Infineon has recently released the AIROC CYW20829 Bluetooth LE (Low Energy) 5.4 family which now includes SoCs and modules. These SoCs include two Cortex-M33 MCU cores: one 48 or 96 MHz application core for the peripherals, security, and system resources, and one communication core for the 2.4 GHz RF transceiver with up to 10 dBm transmit power and -98 dBm receive sensitivity. This high integration reduces bill-of-material (BOM) costs for a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, home automation, and others.
Back in 2021, we saw Infineon release the AIROC CYW5557x family of Wi-Fi 6/6E SoCs for IoT and streaming devices with features like enhanced range and improved network efficiency. More recently, Infineon announced the PSOC Edge E81, E83, and E84 MCU based on Cortex-M55/M33 microcontrollers. Feel free to check those out if you are looking for Infineon-specific MCUs.
Infineon AIROC CYW20829 series has a total of eight SKUs that share most of the same specifications:
- Devices
- CYW20829B0000 – SoC in a 56QFN package, designed for PC accessories, remotes, ESL, and low-end BLE MCUs.
- CYW20829B0010 – SoC in a 56QFN package, suitable for gaming accessories and LE Audio products.
- CYW20829B0-P4EPI100 – Module suitable for long-range, asset tracking, power tools, and generic Bluetooth LE use cases.
- CYW20829B0-P4TAI100 – Module suitable for long-range, asset tracking, power tools, and generic Bluetooth LE use cases.
- CYW20829B0021 – SoC in a 40QFN package, suited for industrial and long-range applications.
- CYW89829B0022 – SoC in a 40QFN package, designed for wireless BMS and car access.
- CYW89829B0232 – SoC in a 77BGA package, suitable for wireless BMS and car access.
- CYW20829B1230 – (Expected Q2 2025) SoC in a 64-ball BGA package, suitable for wearables, power tools, and asset tracking.
- MCU Cores
- 48/96 MHz Arm Cortex-M33 (application core)
- 48 MHz Arm Cortex-M33 (Bluetooth subsystem)
- ARMv8-M architecture
- Memory – 256 KB SRAM
- Storage – External QSPI flash support (XIP, encryption)
- Bluetooth 5.4
- 2.4 GHz RF transceiver with 50 Ω antenna drive
- Digital PHY
- Master and slave modes
- TX power: up to 10 dBm
- RX sensitivity:
- -98 dBm (LE 1 Mbps)
- -95 dBm (LE 2 Mbps)
- -101 dBm (Coded PHY 500 kbps)
- -106 dBm (Coded PHY 125 kbps)
- Up to 16 simultaneous connections (4 peripheral)
- Angle of Arrival (AoA) and Angle of Departure (AoD) support
- Interfaces
- Quad SPI (QSPI) / Serial Memory Interface (SMIF)
- 3x configurable Serial Communication Blocks (SCBs) – SPI, I2C, or UART
- 2x PDM audio channels, 1x I2S channel (TDM mode)
- Up to 32x GPIOs
- Peripherals
- 7x 16-bit, 2x 32-bit Timer/Counter Pulse-Width Modulator (TCPWM)
- 12-bit sigma-delta ADC
- DMA controller (16 channels)
- Cryptography hardware acceleration
- True Random Number Generator (TRNG)
- Security
- Secure Boot
- Secure execution environments
- Encrypted image support
- Debug disable & authentication
- OTP eFuse array
- Power Supply
- Supply voltage – 1.7 V to 3.6 V
- Selectable core logic operation – 1.1 V or 1.0 V
- On-chip DC-DC buck converter
- Power Consumption
- Deep Sleep – 4.5 µA (64 KB SRAM retention)
- Active CPU current
- 40 μA/MHz (1.1 V core)
- 22 μA/MHz (1.0 V core)
- Bluetooth LE power consumption
- TX: 5.2 mA (0 dBm), 17.2 mA (10 dBm)
- RX: 5.6 mA (LE 1 Mbps)
- Package – 56-lead 6×6 mm
- Process – 40nm CMOS process
The specification is taken from the AIROC CYW20829 general-purpose Bluetooth LE 5.4 MCU family because at the time of writing Infineon did not provide a datasheet for the CYW89829 series built for automotive applications with AECQ-100 Grade 2 qualification, an up to 105°C operating temperature, fewer GPIOs, and integrated flash, which is beneficial for automotive applications where space and reliability are crucial.
In terms of software, the company mentions that the MCUs will be compatible with their ModusToolbox software, tools, and libraries for developing MCU and wireless systems. Infineon also provides many code examples on GitHub, including board support packages, low-level resources like HAL and PDL, middleware for features like Bluetooth, and application examples. HAL simplifies interacting with hardware blocks and works across multiple product families.
The company also provides the CYW920819M2EVB Bluetooth Low Energy Evaluation Kit making it easy to create Bluetooth-connected IoT devices. Built around the CYW20829 MCU, this user-friendly tool to help you build solutions for smart homes, industrial automation, and more. It’s compatible with Arduino and works on Windows, macOS, and Linux. In addition, the kit features an onboard programmer/debugger (KitProg3) and supports 1.8 V, 3.3 V, and a coin-cell battery for simplified operation.
The general-purpose CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 Bluetooth LE 5.4 modules can be purchased from Mouser for $6.83 for a single unit and less in quantities. The CYW920819M2EVB-01 can also be ordered from Mouser for $58.2. However, at the time of writing, I cannot find any pricing details for the industrial and automotive grade modules. More information about the CYW20829 and CYW89829 can be found on their respective products page and some additional details can be found on the company’s press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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