Intel Tiger Lake UP3 COM Express Module Offers High AI Performance, PCIe Gen4 Interface

Earlier today, Intel announced the Elkhart Lake IoT edge processor family, and as well as more 15W Tiger Lake Core i3/i5/i7 UP3 processors designed for IoT & embedded applications, and with a configurable TDP from 12W to 28W.

ADLINK Technology is leveraging existing and those new Tiger Lake UP3 processors with the cExpress-TL COM Express Type 6 module based on the various Intel Core i7/i5/i3 and Celeron Tiger Lake UP3 SKUs delivering three times the AI inferencing performance of older platforms thanks to AVX-512 Vector Neural Network Instructions (AVX512 VNNI) instructions and equipped with the latest PCIe Gen4 expansion interface.

cExpress-TL COM Express Tiger Lake module specifications:

SoC (one or the other)
- Intel Core i7-1185G7E quad-core/octa-thread processor with 12MB cache, Intel Iris Xe graphics with 96x EU; up to 28W TDP (cTDP 15W)
- Intel Core i5-1145G7E quad-core/octa-thread processor with 8MB cache, Intel Iris Xe graphics with 80x EU; up to 28W TDP (cTDP 15W)
- Intel Core i3-1115G4E dual-core/quad-thread processor with 6MB, Intel UHD graphics with 48EU; Up to 28W TDP (cTDP 15W)
- Intel Celeron processor with 4MB cache, 15W (Note: if that’s also a Tiger Lake processor then it has not been announced).
System Memory- Up to 64GB via two DDR4 SO-DIMM sockets up to 3200 MT/s IBECC (in-band ECC)/non-ECC
COM Express board-to-board connectors with
- Storage – 2x SATA 6Gb/s
- Video Interfaces – Combination of DisplayPort, HDMI, LVDS, eDP or VGA outputs for up to 4x 4Kp60 independant displays, and 2x 8Kp60 displays
- Audio – Support for ALC886 on carrier board
- Networking – 2.5GbE via Intel i225 series TSN MAC/PHY
- USB – 4x USB 3.2 and 4x USB 2.0
- Serial – 2x UART ports with console redirection
- PCIe
  - 5x PCIe x1 Gen3 (AB): Lanes 0/1/2/3 (configurable to 4 x1, 2 x2, 1 x4, 2 x1 + 1 x2, 1 x2 + 2 x1) and Lane 4 (x1 only)
  - 1x PCIe x4 Gen4 (CD): Lanes 16-19 (only x4) up to 16 GT/s
- Low Speed Interfaces – LPC bus, SMBus (system) , I2C (user)
- GPIO – 4x GPO and 4x GPI
Misc – SEMA Board Controller with Voltage/current monitoring, power sequence debug support, AT/ATX mode control, watchdog timer, etc..
BIOS – 16MB or 32MB flash for AMI UEFI Embedded BIOS (optional failsafe dual-BIOS support)
Debug Header – 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module
HW – Security – InfineonTPM 2.0
Power Supply
- Standard Input – ATX: 12V/ 5V or AT: 12V
- Wide Input – ATX: 8.5-20 V / 5V or AT: 8.5-20V
- ACPI 5.0 compliant, Smart Battery support
DImensions – 95 x 95 mm (PICMG COM.0 Rev 3.0 Type 6)
Temperature Range
- Standard: 0°C to 60°C (Storage: -20°C to 80°C)
- Extreme Rugged: -45°C to +85°C
Humidity – 5-90% RH operating, non-condensing; 5-95% RH storage (and operating with conformal coating)
Shock and Vibration
- IEC 60068-2-64 and IEC-60068-2-27
- MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

The company provides support for Windows 10 IoT Enterprise 64-bit, Yocto Linux 64-bit, and expect VxWorks 64-bit and/or Ubuntu to be available for the module as well. Intel OpenVINO toolkit makes sure of optimal performance leverage the AVX-512 VNNI instructions in the CPU cores, as well as the integrated Intel Iris Xe graphics execution units.

Compared to their non-embedded versions, the new Tiger Lake UP3 processors are clocked at a slightly lower frequency in order to support a wider operating temperature range. This allows ADLINK cExpress-TL COM Express module to be found integrated into applications for transportation, healthcare, industrial automation and control, edge controllers, robotics, and multi-camera-based AI solutions.

Visit the product page or more information about the cExpress-TL COM Express module.

Jean-Luc Aufranc (CNXSoft)

Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.