ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

ADLINK COM-HPC-mMTL is an industrial-grade COM-HPC Mini Computer-on-Module based on Intel Meteor Lake processors up to the 16-core Intel Core Ultra 7 165H featuring Intel Arc Graphics with eight Xe cores, Intel AI Boost NPU up to 8.2 TOPS, and 16x PCIE Gen4 lanes.

The COM-HPC R1.2-compliant Mini size module also supports up to 64GB LPDDR5x memory soldered directly onto the board, an optional NVMe BGA SSD, and features two SATA interfaces, two 2.5 Gbps Ethernet, multiple DDI/USB4, and USB 3.0/2.0 through the standard 400-pin board-to-board connector of the 95x70mm CoM.

COM-HPC-mMTL 16-core Intel Core Ultra COM-HPC Mini
ADLINK COM-HPC-mMTL specifications:

  • Meteor Lake H/U SoC (one or the other)
    • Intel Core Ultra 7 165H 16-core (6P+8E+2LPE) processor @ up to 5.0 / 3.8 / 2.5 GHz with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.35 GHz, Intel AI Boost NPU; TDP: 28W
    • Intel Core Ultra 7 155H 16-core (6P+8E+2LPE) processor @ up to 4.8 / 3.8 / 2.5 GHz with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.25 GHz, Intel AI Boost NPU; TDP: 28W
    • Intel Core Ultra 5 135H 14-core (4P+8E+2LPE) processor @ up to 4.6 / 3.6 / 2.5 GHz with 18MB cache, 8x Xe-cores Intel Arc graphics @ 2.20 GHz, Intel AI Boost NPU; TDP: 28W
    • Intel Core Ultra 5 125H 14-core (4P+8E+2LPE) processor @ up to 4.9 / 3.6 / 2.5 GHz with 18MB cache, 7x Xe-Cores Intel Arc graphics @ 2.2 GHz, Intel AI Boost NPU; TDP: 28W
    • Intel Core Ultra 7 165U 12-core (2P+8E+2LPE) processor @ up to 4.9 / 3.8 / 2.1 GHz with 12MB cache, 4x Xe-cores Intel Arc graphics @ 2.0 GHz, Intel AI Boost NPU; TDP: 15W
    • Intel Core Ultra 7 155U 12-core (2P+8E+2LPE) processor @ up to 4.8 / 3.8 / 2.1 GHz with 12MB cache, 4x Xe-cores Intel Arc graphics @ 1.95 GHz, Intel AI Boost NPU; TDP: 15W
    • Intel Core Ultra 5 135U 12-core (2P+8E+2LPE) processor @ up to 4.4 / 3.6 / 2.1 GHz with 12MB cache, 4x Xe-cores Intel Arc graphics @ 1.9 GHz, Intel AI Boost NPU; TDP: 15W
    • Intel Core Ultra 5 125U 12-core (2P+8E+2LPE) processor @ up to 4.3 / 3.6 / 2.1 GHz with 12MB cache, 4x Xe-cores Intel Arc graphics @ 1.85 GHz, Intel AI Boost NPU; TDP: 15W
    • Arc GPU features: AV1 encode/decode, H.265 (HEVC) 8-bit codec, DX 12.1, OpenGL 4.6, oneAPI
  • System Memory – Up to 64GB (4x 16GB) LPDDR5x soldered-down memory at max. 7467MT/s
  • Storage – Optional NVMe SSD on module (for 28W Meteor Lake-H SKUs only)
  • Camera I/F – 2x 4-lane MIPI-CSI2 on-board FFC connectors
  • Networking – 2x Intel I226 2.5GbE controllers (with TSN by build option)
  • 400-pin connector compliant with COM-HPC Mini specifications:
    • Storage
      • Up to 2x SATA (SATA 0, 1)
      • NVMe via PCIe (see below)
    • Video
      • Digital Display Interfaces DDI 0/1 supporting DP1.4a, HDMI2.0b, DVI
      • 3x DP via USB4
      • 4-lane eDP 1.4b
      • Note: 3x USB4 ports muxed with DDI 0/1 and USB3 port 2; BIOS code modification on project basis and a re-timer with PD on the carrier are required.
    • Audio
      • Interface – HDA (I2S and SoundWire, TBC)
