Small (45x43mm) system-on-module packs Rockchip RK3562 AIoT SoC, 16GB eMMC, 2GB RAM, and PMIC

MIYR Tech MYC-YR3562 is a small 45x43mm system-on-module that packs a Rockchip RK3562 or RK3562J quad-core Cortex-A53 AIoT SoC with a 1 TOPS AI accelerator, up to 2GB LPDDR4, 16GB eMMC flash, 32 Kbit EEPROM, and a PMIC.

To keep the module small while making no compromise on the number of I/Os offered, the company designed the module with 164 castellated holes (LCC – ) and 58 pads (LGA). That means the MYC-YR3562 system-on-module gets all interfaces from the RK3562(J) SoC, including Gigabit Ethernet, USB 3.0, PCIe 2.1, RGB, LVDS, and MIPI-DSI interfaces, camera inputs (MIPI-CSI), and a range of low-speed I/Os.

MYC-YR3562 SoM specifications

• SoC –  Rockchip RK3562 or RK3562J
  • CPU
    • RK3562 – Quad-core Arm Cortex-A53 quad-core @ 2.0 GHz
    • RK3562J – Quad-core Arm Cortex-A53 quad-core @ 1.2 GHz (stock, overclock up to 1.8 GHz)
      
  • GPU – Mali-G52-2EE with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1
  • AI accelerator – 1 TOPS (INT8) NPU
  • VPU
    • Encoder – H.264 1920×1080 @ 60fps
    • Decoder – H.265/VP9 4096×2304 @ 30fps; H.264 1920×1080 @ 60fps
• RAM – 1GB or 2GB LPDDR4
• Storage
  • 8GB or 16GB eMMC flash
  • 32Kbit EEPROM
• 164-pin castellated edges and 58 pads on the bottom
  • Storage – 2x SDIO 3.0
  • Display
    • MIPI DSI up to 2048×1080 @ 60Hz
    • LVDS up to 1280×800 @ 60Hz
    • 24-bit RGB up to 2048×1080 @ 60Hz
  • Camera – 2x MIPI CSI
  • Audio
    • 3x SAI
    • S/PDIF
    • 8-channel PDM input
  • Ethernet – 1x RGMII (10/100/1000Mbps), 1x RMII (10/100Mbps)
  • USB
    • 1x USB 3.0/2.0 OTG
    • 1x USB 2.0 Host
  • PCIe – PCIe Gen 2.1 x1 (Multi-PHY with USB 3.0)
  • Other Interfaces
    • 10x UART, 5x I2C
    • 16x PWM
    • 2x CAN Bus (CAN 2.0B)
    • 2x SARADC
    • GPIO pins
• Supply Voltage – 3.3V (up to 2A)
• Dimensions – 45 x 43 mm (10-layer PCN design)
• Temperature Range
  • Commercial: 0 to 70°C (RK3562)
  • Industrial: -40 to 85°Celsius (RK3562J)

 

MYIR Tech provides a Linux SDK with kernel 6.1.99 and u-boot 2017.9, all drivers for the module, and two root file systems (buildroot built and Debian). Target applications include industrial automation, IoT gateways, and edge computing.

The MYD-YR3562 development board can be used to evaluate the capabilities of the RK3562(J) SoM and get started with development while the hardware team is working on the custom carrier board.

MYD-YR3562 specifications:

• SoM – MYC-YR3562 as described above
• Storage
  • MicroSD card slot
  • M.2 NVMe PCIe NVMe SSD socket
• Display I/F
  • HDMI
  • MIPI DSI Interface (0.5mm pitch 30-pin FPC connector) compatible with MY-MIPI101C 10.1-inch MIPI module with 1920×1200 resolution
• Camera I/F – 3x MIPI-CSI interfaces (0.5mm pitch 30-pin FPC connector) compatible with the company’s MY-CAM004M and MY-CAM005M camera modules
• Audio
  • 3.5mm audio jack
  • Speaker connector
• Networking
  • Gigabit Ethernet (RJ45) port
  • 2x 10/100Mbps Fast Ethernet (RJ45) ports
  • WiFi 5 802.11a/b/g/n/ac and Bluetooth 5.2 module
• USB – 2x USB 3.0 Type-A port
• Expansion
  • 2x 40-pin GPIO headers
    • One (mostly) compatible with the 40-pin GPIO header with GPIO, I2C, UART, SPI, CAN Bus
    • MiFAN header with GPIO, I2C, UART, SPI, USB)
  • MY-ICEB001 Expansion Board connecting to the two 40-pin headers
    • Expansion – M.2 socket and SIM card slot for USB-based 4G LTE module
    • USB – 3x USB 2.0 Type-A ports
    • Serial – 1x RS232, 2x RS485, 2x CAN Bus
    • Misc
      • 2x Buttons (RESET, USER)
      • 2x LEDs (RUN LED, USR LED)
    • Phoenix connector for power input
• Debugging – USB-C Debug UART port
• Misc
  • 5x buttons (Update, PWR, V+, V-, RESET)
  • 3x LEDs (1x PWR LED, 1x RUN LED, 1x USR LED)
• Power Supply – 12V DC/3A via power barrel jack
• Dimensions – 120 x 90mm (6-layer PCB)

The MYiR MYC-YR3562 is far from the first Rockchip RK3562 or RK3562J system-on-module we’ve covered, but it’s the smallest so far. Others include the Firefly Core-3562JQ with three B2B connectors (60 x 36mm), Forlinx FET3562J-C with a similar design as the Firefly one but a bit smaller (56 x 36mm), and the Graperain G3562 SO-DIMM module (69.6 x 48.1mm). However, there’s an even smaller Rockchip RK3562 module we haven’t written about yet: Armdesiger/Boardcon MINI3562 with two 200-pin B2B connectors at just 45x34mm.

Contrary to most embedded systems companies, MYiR sells its system-on-modules and development boards directly online and provides pricing information.

Three variants of the MYC-YR3562 module are available:

• MYC-YR3562J-8E1D-180-I – $35 with RK3562J, 1GB LPDDR4, 8GB eMMC, -40 to 85°C temperature range
• MYC-YR3562J-16E2D-180-I – $39 with RK3562J, 2GB LPDDR4, 16GB eMMC, -40 to 85°C temperature range
• MYC-YR3562-16E2D-200-C – $29 with RK3562, 2GB LPDDR4, 16GB eMMC,  0 to 70°C temperature range

The commercial-grade MYD-YR3562-16E2D-200-C development board sells for $75, while the industrial-grade MYD-YR3562J-16E2D-180-I-GK kit that also features the MY-ICEB001 expansion board is offered for $109. You’ll find more information and purchase links on the product page.

As a side note, if you have even lower requirements, MYiR also introduced an even smaller MYC-YR3506 module (39x37mm) powered by a Rockchip RK3506 tri-core Cortex-A7 SoC for entry-level IoT applications, and a price that starts at just $12.80

Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress