IBASE INA1607 is a fanless uCPE/SD-WAN appliance powered by an Intel Atom x7405C Amston Lake SoC

Intel Atom x7405C Amston Lake Appliance

IBASE Technology’s INA1607 is a fanless uCPE (universal Customer Premises Equipment) and SD-WAN (Software-defined WAN) appliance powered by an Intel Atom x7405C Amston Lake processor coupled with up to 16GB ECC or non-EEC DDR5 memory. The embedded computer comes with offers up to 64GB eMMC flash, features a 2.5-inch SATA bay, offers four 2.5GbE RJ45 ports, two dual-function GbE ports (RJ45/SFP), and supports wireless expansion for WiFi 6 or 4G LTE/5G modules through mini PCIe and M.2 slots and up to six antennas. IBASE INA1607 specifications: SoC – Intel Atom X7405C quad-core Amston Lake processor @ up to 2.2GHz with 6MB cache; TDP: 12W System Memory – Up to 16GB DDR5 4800MHz ECC/Non-ECC via SODIMM socket Storage 16GB, 32GB, or 64GB eMMC flash M.2 2280 B-Key 3042/3080 socket for SATA III or PCIe SSD 2.5-inch SATA drive bay Networking 4x 2.5GbE RJ45 ports via Intel i226-V controllers 2x GbE RJ45 […]

Morse Micro MM8108 WiFi HaLow SoC supports up to 43.33 Mbps transfer rate, improves range and power efficiency

Morse Micro MM8108

Morse Micro MM8108 is a new WiFi HaLow (802.11ah) SoC with a throughput of up to 43.33 Mbps, and improved range and power efficiency compared to its predecessor the Morse Micro MM6108 introduced in 2022 and supporting up to 32.3 Mbps transfer rate. The new chip is also smaller at just 5x5mm in a BGA package instead of 6x6mm in a QFN48 package for the MM6108/MM6104, adds a USB 2.0 host interface besides SDIO 2.0 and SPI, as well as a MIPI RFFE (Radio Frequency Front-End) for integration and interoperability with multi-radio systems. Morse Micro MM8108 specifications: 32-bit RISC-V Host Applications Processor (HAP) Single-Chip IEEE802.11ah Wi-Fi HaLow transceiver for low-power, long-reach IoT applications Worldwide Sub-1 GHz frequency bands (850MHz to 950MHz) On-chip 26 dBm power amplifier with support for external FEM (Front End Module) option 1/2/4/8 MHz channel bandwidth for up to 43.3 Mbps data rate using 256-QAM modulation at […]

ArmSoM CM5 Raspberry Pi CM4 alternative with Rockchip RK3576 SoC

Fully enclosed ESP32-S3 board features 1.8-inch AMOLED, microphone & speaker for AI audio applications

ESP32 S3 1.8inch AMOLED display development board

Waveshare ESP32-S3-Touch-AMOLED-1.8 is an ESP32-S3 development board with an AMOLED display and AI audio support fully housed in a plastic enclosure. The most interesting feature of this devkit is its 1.8-inch AMOLED display with a 100000:1 contrast ratio and a wide 178° viewing angle, plus support for AI speech using its built-in microphone and speaker, and a built-in battery for IoT and AI applications. Other features include a QMI8658 6-axis IMU for motion detection, a PCF85063 RTC for time, and an ES8311 audio codec for high-quality audio. The ESP32-S3 provides Bluetooth and Wi-Fi connectivity and the board also features a USB-C port for power and programming. The AXP2101 power management IC enables battery charging and optimization, while GPIO, I2C, and UART pads allow expansion. Waveshare ESP32-S3-Touch-AMOLED-1.8 specifications Wireless MCU – Espressif Systems ESP32-S3R8 CPU – Dual-core Tensilica LX7 @ up to 240 MHz with vector instructions for AI acceleration. Memory – […]

Review of SMARTHON Smart City IoT Starter Kit for BBC Micro:bit

Smarthon Smart City IoT Starter Kit review

SMARTHON Smart City IoT Starter Kit for micro:bit is an educational kit for 10+ years old teaching basic projects from turning an LED to more complex projects with multiple sensors, IFTTT integration, and mobile app development. The company sent us a sample of the Start Kit along with a BBC Micro:bit board for review, and we’ll report our experience with the kit in this review. Unboxing of SMARTHON Smart City IoT Starter Kit for micro:bit The package I received includes the SMARTHON Smart City IoT Starter Kit for Micro:bit and a BBC Micro:bit V2 board since it’s not included in the starter kit. The bottom side of the package lists the main components and features a QR code pointing to the product page. The package includes cardboard and wooden models, various cables, a 180° servo, a screw set, a city map, the Smarthon IoT:bit carrier board for the BBC Micro:bit, […]