      • Audio Codec on COM-HPC Mini base carrier (Realtek solution)
    • Networking – 2x 2.5GbE (Note: NBASE-T_1 muxed with PCIe lane7/SATA port 0; default is NBASE-T_1)
    • USB
      • 3x USB 3.x/2.0 (USB ports 0,1,2)
      • 5x USB 2.0 (USB ports 3,4,5,6,7)
      • Note: USB port 2 muxed with USB4; USB4 availability on project basis
    • Serial – 2x UART ports with console redirection (UART from SoC on project basis)
    • Low-speed I/O – 12x GPIO (GPI with interrupt, TBC)
    • PCIe – Up to 16 PCIe Gen4 lanes
      • 4 PCIe at lanes 8-11: x4 configuration
      • 4 PCIe at lanes 12-15: x4 configuration
      • 4 PCIe at lanes 0-3: x1, x2, x4 configurable
      • Up to 4 PCIe at lanes 4-7: x1, x2, x4 configurable
      • Note: PCIe lane 6 muxed with SATA port 1; PCIe lane 7 muxed with SATA port 0 and NBASE-T port 1; defaults are PCIe lane 6 and NBASE-T port 1.
    • SMBus (system), 2x I2C (user), 1x GP_SPI (TBC), 1x Boot_SPI and eSPI
  • SEMA Board Controller – Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO, watchdog timer, fan control
  • Security – Optional Infineon TPM 2.0 (SPI based)
  • Debugging – 40-pin multipurpose flat cable connector for use with DB40-HPC debug module providing BIOS POST code LED, MMC/EC access, SPI BIOS flashing, power testpoints, debug LEDs
  • Misc
    • AMI UEFI with CMOS backup in 32MB SPI BIOS (dual BIOS opt.)
  • Power Supply
    • Standard Input – AT: 12V DC ±5%
    • Wide Input – AT: 8.5t to 20V DC
    • Power States – C1-C6, S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)
  • Dimensions – 95 x 75 mm; PICMG COM-HPC Rev 1.2 Mini Type
  • Temperature Range
    • Standard: 0°C to 60°C (storage: -20°C to 80°C)
    • Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, build option, selected SKUs, TBC)
  • Humidity
    • 5-90% RH operating, non-condensing
    • 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
  • HALT – Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test

COM-HPC Mini Bottom Side

COM-HPC-mMTL block diagram
COM-HPC-mMTL block diagram

ADLINK provides support for Windows 10 IoT Enterprise LTSC, Windows 11 IoT Enterprise LTSC, and Ubuntu 64-bit (TBC) for the Intel Core Ultra Meteor Lake COM-HPC Mini module. Two cooling solutions are offered for the CoM:  the HTS-cMTL-B heatspreader with threaded standoffs for bottom mounting, and THSF-mMTL-B active heatsinks with a fan.

The company also designed the COM-HPC Mini Base reference carrier board in ATX form factor for their first COM-HPC Mini module and subsequent ones. It features PCIe x8, PCIe x4, 3x PCIe x4 M.2 M-key slots, DP, eDP, and 4-lane MIPI-CSI display interfaces, Mic/Line-in/Line-out audio jacks, two USB 4, two USB 3.x, four USB 2.0, and an Ethernet port.

COM-HPC Mini carrier board

ADLINK COM-HPC-mMTL Intel Core Ultra COM-HPC Mini Computer-on-Module is shown as being preliminary, and unsurprisingly, we don’t have pricing information. The company says the development kit for prototyping and referencing will be available in H2 2025. More details may be found on the product page and the carrier board page.

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