SECO’s SMARC-QCS5430 SMARC SoM and devkit feature Qualcomm QCS5430 SoC for Edge AI and 5G applications

SECO has announced early engineering samples for its SOM-SMARC-QCS5430 system-on-module (SoM) and devkit designed to support IoT and edge computing applications. Built around the Qualcomm QCS5430 processor this SMARC-compliant SoM targets industrial automation, robotics, smart cities, and surveillance.

The module also offers dual MIPI-CSI interfaces for camera and connectivity options including USB 3.1, PCIe Gen3, dual GbE, and optional Wi-Fi and Bluetooth. SECO’s DEV-KIT-SMARC industrial devkit includes all the necessary components for rapid prototyping and integration.

SOM SMARC QCS5430 Block Diagram
SOM-SMARC-QCS5430 block diagram

SMARC-QCS5430 SoM specifications:

  • SoC – Qualcomm QCS5430
    • CPU – Hexa-core Kryo 670 with 2x Gold Plus cores (Cortex-A78) @ up to 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.8 GHz
    • GPU –Adreno 643L clocked at 812 MHz, supports OpenGL ES 3.2, DirectX FL 12, OpenCL 2.0, and Vulkan.
    • DSP – 1.4 GHz Hexagon DSP with dual HVX and 4K HMX
    • VPU – Adreno 642 VPU up to 4K60 decode for H.264/H.265/VP9, Up to 4K30 encode for H.264/H.265; Support for HDR10 and HDR10+ playback
    • Spectra ISP – Dual SpectraISP, 14-bit depth, supports up to 22+22 MP cameras, 4K video capture at 30 fps, 720p at 960 fps slow motion.
    • AI – 3.5 TOPS, scalable AI architecture, on-device machine learning, dual-core AI processor, audio ML DSP
    • Memory – Soldered LPDDR5-6400 memory, up to 12GB (32-bit interface, 2 channels)
  • Storage
    • On-board eMMC 5.1 drive, up to 64GB (boot device)
    • SD card interface (4-bit)
    • Optional UFS 2.x/3.1 flash
  • Display
    • LVDS dual channel 18/24 bit
    • eDP V1.4
    • MIPI DSI 4 lanes
    • Display Port through USB 3.1 Type C
  •  Networking
    • 2x Gigabit Ethernet interfaces
    • Optional Wi-Fi + BT5.0
  • Camera – 2x 4-line MIPI CSI interfaces with ISP support
  • Audio – 2x I2S audio interfaces
  •  USB
    • 1x USB 3.1 interface
    • 1x USB 2.0 OTG
    • 1x USB 2.0 or 4x USB 2.0 (Hub option)
  • Serial
    • 2x UART (RX/TX/RTS/CTS)
    • 2x UART (RX/TX)
  • Security – Optional TPM 2.0 on-board
  • Expansion
    • 2x PCIe Gen3 x1 lanes
    • 1x PCIe Gen3 x2 lane (QPS615)
  • Misc
    • 1x CAN via SPI
    • 2x I2C
    • Ultra-low power RTC
    • 2x PWM
    • FAN, Watchdog, Power Management, I/O Signals via embedded controller
  • Power – 5V DC (+5V standby optional)
  • Temperature
    • Commercial: 0 to +60°C
    • Industrial: -30 to +85°C
  • Dimensions – 82 x 50 mm

CSM-B79 Carrier Board specificaations:

  • Supported SoMs
  • Storage
    • mSATA connector with dedicated power connector (shared with M.2 Socket 2 2230/2242/2260 Key B SSD slot)
    • microSD card slot
    • eSPI pin header + flash socket
    • SPI pin header + flash socket
    • I2C EEPROM socket
  • Display Interfaces
    • 2x DP++ connector
    • HDMI connector (alternative to 1x DP++)
    • LVDS/MIPI-DSI connector (shared with 2x eDP connectors)
    • Backlight control + LCD selectable voltage connector
  • Camera interfaces – 2x MIPI CSI
  • Audio
    • TRSS Mic In + Line Out Audio Jack
    • Onboard I2S Audio Codec (TI TLV320AIC3204) + HD Audio Codec (Cirrus Logic CS4207)
    • I2S Audio header
  • Networking
    • 2x RJ-45 Gigabit Ethernet connectors
    • M.2 E-Key socket for Wi-Fi
    • M.2 B-Key socket and microSIM slot for WWAN modem
  •  USB
    • USB 3.0 Type-A port
    • USB 2.0 Type-A port
    • USB OTG micro-AB port
    • USB 3.1 Type-C port
  • Serial
    • 2x CAN ports
    • 2x RS-232/RS-422/RS-485 configurable serial ports (internal pin header)
    • 2x Serial ports (Tx/Rx signals only, TTL level, feature pin header)
  • Expansion
    • PCIe x4 slot
    • M.2 2230 E-Key socket for Wi-Fi Modules (shared with PCIe x4 slot)
    • 2x M.2 B-key 2260/3042 sockets for WWAN Modem Modules (shared with PCIe x4 slot), connected to onboard microSIM slot
    • Pin header with 2x Serial ports, I2C, SMBus, Watchdog, and Power Management Signals
    • GPIO/FuSa pin header
  •  Debugging
    • Optional Debug USB port (micro-B connector)
    • JTAG connector
  •  Misc
    • 4x 7-segment LCDs for POST codes
    • FAN connector
    • Boot selection switches
    • Selector for SMARC 2.0/2.1.1 pinout compatibility
    • RTC with coin-cell battery holder
  • Power Supply
    • 9-24V via Mini-Fit Jr 2×2 power connector or USB Type-C connector
    • 6-17V 2/3/4 cell Smart Battery Connector
  • Dimensions – 243.84 x 243.84 mm (microATX)
  • Temperature Range – -40°C to +85°C (industrial range)

SOM SMARC QCS5430 SoM

In terms of software, the company mentions that the SoM supports Microsoft Windows 11 IoT Enterprise, Yocto (Linux 64-bit), and Android for flexibility. The company also mentions support for EDGEHOG OS for managing remote devices, optimizing data orchestration, and supporting custom applications in Docker containers. It also has support for dual-partition systems and AI-based protection through Exein’s integration. More information is available on the datasheet.

CSM-B79 development board block diagram
CSM-B79 development board block diagram
CSM B79 development board specifications
CSM-B79 development board specifications

The CSM-B79 carrier board is compatible with SMARC 2.0 / 2.1.1 compliant modules and comes with various accessories including adapter cables, SATA power cables, and certified HDMI/DP cables. It offers multiple video interfaces, including LVDS, MIPI-DSI, and DP++, along with support for up to two Gigabit Ethernet ports and various USB and PCIe slots. Additionally, it features audio codecs, serial ports, and mass storage options like microSD and SATA. More information is available in the user manual.

The Qualcomm QCS5430-powered SMARC SoM and development kit are sampling right now, but pricing is not public, so you’d have to contact the company through their products page for a quote. You can also check out the press release for more information.

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