Introduced in 2018, ZiP (zGlue Integration Platform) chip-stacking technology aims to produce chips similar to Systems-in-Package (SiP) but at much lower costs and lead times. We first found it in a Bluetooth tracker featuring ZGLZ1BA custom chip manufactured with zGlue technology and integrating an Arm Cortex-M0 MCU, flash memory and sensors into a single package. But now the technology is back in the news with Antmicro announcing GEM chiplet-based ASIC last December. At the time of the announced the company’s GEM1 chip featured two Lattice iCE40 FPGAs with a MIPI CSI-2 switch, and they had started working on GEM2 chip combining a hard RISC-V processor and Lattice iCE40 FPGA. Those are so-called demonstrators chip as Antmicro customers will be able to easily and quickly design their own 6×9 mm chip(s) with RISC-V and/or ARM CPUs, FPGAs, sensors, radios and other functional elements to meet the requirements of their specific applications. […]