra Flash.
Note the ENW89861AXKF evaluation board is said to come with the Economy module, but features 8 MB memory and a slow clock on the EVB.
A number of Bluetooth 6.0 modules are slowly being released to the market. This includes the Silicon Labs BG22L and BG24L low-cost, ultra-low-power BLE 6.0 SoCs for asset tracking tags and other compact appliances, and the KAGA FEI ES4L15BA1 Bluetooth LE 6.0 and 802.15.4 module with an ultra-compact 8.55 x 3.25 x 1.00 mm size and an integrated antenna.
Panasonic says the PAN B511-1C Bluetooth 6.0 and 802.15.4 module is currently sampling, and mass production is scheduled for June 2025. More information can be found on the product page and press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress
