The HL7900 5G LPWA module from Semtech (Sierra Wireless) is a globally certified solution built around Sony’s Altair ALT1350 chip and designed for low-power IoT applications. It is certified by major U.S. carriers, including AT&T, T-Mobile, and Verizon, as well as Japan’s KDDI, and has achieved global regulatory certifications (FCC, CE, ISED, etc.) and industry certifications (PTCRB, GCF) for carrier interoperability.
This chip features an ultra-low-power sensor hub MCU for efficient environmental monitoring. Additionally, it includes integrated sub-GHz and 2.4GHz radios supporting short-range protocols such as Wi-SUN including U-Bus Air, NB-IoT, and 5G NTN along with GNSS and Wi-Fi-based indoor/outdoor tracking. Furthermore, this chip supports embedded SIM support, secure edge-to-cloud connectivity, and over-the-air updates. These features make this chip useful for applications such as asset tracking, urban navigation, and other IoT solutions requiring reliable, low-power connectivity with global reach.
Semtech HL7900 specifications:
- MCU – Sony ALT1350 5G cellular IoT chip
- Wireless
- Cellular
- 3GPP Release 14/15/16, up to 17 through SW upgrade
- CAT-M1: Up to 590 Kbps in DL, and 1110 Kbps in uplink (up to 1.2mbps with Release 17)
- CAT-NB2: Up to 127 Kbps in DL, and 158 Kbps in uplink (up to 254kbps with Release 17)
- LTE Frequency Band Support
- HFDD (Half Duplex FDD) and TDD
- OneSKU frequency range
- Low Band: 617–960 MHz
- Middle Band: 1700–2200 MHz
- Supported Band List:
- LTE-M: 1, 2, 3, 4, 5, 8, 12, 13, 14, 18, 19, 20, 25, 26, 27, 28, 66, 71
- NB-IoT: 1, 2, 3, 4, 5, 8, 12, 13, 14, 17, 18,19, 20, 25, 26, 28, 65, 66, 70, 71, 85
- NTN: B23, B255, B256
- 410-466MHz (bands 31, 72, 73, 87, 88) can be supported using additional RF FE components.
- Sub-GHz and 2.4 GHz 802.15.4 radios for short-range communication like Wi-SUN and U-Bus Air
- GNSS support (GPS and GLONASS) for asset tracking and other applications.
- Cellular
- Network protocols – IPv4/IPv6 with TCP/UDP, PPP, FTP, HTTTP, TLS, HTTPS, SSL, DTSL, MQTT, CoAP, LWM2M
- Host and peripheral interfaces
- 1x 8-wire UART (main interface)
- 1x 4-wire UART (debug interface)
- 12x GPIOs
- 2x ADCs
- External Flash and PSRAM interfaces
- MIPI interface
- RF interfaces for LTE and GNSS antennas
- Security – End-to-end security with secure elements
- Misc
- Integrated eSIM support (SKU-dependent).
- AT command interface (3GPP 27.007 with proprietary extensions).
- Approvals
- Regulatory – PTCRB, GCF, FCC (USA), ISED (Canada), CE(EU), JRF/JPA (Japan), NCC (Taiwan), RCM (Australia)
- Carrier – Verizon, AT&T, KDDI, T-Mobile US, Planned: Docomo, Vodafone
- Integrated low-power MCU for edge processing
- Power
- Input voltage: 2.5V to 4.35V (VBAT_BB, VBAT_RF).
- Power modes include Power Save Mode (PSM) and extended DRX (eDRX).
- Package and Dimensions
- Compact industrial-grade LGA module with 152 solderable pins
- LGA 18.0mm x 15.0mm x 2.5mm
- Weight – 1.17g ± 0.24g.
- Operating temperature ranges:
- Class A – -30°C to +70°C.
- Class B – -40°C to +85°C.
- Certifications
- FCC, IC, and Japan radio/telecom approvals.
- ESD protection – ±6 kV contact and ±8 kV air (IEC-61000-4-2)
The HL7900 5G LPWA module comes with pre-certified firmware with secure boot for additional security and reliability. Semtech also provides free Firmware Over-the-Air (FOTA) upgrades, allowing you to keep your device up-to-date with the latest features and security enhancements remotely. Additionally, you have the option to opt for Cloud Services, including Connectivity Management and Device Management options. You’ll find developer resources such as documentation, AT Command set, and FreeRTOS-based firmware on the source website.
The company also provides the HL/RC Module Evaluation Kit to develop software and hardware applications based on HL78xx and HL7900 modules. The board features various interfaces including USB, UART, GPIOs, ADCs, RF, and GNSS connectors, as well as flexible power options. The kit supports SIM management, snap-in module connectors, and headers for STM32 and Arduino. Additionally, it features test points for signal access, debug interfaces, and LEDs. A limitation of the development kit is that it only supports Ring B pins, which are specific to the HL78xx series modules. However, the Ring C pins of the HL7900 module are not supported.
The HL7900 adds to some other 5G LPWAN modules such as the Quectel BG770A-SN with eMTC, NB-IoT, and NTN satellite connectivity, the Quectel BG95-S5 with similar features, Sequans Monarch 2 GM02S LTE IoT module without NTN, and several others.
The HL7900 5G LPWA module is available on Techship for $31 and the HL78/HK79 devkit for $199 without module. More information can be found on the product page and the press release.
Debashis Das is a technical content writer and embedded engineer with over five years of experience in the industry. With expertise in Embedded C, PCB Design, and SEO optimization, he effectively blends difficult technical topics with clear communication
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