NXP MCX L14x and MCX L25x ultra-low-power Cortex-M33 MCUs target energy harvesting and battery-powered devices

MCX L series chip

NXP Semiconductors has launched the MCX L series of ultra-low-power Arm Cortex-M33 MCUs with the MCX L14x and MCX L25x SKUs. The new series offers similar peripherals as the rest of the MCX portfolio but uses a new “power management architecture that supports always-on, battery-powered applications” The MCX L series uses a dual domain architecture, with “real-time processing and ultra-low-power sensing functions in a single device.” The Arm Cortex-M33 core supports real-time processing functions while the Arm Cortex-M0+ core offers always-on operation in the ultra-low-power sense domain. The new microcontrollers reportedly use three times less power than their predecessors. The ultra-low-power series is targeted at energy-constrained applications, powered by a battery, ultracapacitor, or power harvesting circuit. These include building control, industrial sensing, smoke and fire alarms, flow meters, smart appliances, and motion detectors. NXP MCX L14x and L25x specifications: CPU Main core: Arm Cortex-M33 microcontroller @ up to 96 MHz […]

Seeed Studio XIAO Plus series adds more GPIOs through castellated holes

SeeedStudio XIAO Plus Series

In response to community feedback for more I/O options, Seeed Studio has recently launched the Seeed Studio XIAO Plus series with 23 castellated mounting pins (20 GPIOs, 3 power pins) and improved back solder points, improving compatibility with carrier boards for complex projects. The new series includes the XIAO ESP32S3 Plus, XIAO nRF52840 Plus, and XIAO nRF52840 Sense Plus which are direct upgrades of the XIAO ESP32S3, XIAO nRF52840 BLE, and XIAO nRF52840 Sense boards. The new design allows for easier assembly and scalable production, with double the I/O options. XIAO ESP32S3 Plus The Seeed Studio XIAO ESP32S3 Plus is a compact development board with a total of 23 pins on the board out of which 11 are through-hole GPIO pins 9 additional SMD castellations GPIO pins and 3 through-hole are power pins. The board is built around an ESP32-S3 MCU so it has 2.4GHz WiFi and BLE 5.0 connectivity. Other […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025

GuRu’s modular wireless power transfer system can power a drone indefinitely

GuRu wireless power transfer System

California-based company GuRu Wireless has recently developed and showcased a scalable and modular wireless power transfer system that is capable of delivering power to a high-power device up to several kilowatts, such as a drone, from up to 30 feet away (a little over 9 meters). They also mention that the system can power low-power devices, like LEDs and consumer electronics, over distances of several kilometers. It’s quite an extension to the GuRu’s desk-range wireless power evaluation kit we covered in 2020. The system uses 24 GHz high-frequency millimeter-wave radio signals to deliver energy over long distances without needing batteries or tethered systems. GuRu’s system uses a phased array transmitter with proprietary RFICs, to precisely deliver power to the receiver called the Recovery Unit (RU). In a recent demonstration video, GuRu Wireless showcased their wireless power transfer system by powering a drone from 30 feet away, operating it continuously for […]

NanoCOM-ADN – A COM Express Type 10 Module based on Intel Alder Lake-N SoC

AAEON NanoCOM-ADN COM Express module

AAEON NanoCOM-ADN is a compact (84 x 55mm) COM Express Type 10 module based on Intel Alder Lake-N SoCs, namely Processor N50/N97, Atom x7425E, or Core i3-N305 that adds another option to the SMARC, Qseven, and COM Express Type 6 modules offered by the company with the same processors. The NanoCOM-ADN computer-on-module features up to 16GB LPDDR5x soldered-on memory, up to 64GB eMMC flash, and two Intel i226-V 2.5GbE controllers. Its standard 220-pin COM Express board-to-board connector exposes two SATA interfaces, four PCIe Gen3 x1 interfaces, DDI and LVDS video outputs, eight USB interfaces, and more. AAEON explains the Alder Lale-N COM Express Type 10 CPU module is especially suited to digital signage, healthcare imaging, machine vision, industrial, robotics, and edge computing applications.   AAEON NanoCOM-ADN specifications: Alder Lake N-series SoC (one or the other) Intel Atom x7425E quad-core processor up to 3.4 GHz with 6MB cache, 24EU Intel UHD […]

Boardcon EM3562 Rockchip RK3562 SBC with 8 analog camera inputs