ADLINK has launched an IP-i IoT Prototype Kit based on their Express-ADP COM Express Type 6 Basic “Alder Lake-H” module with either an Intel Core i5-12600HE 12-core (4P+8E) processor clocked at up to 4.5 GHz or a Core i3-12300HE 8-core (4P+4E) processor reaching up to 4.3 GHz.
The kit also includes the Express-BASE6 R3.1 carrier board, a thick heatsink with an active fan, a debug board (DB30 x86), and various cables for SATA storage, a DB9 COM port, and I/Os, and the kit can be used to develop applications for industrial automation and control, medical ultrasound, image processing and analysis, high-speed video encoding and streaming, predictive traffic analysis, multi camera-based AI, etc…
The Express-ADP module supports up to 64GB DDR5 memory, optional on-module NVMe storage, up to 4x 4K displays, multiple PCIe Gen4 and Gen3 interfaces, SATA 3.0, and so on. You’ll find detailed Express-ADP COM Express module specifications in our earlier post.
ADLINK Express-BASE6 R3.1 specifications:
- Supported modules – PICMG COM Express Revision 3.1 Type 6 modules with Basic / Compact size, 220-pin COM Express connector
- Storage
- 4x SATA 3.0 ports, but only 2x supported by the Express-ADP modules
- SD card slot
- Video Output
- DisplayPort
- 32-pin LVDS header (build option for eDP)
- Optional VGA port
- Audio
- Realtek ALC262 codec
- Mic/Line-in/Line-out combo jacks, S/PDIF output
- Networking – 2500/1000/100/10BASE-T compatible RJ45 Ethernet port
- USB
- 2x USB4 Type-C ports
- 4x USB 3.x ports, 2x USB 2.0 ports, 2x USB 2.0 interfaces on 9-pin header for front panel
- Serial Port
- 1x DB-9 (from Super I/O) connector
- 3x 10-pin headers
- Expansion
- 1x PCI Express x16 slot
- 1x PCI Express x4 slot
- 4x PCI Express x1 slots
- 8-pin header GPIO
- Headers for SMBus, I2 C, LPC
- Header for front panel usage
- Misc
- Onboard socket for secondary SPI flash
- Onboard diagnostics for BIOS POST code data on LPC bus
- 4-pin FAN connector from COM module, 2x 4-pin FAN connectors from Super I/O
- 4x buttons (ON/OFF, Reset, SLEEP, LID), LED, Buzzer
- Power Supply – 24-pin ATX connector
- Dimensions – 150 mm x 142 mm
- Temperature Range – Standard: 0°C to 60°C; rugged: -40°C to 85°C (optional)
- Humidity
- 5-90% RH operating, non-condensing
- 5-95% RH storage (and operating with conformal coating)
- Shock and Vibration – IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
- HALT – Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test
The company provides Ubuntu 20.04 and Windows 10 images for the IoT prototype kit as well as documentation to help users get started with either Windows or Ubuntu, upgrading the BIOS, or even using the Intel OpenVINO AI framework. The BIOS can be flashed with the included DB30 x86 board shown below.
This kind of hardware would be typically reserved to companies planning volume production of products with the COM Express modules, but ADLINK appears to sell it to whoever wants it with the Core i5-12600HE Alder Lake-H kit going for $865.00, and the Core i3-12300HE currently out of stock.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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Should be corrected to read “HE” instead of “H” throughout the article. There’s no i3-12300H SKU, but there is an i5-12600H mobile Alder Lake SKU.
Intel should put a 4+4 SKU on desktop in the future, instead of just 4+0 (e.g. i3-13100).