Israeli embedded systems manufacturer, SolidRun, has recently introduced the Bedrock R8000, a new fanless, Industrial PC targeted at edge AI applications. The Bedrock R8000 integrates the newly-announced AMD Ryzen Embedded 8000 series processors with 8 Zen 4 cores and 16 threads clocked at up to 5.1 GHz.
The Ryzen Embedded 8000 Series has a 16 TOPS NPU for AI workloads and offers up to 10 years of guaranteed availability. Also, up to 3 AI accelerators (either Hailo-10 or Hailo 8) can be combined with the onboard NPU to achieve over 100 TOPS for generative or inferencing AI workloads.
Apart from the Ryzen Embedded 8000 series, the Bedrock R8000 series also supports other Accelerated Processing Units (APU) in the “Hawk Point” family. The CPU power limit can be adjusted in the BIOS within a range of 8W to 54W. Memory goes up to 96GB DDR5 ECC/non-ECC and three NVME PCIe Gen4 x4 slots provide storage for the device. Both the RAM and storage are conduction-cooled for optimal operation in extreme temperatures.
SolidRun Bedrock R8000 specifications:
- SoC – AMD Ryzen Embedded 8000 Series | Ryzen 8040 Series 8C/16T Zen4 4nm
- CPU: Ryzen Embedded 8845HS | Ryzen 9 8945HS | Ryzen Embedded 8840U @ up to 5.1 GHz
- GPU: AMD Radeon 780M (Up to 12 Compute Units @ 2700 MHz)
- AI accelerator: 16 TOPS NPU
- TDP: 8W – 54 W
- Memory – Up to 96GB dual channel DDR5-5600 (2x SODIMM (2×32 bit each))
- Storage – Up to 3x NVMe PCIe Gen4 x 4 (M.2 key-M 2280)
- Networking
- Ethernet – 4x 2.5 Gigabit Ethernet
- Wireless – Wi-Fi 6E, Bluetooth 5.3
- Modem – 4G / 5G (Quectel)
- Display
- Up to 4 display outputs (1x HDMI 2.1, 1x DisplayPort 2.1, 2x mini-DisplayPort 2.1)
- Max resolution/refresh rate: 7680 x 4320 @ 60Hz, 3840 x 2160 @ 240Hz
- USB – 4x USB Type-A (1x USB 3.2 Gen 2 10 Gb/s, 3x USB 3.2 Gen 2 5 Gb/s)
- Console – Serial over USB
- Misc
- BIOS – AMI Aptio V on dual SPI flash for redundancy and with console redirection
- Cooling
- Liquid metal TIM (thermal interface material)
- 360º stacked heat pipes
- Dual-layer chimney effect heat exchanger
- Thermal coupling of all internal devices
- Power – 12V – 60V DC via 2-pin Phoenix terminal
- Dimensions
- 30W model: 45 mm (W) x 160 mm (H) x 130 mm (D) – 0.9 liter
- 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter
- Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter
- Enclosure – All-aluminum enclosure, fanless cooling
- Mounting – DIN-rail, wall, VESA, tabletop
- Temperature Range – Up to -40ºC to 85ºC range
- Operating Systems – Windows 10/11/IoT, Linux
SolidRun offers different types of mounting brackets for the product, including DIN-Rail, wall, VESA, and tabletop. Supported operating systems include Windows 10, Windows 11, and Windows IoT, Linux, and other x86 operating systems.
Bedrock R8000 is designed in the same Tile/30W/60W form factors as other Bedrock products and can be configured using the same boards and modules. According to SolidRun’s press release, samples will be available in June 2024 with volume production in the third quarter of 2024. You can find more information about the Bedrock R8000 and request a quote on the product page. The industrial computer was displayed at AMD’s booth at Embedded World 2024.
Tomisin is a writer specializing in hardware product reviews, comparisons, and explainers. He is very passionate about small form factor and single-board computers.
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one more m.w nvme and it will be perfect